JP3702842B2 - シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品 - Google Patents

シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品 Download PDF

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Publication number
JP3702842B2
JP3702842B2 JP2001370441A JP2001370441A JP3702842B2 JP 3702842 B2 JP3702842 B2 JP 3702842B2 JP 2001370441 A JP2001370441 A JP 2001370441A JP 2001370441 A JP2001370441 A JP 2001370441A JP 3702842 B2 JP3702842 B2 JP 3702842B2
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JP
Japan
Prior art keywords
atom
component
silica
based film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001370441A
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English (en)
Japanese (ja)
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JP2003171616A5 (enExample
JP2003171616A (ja
Inventor
浩一 阿部
礼子 高安
茂 野部
和宏 榎本
治彰 桜井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2001370441A priority Critical patent/JP3702842B2/ja
Publication of JP2003171616A publication Critical patent/JP2003171616A/ja
Publication of JP2003171616A5 publication Critical patent/JP2003171616A5/ja
Application granted granted Critical
Publication of JP3702842B2 publication Critical patent/JP3702842B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Silicon Compounds (AREA)
  • Paints Or Removers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP2001370441A 2001-12-04 2001-12-04 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品 Expired - Fee Related JP3702842B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001370441A JP3702842B2 (ja) 2001-12-04 2001-12-04 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001370441A JP3702842B2 (ja) 2001-12-04 2001-12-04 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2004260262A Division JP2005042118A (ja) 2004-09-07 2004-09-07 シリカ系被膜形成用組成物、シリカ系被膜の製造方法及び電子部品
JP2004316467A Division JP2005105284A (ja) 2004-10-29 2004-10-29 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品
JP2004316470A Division JP2005072615A (ja) 2004-10-29 2004-10-29 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品

Publications (3)

Publication Number Publication Date
JP2003171616A JP2003171616A (ja) 2003-06-20
JP2003171616A5 JP2003171616A5 (enExample) 2005-07-07
JP3702842B2 true JP3702842B2 (ja) 2005-10-05

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JP2001370441A Expired - Fee Related JP3702842B2 (ja) 2001-12-04 2001-12-04 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品

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JP (1) JP3702842B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004277502A (ja) * 2003-03-13 2004-10-07 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法並びにシリカ系被膜を備える電子部品

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7687590B2 (en) 2002-02-27 2010-03-30 Hitachi Chemical Company, Ltd. Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
KR20040094732A (ko) 2002-02-27 2004-11-10 히다치 가세고교 가부시끼가이샤 실리카계 피막형성용 조성물, 실리카계 피막 및 그제조방법 및 전자부품
US7682701B2 (en) 2002-02-27 2010-03-23 Hitachi Chemical Co., Ltd. Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
JP2005314616A (ja) * 2004-04-30 2005-11-10 Shin Etsu Chem Co Ltd シリコーンコーティング組成物及び被覆物品
TW200605220A (en) * 2004-06-21 2006-02-01 Hitachi Chemical Co Ltd Organic siloxane film, semiconductor device using same, flat panel display and raw material liquid
US20060047034A1 (en) 2004-09-02 2006-03-02 Haruaki Sakurai Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film
JP4756128B2 (ja) * 2004-10-20 2011-08-24 日揮触媒化成株式会社 半導体加工用保護膜形成用塗布液、その調製方法およびこれより得られる半導体加工用保護膜
JP2006213908A (ja) * 2004-12-21 2006-08-17 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜の形成方法、シリカ系被膜、及び、電子部品
US20080260956A1 (en) * 2004-12-21 2008-10-23 Haruaki Sakurai Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part
JP2007254678A (ja) * 2006-03-24 2007-10-04 Tokyo Ohka Kogyo Co Ltd シリカ系被膜形成用組成物およびシリカ系被膜

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004277502A (ja) * 2003-03-13 2004-10-07 Hitachi Chem Co Ltd シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法並びにシリカ系被膜を備える電子部品

Also Published As

Publication number Publication date
JP2003171616A (ja) 2003-06-20

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