JP3647448B2 - 半導体装置及び半導体装置の製造方法 - Google Patents

半導体装置及び半導体装置の製造方法 Download PDF

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Publication number
JP3647448B2
JP3647448B2 JP2004168845A JP2004168845A JP3647448B2 JP 3647448 B2 JP3647448 B2 JP 3647448B2 JP 2004168845 A JP2004168845 A JP 2004168845A JP 2004168845 A JP2004168845 A JP 2004168845A JP 3647448 B2 JP3647448 B2 JP 3647448B2
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Japan
Prior art keywords
die pad
semiconductor element
semiconductor device
resin
view
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Expired - Fee Related
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JP2004168845A
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English (en)
Japanese (ja)
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JP2004260216A5 (https=
JP2004260216A (ja
Inventor
秀一 尾方
健一 伊東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2004168845A priority Critical patent/JP3647448B2/ja
Publication of JP2004260216A publication Critical patent/JP2004260216A/ja
Application granted granted Critical
Publication of JP3647448B2 publication Critical patent/JP3647448B2/ja
Publication of JP2004260216A5 publication Critical patent/JP2004260216A5/ja
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Lead Frames For Integrated Circuits (AREA)
JP2004168845A 2004-06-07 2004-06-07 半導体装置及び半導体装置の製造方法 Expired - Fee Related JP3647448B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004168845A JP3647448B2 (ja) 2004-06-07 2004-06-07 半導体装置及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004168845A JP3647448B2 (ja) 2004-06-07 2004-06-07 半導体装置及び半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP35644699A Division JP3602997B2 (ja) 1999-12-15 1999-12-15 半導体装置及び半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005004182A Division JP4418373B2 (ja) 2005-01-11 2005-01-11 半導体装置

Publications (3)

Publication Number Publication Date
JP2004260216A JP2004260216A (ja) 2004-09-16
JP3647448B2 true JP3647448B2 (ja) 2005-05-11
JP2004260216A5 JP2004260216A5 (https=) 2005-06-02

Family

ID=33128737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004168845A Expired - Fee Related JP3647448B2 (ja) 2004-06-07 2004-06-07 半導体装置及び半導体装置の製造方法

Country Status (1)

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JP (1) JP3647448B2 (https=)

Also Published As

Publication number Publication date
JP2004260216A (ja) 2004-09-16

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