JP3641193B2 - 縦型熱処理装置及び熱処理方法並びに保温ユニット - Google Patents
縦型熱処理装置及び熱処理方法並びに保温ユニット Download PDFInfo
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- JP3641193B2 JP3641193B2 JP2000199992A JP2000199992A JP3641193B2 JP 3641193 B2 JP3641193 B2 JP 3641193B2 JP 2000199992 A JP2000199992 A JP 2000199992A JP 2000199992 A JP2000199992 A JP 2000199992A JP 3641193 B2 JP3641193 B2 JP 3641193B2
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- unit
- heating element
- heat
- temperature
- heat treatment
- Prior art date
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- 238000010438 heat treatment Methods 0.000 title claims description 121
- 238000009413 insulation Methods 0.000 title claims description 12
- 238000000034 method Methods 0.000 title description 6
- 238000006243 chemical reaction Methods 0.000 claims description 52
- 238000001514 detection method Methods 0.000 claims description 44
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 43
- 239000010453 quartz Substances 0.000 claims description 42
- 230000001681 protective effect Effects 0.000 claims description 27
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000003575 carbonaceous material Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 67
- 239000007789 gas Substances 0.000 description 20
- 239000010408 film Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000012494 Quartz wool Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XMIJDTGORVPYLW-UHFFFAOYSA-N [SiH2] Chemical compound [SiH2] XMIJDTGORVPYLW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229960001730 nitrous oxide Drugs 0.000 description 1
- 235000013842 nitrous oxide Nutrition 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000199992A JP3641193B2 (ja) | 2000-06-30 | 2000-06-30 | 縦型熱処理装置及び熱処理方法並びに保温ユニット |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000199992A JP3641193B2 (ja) | 2000-06-30 | 2000-06-30 | 縦型熱処理装置及び熱処理方法並びに保温ユニット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002025994A JP2002025994A (ja) | 2002-01-25 |
| JP2002025994A5 JP2002025994A5 (enrdf_load_stackoverflow) | 2004-12-16 |
| JP3641193B2 true JP3641193B2 (ja) | 2005-04-20 |
Family
ID=18697932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000199992A Expired - Fee Related JP3641193B2 (ja) | 2000-06-30 | 2000-06-30 | 縦型熱処理装置及び熱処理方法並びに保温ユニット |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3641193B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7203588B2 (ja) * | 2018-12-17 | 2023-01-13 | 東京エレクトロン株式会社 | 熱処理装置 |
| CN114127897B (zh) * | 2019-06-27 | 2025-08-12 | 株式会社国际电气 | 隔热结构体、基板处理装置、半导体装置的制造方法、基板处理方法以及存储介质 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH084000Y2 (ja) * | 1991-03-28 | 1996-01-31 | 信越化学工業株式会社 | 複層セラミックスヒ−タ− |
| JP3449630B2 (ja) * | 1993-07-15 | 2003-09-22 | 株式会社日立国際電気 | 半導体製造装置 |
| JP3423131B2 (ja) * | 1995-11-20 | 2003-07-07 | 東京エレクトロン株式会社 | 熱処理装置及び処理装置 |
| JPH10208855A (ja) * | 1997-01-23 | 1998-08-07 | Toshiba Ceramics Co Ltd | 面状ヒータ |
-
2000
- 2000-06-30 JP JP2000199992A patent/JP3641193B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002025994A (ja) | 2002-01-25 |
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