JP3630398B2 - 電子部品実装用フィルムキャリアテープの製造方法 - Google Patents

電子部品実装用フィルムキャリアテープの製造方法 Download PDF

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Publication number
JP3630398B2
JP3630398B2 JP35348899A JP35348899A JP3630398B2 JP 3630398 B2 JP3630398 B2 JP 3630398B2 JP 35348899 A JP35348899 A JP 35348899A JP 35348899 A JP35348899 A JP 35348899A JP 3630398 B2 JP3630398 B2 JP 3630398B2
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Japan
Prior art keywords
plating
tin plating
tin
layer
solder resist
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Expired - Fee Related
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JP35348899A
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Japanese (ja)
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JP2001168147A (ja
JP2001168147A5 (enExample
Inventor
口 裕 井
田 一 雄 生
村 浩 文 河
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Mitsui Kinzoku Co Ltd
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Mitsui Mining and Smelting Co Ltd
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Priority to JP35348899A priority Critical patent/JP3630398B2/ja
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Publication of JP2001168147A5 publication Critical patent/JP2001168147A5/ja
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JP35348899A 1999-12-13 1999-12-13 電子部品実装用フィルムキャリアテープの製造方法 Expired - Fee Related JP3630398B2 (ja)

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JP35348899A JP3630398B2 (ja) 1999-12-13 1999-12-13 電子部品実装用フィルムキャリアテープの製造方法

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JP35348899A JP3630398B2 (ja) 1999-12-13 1999-12-13 電子部品実装用フィルムキャリアテープの製造方法

Related Child Applications (1)

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JP2004217820A Division JP2004297102A (ja) 2004-07-26 2004-07-26 電子部品実装用フィルムキャリアテープの製造方法

Publications (3)

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JP2001168147A JP2001168147A (ja) 2001-06-22
JP2001168147A5 JP2001168147A5 (enExample) 2004-07-08
JP3630398B2 true JP3630398B2 (ja) 2005-03-16

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JP35348899A Expired - Fee Related JP3630398B2 (ja) 1999-12-13 1999-12-13 電子部品実装用フィルムキャリアテープの製造方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003069967A1 (en) * 2002-02-13 2003-08-21 Shindo Company, Ltd. Circuit substrate production method
JP2004297102A (ja) * 2004-07-26 2004-10-21 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープの製造方法
JP2019075503A (ja) 2017-10-18 2019-05-16 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
WO2020230504A1 (ja) * 2019-05-10 2020-11-19 昭和電工株式会社 フレキシブル配線回路基板の製造方法

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JP2001168147A (ja) 2001-06-22

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