JP3330925B2 - レーザー穴開け用銅箔 - Google Patents

レーザー穴開け用銅箔

Info

Publication number
JP3330925B2
JP3330925B2 JP2000103505A JP2000103505A JP3330925B2 JP 3330925 B2 JP3330925 B2 JP 3330925B2 JP 2000103505 A JP2000103505 A JP 2000103505A JP 2000103505 A JP2000103505 A JP 2000103505A JP 3330925 B2 JP3330925 B2 JP 3330925B2
Authority
JP
Japan
Prior art keywords
copper foil
plating
laser
copper
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000103505A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001288595A (ja
Inventor
勝 坂本
皓嗣 北野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18617204&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3330925(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Priority to JP2000103505A priority Critical patent/JP3330925B2/ja
Priority to TW090107469A priority patent/TWI238027B/zh
Priority to KR10-2002-7012574A priority patent/KR100495481B1/ko
Priority to PCT/JP2001/002706 priority patent/WO2001077420A1/ja
Priority to CN01802679A priority patent/CN1388841A/zh
Priority to EP01917661A priority patent/EP1273682A4/en
Priority to US10/089,581 priority patent/US20020182432A1/en
Priority claimed from PCT/JP2001/002706 external-priority patent/WO2001077420A1/ja
Priority to MYPI20011627A priority patent/MY122999A/en
Publication of JP2001288595A publication Critical patent/JP2001288595A/ja
Publication of JP3330925B2 publication Critical patent/JP3330925B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
JP2000103505A 2000-04-05 2000-04-05 レーザー穴開け用銅箔 Expired - Lifetime JP3330925B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000103505A JP3330925B2 (ja) 2000-04-05 2000-04-05 レーザー穴開け用銅箔
TW090107469A TWI238027B (en) 2000-04-05 2001-03-29 Copper foil for laser drilling
US10/089,581 US20020182432A1 (en) 2000-04-05 2001-03-30 Laser hole drilling copper foil
PCT/JP2001/002706 WO2001077420A1 (fr) 2000-04-05 2001-03-30 Forage de trou par laser dans une tôle de cuivre
CN01802679A CN1388841A (zh) 2000-04-05 2001-03-30 激光开孔用铜箔
EP01917661A EP1273682A4 (en) 2000-04-05 2001-03-30 HOLE DRILLING BY LASER IN A COPPER T
KR10-2002-7012574A KR100495481B1 (ko) 2000-04-05 2001-03-30 레이저 개공용 동박
MYPI20011627A MY122999A (en) 2000-04-05 2001-04-05 Copper foil for use in laser beam drilling

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000103505A JP3330925B2 (ja) 2000-04-05 2000-04-05 レーザー穴開け用銅箔
PCT/JP2001/002706 WO2001077420A1 (fr) 2000-04-05 2001-03-30 Forage de trou par laser dans une tôle de cuivre

Publications (2)

Publication Number Publication Date
JP2001288595A JP2001288595A (ja) 2001-10-19
JP3330925B2 true JP3330925B2 (ja) 2002-10-07

Family

ID=18617204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000103505A Expired - Lifetime JP3330925B2 (ja) 2000-04-05 2000-04-05 レーザー穴開け用銅箔

Country Status (4)

Country Link
JP (1) JP3330925B2 (ko)
KR (1) KR100495481B1 (ko)
MY (1) MY122999A (ko)
TW (1) TWI238027B (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3869352B2 (ja) * 2002-11-12 2007-01-17 日鉱金属株式会社 金属箔の熱量測定方法、表面特性の調整方法、レーザー穴開け方法又は熱量測定装置
US7476449B2 (en) 2003-02-27 2009-01-13 Furukawa Circuit Foil Co., Ltd. Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
JP4458519B2 (ja) * 2003-07-28 2010-04-28 三井金属鉱業株式会社 黒色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ
JP4458521B2 (ja) * 2004-03-02 2010-04-28 三井金属鉱業株式会社 灰色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ
KR100654737B1 (ko) * 2004-07-16 2006-12-08 일진소재산업주식회사 미세회로기판용 표면처리동박의 제조방법 및 그 동박
JP2006210689A (ja) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
US7886437B2 (en) 2007-05-25 2011-02-15 Electro Scientific Industries, Inc. Process for forming an isolated electrically conductive contact through a metal package
KR101289803B1 (ko) 2008-05-16 2013-07-26 삼성테크윈 주식회사 회로 기판 및 그 제조 방법
JP2009235580A (ja) * 2009-07-22 2009-10-15 Furukawa Electric Co Ltd:The レーザー穴開け用銅箔
CN104160068B (zh) 2012-03-01 2017-05-24 三井金属矿业株式会社 带有载体箔的铜箔、带有载体箔的铜箔的制造方法、及用该带有载体箔的铜箔得到的激光打孔加工用覆铜层压板
US9338898B2 (en) 2012-03-09 2016-05-10 Mitsui Mining & Smelting Co., Ltd. Method of producing a printed wiring board
KR101400778B1 (ko) * 2012-10-05 2014-06-02 일진머티리얼즈 주식회사 레이저 가공용 동박, 이를 채용한 동부착적층판 및 상기 동박의 제조방법
CN103972513B (zh) * 2013-02-06 2016-08-17 永箔科技股份有限公司 多孔性集流体金属材料连续加工法
KR102356407B1 (ko) * 2013-03-05 2022-01-28 미쓰이금속광업주식회사 레이저 가공용 구리 박, 캐리어 박 구비 레이저 가공용 구리 박, 구리클래드 적층체 및 프린트 배선판의 제조 방법
CN109788658B (zh) * 2017-11-15 2021-10-19 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法

Also Published As

Publication number Publication date
KR20020084243A (ko) 2002-11-04
KR100495481B1 (ko) 2005-06-14
TWI238027B (en) 2005-08-11
MY122999A (en) 2006-05-31
JP2001288595A (ja) 2001-10-19

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