JP3254901B2 - はんだ合金 - Google Patents
はんだ合金Info
- Publication number
- JP3254901B2 JP3254901B2 JP11608594A JP11608594A JP3254901B2 JP 3254901 B2 JP3254901 B2 JP 3254901B2 JP 11608594 A JP11608594 A JP 11608594A JP 11608594 A JP11608594 A JP 11608594A JP 3254901 B2 JP3254901 B2 JP 3254901B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- alloy
- weight
- solder alloy
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 90
- 229910045601 alloy Inorganic materials 0.000 title claims description 50
- 239000000956 alloy Substances 0.000 title claims description 50
- 238000005476 soldering Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 229910020816 Sn Pb Inorganic materials 0.000 description 10
- 229910020922 Sn-Pb Inorganic materials 0.000 description 10
- 229910008783 Sn—Pb Inorganic materials 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 229910000765 intermetallic Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000035882 stress Effects 0.000 description 7
- 230000008646 thermal stress Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000010409 ironing Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017850 Sb—Ni Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000000376 effect on fatigue Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11608594A JP3254901B2 (ja) | 1994-05-06 | 1994-05-06 | はんだ合金 |
| TW83106794A TW323304B (enrdf_load_stackoverflow) | 1994-05-06 | 1994-07-26 | |
| MYPI9403119 MY116826A (en) | 1994-05-06 | 1994-11-23 | Solder alloy. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11608594A JP3254901B2 (ja) | 1994-05-06 | 1994-05-06 | はんだ合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07299585A JPH07299585A (ja) | 1995-11-14 |
| JP3254901B2 true JP3254901B2 (ja) | 2002-02-12 |
Family
ID=14678345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11608594A Expired - Lifetime JP3254901B2 (ja) | 1994-05-06 | 1994-05-06 | はんだ合金 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3254901B2 (enrdf_load_stackoverflow) |
| MY (1) | MY116826A (enrdf_load_stackoverflow) |
| TW (1) | TW323304B (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6033488A (en) * | 1996-11-05 | 2000-03-07 | Samsung Electronics Co., Ltd. | Solder alloy |
| JP3752064B2 (ja) * | 1997-05-23 | 2006-03-08 | 内橋エステック株式会社 | 半田材料及びそれを用いた電子部品 |
| CN101279406B (zh) | 2008-05-27 | 2011-04-13 | 重庆理工大学 | 一种抑制铅挥发污染环境的含铅钎料 |
| CN108788511A (zh) * | 2018-06-25 | 2018-11-13 | 深圳市博士达焊锡制品有限公司 | 一种具有高抗氧化能力的有铅焊料及其制备方法 |
-
1994
- 1994-05-06 JP JP11608594A patent/JP3254901B2/ja not_active Expired - Lifetime
- 1994-07-26 TW TW83106794A patent/TW323304B/zh not_active IP Right Cessation
- 1994-11-23 MY MYPI9403119 patent/MY116826A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW323304B (enrdf_load_stackoverflow) | 1997-12-21 |
| MY116826A (en) | 2004-04-30 |
| JPH07299585A (ja) | 1995-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3220635B2 (ja) | はんだ合金及びクリームはんだ | |
| JP3152945B2 (ja) | 無鉛はんだ合金 | |
| WO1997012719A1 (en) | Lead-free solder | |
| JP5115915B2 (ja) | 鉛フリーはんだ、そのはんだ加工物、ソルダーペースト及び電子部品はんだ付け基板 | |
| JPWO2004089573A1 (ja) | ソルダペーストおよびプリント基板 | |
| JP2004298931A (ja) | 高温鉛フリーはんだ合金および電子部品 | |
| JP3643008B2 (ja) | はんだ付け方法 | |
| JP3878978B2 (ja) | 鉛非含有はんだ、および鉛非含有の継手 | |
| JP4337326B2 (ja) | 鉛フリーはんだおよびはんだ付け物品 | |
| JP4453473B2 (ja) | 鉛フリーはんだ合金と、それを用いたはんだ材料及びはんだ接合部 | |
| JP3254901B2 (ja) | はんだ合金 | |
| JP2005021958A (ja) | 鉛フリーソルダペースト | |
| JP2008221330A (ja) | はんだ合金 | |
| JP5051633B2 (ja) | はんだ合金 | |
| KR100904656B1 (ko) | 웨이브 및 디핑용 무연 솔더 조성물과 이를 이용한 전자기기 및 인쇄회로기판 | |
| JP2000015479A (ja) | はんだ合金及び電子部品の実装方法 | |
| JP3597607B2 (ja) | はんだ合金及びペ−スト状はんだ | |
| JP4359983B2 (ja) | 電子部品の実装構造体およびその製造方法 | |
| JP3254857B2 (ja) | はんだ合金 | |
| KR100904652B1 (ko) | 웨이브 및 디핑용 무연 솔더 조성물과 이를 이용한 전자기기 및 인쇄회로기판 | |
| JP2910527B2 (ja) | 高温はんだ | |
| KR20070082061A (ko) | 무연 솔더 조성물과 이를 이용한 전자기기 및 인쇄회로기판 | |
| JP3708252B2 (ja) | 電子部品リフロー実装用はんだ合金粉末 | |
| KR100443230B1 (ko) | 납땜용 무연합금 | |
| JPH0332487A (ja) | はんだ材 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20011030 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081130 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091130 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101130 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101130 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111130 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111130 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111130 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121130 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121130 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131130 Year of fee payment: 12 |
|
| EXPY | Cancellation because of completion of term |