JP3253439B2 - 液晶表示素子の製造方法 - Google Patents
液晶表示素子の製造方法Info
- Publication number
- JP3253439B2 JP3253439B2 JP32642893A JP32642893A JP3253439B2 JP 3253439 B2 JP3253439 B2 JP 3253439B2 JP 32642893 A JP32642893 A JP 32642893A JP 32642893 A JP32642893 A JP 32642893A JP 3253439 B2 JP3253439 B2 JP 3253439B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- microlens
- substrate
- cover glass
- crystal display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133526—Lenses, e.g. microlenses or Fresnel lenses
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32642893A JP3253439B2 (ja) | 1993-12-24 | 1993-12-24 | 液晶表示素子の製造方法 |
US08/362,138 US5505804A (en) | 1993-12-24 | 1994-12-22 | Method of producing a condenser lens substrate |
EP94309719A EP0659521B1 (fr) | 1993-12-24 | 1994-12-22 | Méthode de fabrication d'un substrat d'une lentille à collimation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32642893A JP3253439B2 (ja) | 1993-12-24 | 1993-12-24 | 液晶表示素子の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000119258A Division JP2000329907A (ja) | 2000-01-01 | 2000-04-20 | マイクロレンズ基板の製造方法及び液晶表示素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07181305A JPH07181305A (ja) | 1995-07-21 |
JP3253439B2 true JP3253439B2 (ja) | 2002-02-04 |
Family
ID=18187691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32642893A Expired - Fee Related JP3253439B2 (ja) | 1993-12-24 | 1993-12-24 | 液晶表示素子の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5505804A (fr) |
EP (1) | EP0659521B1 (fr) |
JP (1) | JP3253439B2 (fr) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0171092B1 (ko) * | 1995-07-06 | 1999-05-01 | 구자홍 | 기판 제조방법 |
US6197209B1 (en) | 1995-10-27 | 2001-03-06 | Lg. Philips Lcd Co., Ltd. | Method of fabricating a substrate |
DE19610881B4 (de) * | 1995-12-07 | 2008-01-10 | Limo Patentverwaltung Gmbh & Co. Kg | Mikrosystembaustein |
US6211916B1 (en) * | 1996-03-11 | 2001-04-03 | Eastman Kodak Company | Solid state imager with inorganic lens array |
KR0180850B1 (ko) * | 1996-06-26 | 1999-03-20 | 구자홍 | 유리기판 에칭장치 |
KR100265556B1 (ko) | 1997-03-21 | 2000-11-01 | 구본준 | 식각장치 |
US6137555A (en) * | 1997-03-26 | 2000-10-24 | Matsushita Electronics Corporation | Liquid crystal panel with uniform adhesive layer and method of manufacturing |
US5949740A (en) * | 1997-06-06 | 1999-09-07 | Litton Systems, Inc. | Unbalanced fiber optic Michelson interferometer as an optical pick-off |
JP4049854B2 (ja) * | 1997-09-18 | 2008-02-20 | リコー光学株式会社 | 液晶プロジェクタ用の液晶デバイスおよび液晶デバイス用の対向基板 |
US6327011B2 (en) | 1997-10-20 | 2001-12-04 | Lg Electronics, Inc. | Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same |
JP3228896B2 (ja) * | 1997-10-24 | 2001-11-12 | キヤノン株式会社 | 反射型lcdパネルユニット及びこれを用いた液晶プロジェクター |
JPH11211902A (ja) | 1998-01-21 | 1999-08-06 | Micro Opt:Kk | 平板型マイクロレンズアレイ |
KR100272513B1 (ko) | 1998-09-08 | 2001-01-15 | 구본준 | 유리기판의 식각장치 |
KR100308157B1 (ko) | 1998-10-22 | 2001-11-15 | 구본준, 론 위라하디락사 | 액정표시소자용 유리기판 |
JP2008097032A (ja) * | 2000-10-04 | 2008-04-24 | Sharp Corp | マイクロレンズアレイ、液晶表示素子および投影型液晶表示装置 |
US7386205B2 (en) * | 2002-06-17 | 2008-06-10 | Jian Wang | Optical device and method for making same |
US20040047039A1 (en) * | 2002-06-17 | 2004-03-11 | Jian Wang | Wide angle optical device and method for making same |
JP3698144B2 (ja) * | 2003-02-07 | 2005-09-21 | ヤマハ株式会社 | マイクロレンズアレイの製法 |
US6934065B2 (en) * | 2003-09-18 | 2005-08-23 | Micron Technology, Inc. | Microelectronic devices and methods for packaging microelectronic devices |
US7583862B2 (en) * | 2003-11-26 | 2009-09-01 | Aptina Imaging Corporation | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7253397B2 (en) * | 2004-02-23 | 2007-08-07 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7253957B2 (en) * | 2004-05-13 | 2007-08-07 | Micron Technology, Inc. | Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers |
US8092734B2 (en) * | 2004-05-13 | 2012-01-10 | Aptina Imaging Corporation | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers |
US20050275750A1 (en) * | 2004-06-09 | 2005-12-15 | Salman Akram | Wafer-level packaged microelectronic imagers and processes for wafer-level packaging |
US7498647B2 (en) | 2004-06-10 | 2009-03-03 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7262405B2 (en) * | 2004-06-14 | 2007-08-28 | Micron Technology, Inc. | Prefabricated housings for microelectronic imagers |
US7199439B2 (en) * | 2004-06-14 | 2007-04-03 | Micron Technology, Inc. | Microelectronic imagers and methods of packaging microelectronic imagers |
US7232754B2 (en) * | 2004-06-29 | 2007-06-19 | Micron Technology, Inc. | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US7294897B2 (en) * | 2004-06-29 | 2007-11-13 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7416913B2 (en) * | 2004-07-16 | 2008-08-26 | Micron Technology, Inc. | Methods of manufacturing microelectronic imaging units with discrete standoffs |
US7189954B2 (en) * | 2004-07-19 | 2007-03-13 | Micron Technology, Inc. | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US7402453B2 (en) * | 2004-07-28 | 2008-07-22 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060023107A1 (en) * | 2004-08-02 | 2006-02-02 | Bolken Todd O | Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers |
US7364934B2 (en) | 2004-08-10 | 2008-04-29 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7223626B2 (en) * | 2004-08-19 | 2007-05-29 | Micron Technology, Inc. | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
US7397066B2 (en) * | 2004-08-19 | 2008-07-08 | Micron Technology, Inc. | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
US7425499B2 (en) | 2004-08-24 | 2008-09-16 | Micron Technology, Inc. | Methods for forming interconnects in vias and microelectronic workpieces including such interconnects |
US7429494B2 (en) * | 2004-08-24 | 2008-09-30 | Micron Technology, Inc. | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers |
US7115961B2 (en) * | 2004-08-24 | 2006-10-03 | Micron Technology, Inc. | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices |
US7276393B2 (en) * | 2004-08-26 | 2007-10-02 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7511262B2 (en) * | 2004-08-30 | 2009-03-31 | Micron Technology, Inc. | Optical device and assembly for use with imaging dies, and wafer-label imager assembly |
US20070148807A1 (en) * | 2005-08-22 | 2007-06-28 | Salman Akram | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US7646075B2 (en) * | 2004-08-31 | 2010-01-12 | Micron Technology, Inc. | Microelectronic imagers having front side contacts |
US7300857B2 (en) | 2004-09-02 | 2007-11-27 | Micron Technology, Inc. | Through-wafer interconnects for photoimager and memory wafers |
KR100577430B1 (ko) | 2004-09-03 | 2006-05-08 | 삼성전자주식회사 | 디스플레이 장치 |
KR101112548B1 (ko) * | 2004-12-10 | 2012-02-15 | 삼성전자주식회사 | 3차원 표시 장치용 마이크로 렌즈 기판, 3차원 표시 장치및 그 제조 방법 |
US7271482B2 (en) * | 2004-12-30 | 2007-09-18 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
US7214919B2 (en) * | 2005-02-08 | 2007-05-08 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20060177999A1 (en) * | 2005-02-10 | 2006-08-10 | Micron Technology, Inc. | Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces |
US7303931B2 (en) * | 2005-02-10 | 2007-12-04 | Micron Technology, Inc. | Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces |
US7190039B2 (en) * | 2005-02-18 | 2007-03-13 | Micron Technology, Inc. | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
US7795134B2 (en) | 2005-06-28 | 2010-09-14 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
US20060290001A1 (en) * | 2005-06-28 | 2006-12-28 | Micron Technology, Inc. | Interconnect vias and associated methods of formation |
US7622377B2 (en) | 2005-09-01 | 2009-11-24 | Micron Technology, Inc. | Microfeature workpiece substrates having through-substrate vias, and associated methods of formation |
US7288757B2 (en) * | 2005-09-01 | 2007-10-30 | Micron Technology, Inc. | Microelectronic imaging devices and associated methods for attaching transmissive elements |
US7262134B2 (en) * | 2005-09-01 | 2007-08-28 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
JP4648422B2 (ja) * | 2008-04-25 | 2011-03-09 | 東芝モバイルディスプレイ株式会社 | 表示素子の製造方法 |
US20100194465A1 (en) * | 2009-02-02 | 2010-08-05 | Ali Salih | Temperature compensated current source and method therefor |
KR101233349B1 (ko) * | 2010-07-07 | 2013-02-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 제조 방법 |
JP5816107B2 (ja) * | 2012-01-31 | 2015-11-18 | リコー光学株式会社 | マイクロレンズアレイ素子 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4924356A (en) * | 1988-12-07 | 1990-05-08 | General Electric Company | Illumination system for a display device |
US5225935A (en) * | 1989-10-30 | 1993-07-06 | Sharp Kabushiki Kaisha | Optical device having a microlens and a process for making microlenses |
JPH03233417A (ja) * | 1989-10-30 | 1991-10-17 | Sharp Corp | 光学装置 |
JPH03231701A (ja) * | 1990-02-07 | 1991-10-15 | Nippon Sheet Glass Co Ltd | 平板レンズ |
JPH03248125A (ja) * | 1990-02-26 | 1991-11-06 | Sharp Corp | 液晶表示素子 |
EP0450780A3 (en) * | 1990-04-05 | 1992-04-15 | Matsushita Electric Industrial Co., Ltd. | Optical microelement array and its production method |
JPH0588161A (ja) * | 1991-09-26 | 1993-04-09 | Canon Inc | 液晶表示素子 |
JPH05249453A (ja) * | 1992-03-06 | 1993-09-28 | Toray Ind Inc | 液晶表示素子 |
JPH05273512A (ja) * | 1992-03-27 | 1993-10-22 | Matsushita Electric Ind Co Ltd | 液晶パネルおよびその製造方法と液晶投写型テレビジョン |
JP3071947B2 (ja) * | 1992-06-12 | 2000-07-31 | シャープ株式会社 | 投影型カラー画像表示装置 |
-
1993
- 1993-12-24 JP JP32642893A patent/JP3253439B2/ja not_active Expired - Fee Related
-
1994
- 1994-12-22 US US08/362,138 patent/US5505804A/en not_active Expired - Fee Related
- 1994-12-22 EP EP94309719A patent/EP0659521B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0659521B1 (fr) | 1999-10-06 |
US5505804A (en) | 1996-04-09 |
EP0659521A2 (fr) | 1995-06-28 |
JPH07181305A (ja) | 1995-07-21 |
EP0659521A3 (fr) | 1996-01-10 |
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