JP3234042B2 - Semiconductor device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which an electrode on a semiconductor chip is electrically connected to an inner lead of a TCP tape, and a method of manufacturing the same. The present invention relates to a semiconductor device and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, electrodes on a semiconductor chip and TCP
As a technique for plating and connecting an inner lead (lead terminal) of a (Tape Carrier Package) tape, a technique using a positioning jig or the like has already been proposed (for example, Japanese Patent Application No. 3-314831).
issue).

For example, as shown in FIG. 6, a semiconductor chip 100 is placed on a positioning jig 101 such as a tray, a TCP tape 102 is placed thereon, and a pressing jig 103 is further placed thereon. Then, after fixing the two, they are put into a metal plating atmosphere to join each electrode of the semiconductor chip and each of the inner leads by metal plating.

[0004] However, the above method has a disadvantage that productivity is poor because a step of removing the jig after the plating process and a washing and drying process for reusing the jig are required. Also, when removing the jig, the surface tension of the plating solution is applied as stress to the joint, so that
There is a disadvantage that the reliability is reduced.

[0005]

As described above, conventionally, the plating connection between the electrode on the semiconductor chip and the inner lead of the TCP tape is performed by using a positioning jig or the like. There have been problems such as low productivity and easy deterioration of reliability.

Accordingly, an object of the present invention is to provide a semiconductor device capable of performing plating bonding without using a positioning jig or the like and improving productivity and reliability, and a method of manufacturing the same. I have.

[0007]

In order to achieve the above object, in a semiconductor device according to the present invention, there is provided a semiconductor chip having electrodes, and lead terminals provided corresponding to the electrodes of the semiconductor chip. And a metal for fixing the electrodes of the semiconductor chip to the lead terminals.
And an adhesive tape for positioning, and a joining portion formed by electrically joining the electrodes of the semiconductor chip and the lead terminals by metal plating while being fixed by the adhesive tape.

Further, in the semiconductor device manufacturing method of the present invention, a semiconductor chip having electrodes is fixed by an adhesive tape, positions the TCP tape lead terminals are formed on the semiconductor chip, the TCP tape Lee
Then , the semiconductor chip electrodes and the lead terminals of the TCP tape are fixed by metal plating by fixing the lead terminals and the electrodes of the semiconductor chip in a state where they are aligned with the adhesive tape, and then putting the semiconductor chip in a metal plating atmosphere. It is configured to be joined.

[0009]

According to the present invention, the fixing of the semiconductor chip and the TCP tape can be simplified by the above-mentioned means, so that it is possible to eliminate various inconveniences concerning the mounting and dismounting of the jig. is there.

[0010]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 schematically shows a cross-sectional structure of a semiconductor device according to the present invention. That is, in this semiconductor device, for example, the semiconductor chip 10 is bonded and fixed to the position fixing tape 20 by the adhesive 21.
By this position fixing tape 20, TCP (Tape)
(Carrier Package) tape 30.

A state in which a plurality of electrode pads (not shown) provided on the surface of the semiconductor chip 10 and a plurality of inner leads (lead terminals) 31 provided on the TCP tape 30 are individually contacted. By being put into a plating atmosphere, the contact portions of the two are electrically connected by metal plating.

Next, a method of manufacturing the above-described semiconductor device will be described. FIG. 2 shows an outline of a semiconductor device manufacturing process (plating pretreatment). For example, the semiconductor chip 10 is bonded by the position fixing tape 20 (FIG. 1A).

In a state where the semiconductor chip 10 is fixed by the position fixing tape 20 (FIG. 4B), the semiconductor chip 10 is aligned with the TCP tape 30 and then the TCP tape 30 is fixed by the position fixing tape 20. Are adhered from the back side and fixed to each other (FIG. 3 (c)).

The semiconductor device positioned and fixed in this manner is sent to the next plating step, and the electrode pads on the semiconductor chip 10 and the TCP tape 3 are kept as they are.
The plating connection with the 0 inner lead 31 is performed.

In this case, the position fixing tape 20 is
For example, a polyimide-based material is die-cut into a substantially cross shape, and an adhesive is applied in advance to the entire bonding surface or only the bonding portion (partially).

The reason why the position fixing tape 20 is formed in a substantially cross shape is to take the movement of the plating solution during the plating process into consideration so that the plating solution is easily removed. In this embodiment, the position fixing tape 20 is press-molded, as shown in FIG. 1, so that the semiconductor chip 10 is appropriately pressed, that is, the electrode pads on the semiconductor chip 10 and the inner leads 31 of the TCP tape 30 are pressed. To ensure that contact is made.

The material of the position fixing tape 20 is not limited to a polyimide-based material, but a metal such as copper (Cu) can be used. When Cu is used, the heat dissipation is improved. be able to.

On the other hand, the TCP tape 30 is, for example, shown in FIG.
As shown in FIG. 7, after a conductor layer such as copper is laminated (attached using an adhesive) to an insulating organic film base material 30a such as a polyimide film, the inner leads 31 and the inner leads 31 are selectively etched. A plurality of lead electrodes 30b including an outer lead connected to the lead electrode 31 are formed.

An opening 30c into which the semiconductor chip 10 is inserted is formed at the center thereof.
A plurality of tape feed holes 30d are formed in both side surfaces of the tape 30.

When the electrode pads on the semiconductor chip 10 are positioned and fixed by the position fixing tape 20 so as to be located at the tips of the inner leads 31 of the lead electrodes 30b provided on the TCP tape 30. After that, it is immersed in a plating bath together with the plating electrode.

Then, each lead electrode 3 on the TCP tape
0b, a predetermined DC voltage is applied between the common electrode 30e such that the common electrode 30e has a negative polarity and the plating electrode has a positive polarity,
By performing the electroplating for a predetermined time, the formation of the bonding portion by metal plating (plating connection between the electrode pad and the inner lead 31) is performed.

For example, when the applied DC voltage is several volts,
By applying a current of 10 mA between them and a plating time of about 5 min (per piece), an appropriate joint can be formed.

After the plating is completed, the plating solution is washed with pure water to remove a plating solution adhered during plating. in this way,
In the step of plating connection between the electrode pads of the semiconductor chip and the tip ends of the leads of the TCP tape, the positioning and fixing performed by using a jig such as a tray is performed by using a position fixing tape, thereby positioning and fixing. Since the subsequent steps from the plating process to the subsequent plating process can be executed as one continuous process, the productivity can be remarkably improved.

Further, the reliability is not reduced by removing the jig. Next, another embodiment of the present invention will be described. FIG. 4 shows an example in which the position fixing tape is formed in a film shape (band shape).

That is, the position fixing tape row 40
Is an island 40 for fixing the semiconductor chip 10
_1, the semiconductor chip 1 in this island 40 ₁ surrounding a plurality of openings formed in 40 _2, and TCP tape 30
0 consisting adhesive fixing portion 40 ₃ for securing a plurality of tape 40a, 40b, 40c, ~ is, through the opening 40 _4, there is a continuously tethered configuration.

In this case, each of the tapes 40a, 40b, 40
In the state where the semiconductor chips 10 are respectively fixed to the islands 40 ₁ , c,.
The fixing of each semiconductor chip 10 to the CP tape 30 is continuously performed.

FIG. 5 shows the position fixing tape row described above.
This is an example in which a sprocket hole is provided. That is, the position fixing tape row 50 is provided with a plurality of apertures (sprocket holes) on both side faces of the film-shaped position fixing tape row (for example, the position fixing tape row 40 in FIG. 4 described above). ) 51 are provided.

In this case, the positioning tape row 50 is transported, and the transport is synchronized with the transport of the TCP tape 30 at the time of this transport, so that the positioning can be facilitated.

As described above, the fixing between the semiconductor chip and the TCP tape can be simplified. That is, a position fixing tape is used for positioning and fixing the semiconductor chip and the TCP tape. This allows
Plating bonding can be performed without requiring a jig such as a tray. Therefore, it is possible to eliminate various troubles such as troubles such as installation and removal of the jig, cleaning and drying for reusing the jig, and a stress applied to the joint portion by the surface tension of the plating solution at the time of removal. It is possible to improve productivity and reliability.

In particular, when the position fixing tape is formed in a film shape, the processing of the next step can be performed continuously, or it can be wound up and then transferred to the processing of the next step. It is possible to realize a mass production system according to the equipment and situation. The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the invention.

[0031]

As described in detail above, according to the present invention, a semiconductor device capable of performing plating bonding without using a positioning jig or the like and improving productivity and reliability and a semiconductor device therefor. A manufacturing method can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view schematically showing a structure of a semiconductor device according to one embodiment of the present invention.

FIG. 2 is a perspective view similarly illustrating a main part in a manufacturing process of the semiconductor device.

FIG. 3 is a plan view showing a schematic configuration of a TCP tape.

FIG. 4 is a perspective view shown to explain a main part in a manufacturing process of a semiconductor device according to a second embodiment of the present invention;

FIG. 5 is a perspective view showing an example of a position fixing tape row according to a third embodiment of the present invention.

FIG. 6 is a perspective view in the case of performing a plating connection shown to explain a conventional technique and its problems.

[Explanation of symbols]

10: semiconductor chip, 20: position fixing tape, 21:
Adhesive, 30: TCP tape, 31: Inner lead (lead terminal), 40, 50: Positioning tape row.

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yoshimasa Kudo 1 Komagi Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Prefecture Inside the Toshiba Tamagawa Plant (72) Inventor Yasuhiko Ono 1618 Ida, Nakahara-ku, Kawasaki-shi, Kanagawa New Nippon Steel Corporation Advanced Technology Research Laboratories (72) Inventor Kohei Tatsumi 1618 Ida, Nakahara-ku, Kawasaki City, Kanagawa Prefecture New Nippon Steel Corporation Advanced Technology Research Laboratories (72) Inventor Toshinori Ando Nakada-ku, Kawasaki City, Kanagawa Prefecture No. 1618 Shin Nippon Steel Corporation Advanced Technology Laboratory (56) References JP-A-4-15931 (JP, A) JP-A-4-37149 (JP, A) JP-A-54-126465 (JP, A) Hira 2-27746 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60 311 H01L 21/60 321

Claims (4)

(57) [Claims] A semiconductor chip having electrodes; a lead terminal provided corresponding to the electrode of the semiconductor chip ; and a metal for fixing an electrode of the semiconductor chip to the lead terminal. A semiconductor, comprising: an adhesive tape for positioning; and a joint formed by electrically joining an electrode of the semiconductor chip and a lead terminal by metal plating while being fixed by the adhesive tape. apparatus. 2. The semiconductor device according to claim 1, wherein said adhesive tape is formed in a film shape. 3. The semiconductor device according to claim 1, wherein said lead terminals are inner leads of a TCP tape . 4. A semiconductor chip having electrodes is fixed by an adhesive tape, a TCP tape lead terminals are formed is positioned on the semiconductor chip, the lead terminals of the TCP tape
After fixing the electrodes of the semiconductor chip in a state where they are aligned with the adhesive tape and then putting the semiconductor chip into a metal plating atmosphere, the electrodes of the semiconductor chip and the lead terminals of the TCP tape are joined by metal plating. A method of manufacturing a semiconductor device, comprising: