JPH088293A - Structure for connecting electronic parts and connection method therefor - Google Patents

Abstract

PURPOSE:To connect a semiconductor chip with a film substrate by a small number of steps and without thermocompression bonding when they are subject to bonding. CONSTITUTION:A through-hole 17 is made in an insulation film 16 forming on the upper surface side of a semiconductor chip 11,' corresponding to a connection pad 14 and metallic layer 15. A through-hole 22 is also made in a film substrate 21 corresponding to the hole 17. Wiring patterns 24 and 25 are formed on the upper surface of the substrate 21. Then, the lower surface of the substrate 21 is fixed on the upper surface of the film 16 with an adhesive 26, and a conductive resin 27 is provided inside the holes 22 and 17 and adjacent to them, thereby electrically connecting the patterns 24 and 25 and the layer 15 through the resin 27. In this case, the resin 27 is formed by screen printing, resulting in connecting them by a small number of steps and without thermocompression bonding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting structure for electronic components and a connecting method therefor, and more particularly to a connecting structure for electronic components in which an electronic component such as a semiconductor chip is connected to a substrate and a connecting method therefor.

[0002]

2. Description of the Related Art For example, a TAB tape has a structure in which a semiconductor chip is mounted (connected) on a film substrate.
FIG. 6 shows an example of such a conventional TAB tape. This TAB tape includes a film substrate 1. A device hole 2 is provided at a predetermined position on the film substrate 1. Finger leads (inner leads) 3 and the like protruding into the device holes 2 are provided on the lower surface of the film substrate 1. And the film substrate 1
Since the bumps 5 provided on the upper surface of the semiconductor chip 4 arranged in the device hole 2 from the lower surface side of the are connected to the lower surface of the finger leads 3 via solder (not shown), the semiconductor chip 4 Are mounted on the film substrate 1. In the semiconductor chip 4, the connection pad 8 formed on the chip body 6 is exposed through the opening formed in the passivation film 7 formed on the chip body 6, and the exposed connection pad 8 is exposed. The base metal layer 9 and the bumps 5 are formed in the structure. In this case, the bumps 5 are formed by electrolytic plating or electroless plating. Further, the bump 5 of the semiconductor chip 4 and the finger lead 3 are connected to each other via solder by thermocompression bonding using a thermocompression bonding head.

[0003]

However, in the conventional connection structure for such electronic parts, the bumps 5 of the semiconductor chip 4 are formed by electrolytic plating or electroless plating, and the bumps 5 of the semiconductor chip 4 are formed. Since the connection between the lead and the finger lead 3 via solder is performed by thermocompression bonding using a thermocompression bonding head, the bump forming process and the thermocompression bonding process are separate, so that the number of processes is large and the productivity is poor. Not only that, but there was also the problem of high costs. In addition, since relatively large pressure and heat are applied especially to the semiconductor chip 4 during thermocompression bonding, there is a problem that the semiconductor chip 4 is greatly damaged and a defective product may occur. Further, when such a defective product is generated or there is a defective portion in the connection between the bump 5 of the semiconductor chip 4 and the finger lead 3, it is determined as a defective product as a result of the operation test. Since the connection between the lead wire 5 and the finger lead 3 via the solder is metallic, it is not possible to satisfactorily separate the two and to replace it with another semiconductor chip 4, and therefore the film provided with the finger lead 3 and the like. Even if the substrate 1 is a good product, it is discarded as it is, which is a problem. Further, when the number of pins of the semiconductor chip 4 is increased, the finger leads 3 have to be thinned because of the restriction of the arrangement position of the finger leads 3 protruding in the device hole 2, but if they are thinned, the finger leads 3 will have to be thinned. Since 3 protrudes into the device hole 2, the strength is weakened, and as a result, the finger lead 3 is easily bent or cut, and there is a problem in that it requires considerable care in handling. An object of the present invention is to provide a connection structure of an electronic component and a connection method thereof, which can be connected by a small number of steps and without thermocompression bonding. Another object of the present invention is to provide a connection structure of an electronic component and a connection method thereof that can cope with the increase in the number of pins without difficulty.

[0004]

According to a first aspect of the present invention, there is provided a connection structure for an electronic component, wherein the electronic component has a plurality of connection electrodes on one surface and a wiring pattern on the one surface. A substrate having through holes in portions corresponding to the connection electrodes of the components, and a conductive member provided in the through holes of the substrate and in the vicinity thereof, respectively, and the electronic component with respect to one surface of the substrate. In addition to being fixed to the surface on the opposite side, the connection electrode of the electronic component and the wiring pattern of the substrate are conductively connected via the conductive member. According to a third aspect of the present invention, there is provided an electronic component connecting structure, wherein a plurality of first connecting electrodes are provided on one surface, an interlayer insulating film is provided on the first connecting electrodes, and the first connecting electrodes are provided on the interlayer insulating film. An electronic component provided with a second connection electrode connected to the corresponding first connection terminal at a position different from at least part of the position where the electrode is arranged, and a wiring pattern on one surface, The electronic component is composed of a substrate having a through hole in a portion corresponding to the second connection electrode of the electronic component, and a conductive member provided in and near the through hole of the substrate. The second connection electrode of the electronic component and the wiring pattern of the substrate are conductively connected to each other through the conductive member while being fixed to the surface opposite to the surface of the above. Claim 5
A method of connecting electronic components according to the invention described in any one of claims 1 to 4.
When connecting the electronic component connection structure according to any one of
After the electronic component and the substrate are fixed to each other, the conductive member is applied to the inside of the through hole of the substrate and its vicinity by screen printing.

[0005]

According to the first aspect of the present invention, a conductive member is provided in which a connecting electrode of an electronic component such as a semiconductor chip and a wiring pattern of a substrate such as a film substrate are provided in the through hole of the substrate and in the vicinity thereof. Since the conductive connection is made through the conductive member, for example, when a conductive member is applied by screen printing in and around the through hole of the substrate as in the invention of claim 5, the conductive member is provided through the provided conductive member. The connection electrode of the electronic component and the wiring pattern of the substrate can be conductively connected, and therefore can be connected in a small number of steps and without thermocompression bonding. According to the third aspect of the invention, the structure of the electronic component including the semiconductor chip and the like is arranged at a position different from at least a part of the position of the first connection electrode provided on the one surface in the second structure. Since the structure is such that the connection electrodes are connected to the corresponding first connection terminals respectively, the arrangement position of the second connection electrodes can be selected relatively freely, and even if the number of pins is increased, the board The arrangement position of the wiring pattern is not so restricted, so that it is possible to cope with the increase in the number of pins without difficulty.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an essential part of a connection structure for electronic parts in an embodiment of the present invention. The connection structure of this electronic component has a structure in which the semiconductor chip 11 and the film substrate 21 are connected. Of these, semiconductor chip 1
1 shows that the connection pad 14 formed on the chip body 12 is exposed through the opening formed in the passivation film 13 formed on the chip body 12, and the metal layer 15 is formed on the exposed connection pad 14. And the metal layer 15 is formed.
The insulating film 16 having a flat surface is formed on the passivation film 13 except for the above and surroundings. Therefore, the through hole 17 is formed in the insulating film 16 in the portion corresponding to the metal layer 15 and its periphery.

A through hole 22 is formed in a portion of the film substrate 21 corresponding to the through hole 17 of the semiconductor chip 11. A wiring pattern is formed on the upper surface of the film substrate 21 via an adhesive 23. The wiring pattern in this case is composed of a wiring pattern 24 for connection formed around the upper surface of the film substrate 21 and a wiring pattern 25 for operation test formed in the central portion of the upper surface of the film substrate 21. Then, the lower surface of the film substrate 21 is bonded to the upper surface of the insulating film 16 of the semiconductor chip 11 with an adhesive 26 with the through holes 22 aligned with the through holes 17 of the semiconductor chip 11, respectively. It is fixed. Conductive members 27 are provided in the through holes 22 and 17 of the film substrate 21 and the semiconductor chip 11 and in the vicinity thereof, respectively, and the wiring patterns 24 and 25 of the film substrate 21 and the semiconductor chips 11 are provided via the conductive members 27.
Is electrically conductively connected to the metal layer 15.

Next, a method of manufacturing the semiconductor chip 11 will be described with reference to FIGS. 2 (A) to 2 (E) in order. First, as shown in FIG. 2A, the connection pad 14 formed on the chip body 12 is exposed through the opening formed in the passivation film 13 formed on the chip body 12, and this exposed portion is exposed. A metal layer 15 on the connection pad 14
Prepare the one in which is formed. Metal layer 15 in this case
Although not shown in detail, the lower side is the same as the base metal layer 9 of the conventional semiconductor chip 4 shown in FIG. 6 and is made of a Ti—W alloy formed on the connection pad 14 made of Al. The structure is such that an upper metal layer made of Au is formed on the metal layer. Of these, the lower metal layer is the connection pad 14
Is to improve the adhesion between the upper metal layer and
The upper metal layer is for preventing surface oxidation.

Next, as shown in FIG. 2B, an insulating film 16 made of polyimide is applied to the entire upper surface by a method such as spin coating so that the surface becomes flat. In this case, the film thickness of the insulating film 16 is about 5 to 10 μm. Next, after prebaking, as shown in FIG. 2C, the negative photoresist layer 1 is formed on the upper surface of the insulating film 16.
8 is applied and formed. Next, exposure is performed using a photomask 19 having a light-shielding pattern on the metal layer 15 and the portion around the metal layer 15. Next, as shown in FIG. 2D, when development is performed, a photoresist pattern 18a is formed, and the insulating film 16 is etched by the developing solution at this time using the photoresist pattern 18a as a mask, and the metal layer 15 and A through hole 17 is formed in the insulating film 16 in the portion corresponding to the periphery thereof. After that, when the photoresist pattern 18a is peeled off, FIG.
As shown in FIG. 7, the insulating film 16 having a flat surface is formed on the passivation film 13 excluding the metal layer 15 and its periphery.

Next, a method of manufacturing the film substrate 21 will be described with reference to FIGS. 3 (A) to 3 (D) in order. First, as shown in FIG. 3 (A), a metal foil 3 made of copper foil or the like for forming wiring patterns 24, 25 on an upper surface of a film substrate 21 made of polyimide, PET or the like via an adhesive 23.
Laminate 1. Next, a positive photoresist layer 32 is applied and formed on the upper surface of the metal foil 31. Next, by exposing using a photomask 33 having a predetermined light-shielding pattern and then developing, a predetermined photoresist pattern 32a is formed as shown in FIG. 3 (B). Next, as shown in FIG. 3C, etching is performed using the photoresist pattern 32a as a mask to form predetermined wiring patterns 24 and 25. Then, the photoresist pattern 32a is peeled off.

Next, as shown in FIG. 3 (D), through holes are formed in a predetermined plurality of locations on the film substrate 21, that is, at portions corresponding to the through holes 17 of the semiconductor chip 11 shown in FIG. 2 (E). 22 is formed. In this case, as a method of forming the through holes 22, there is a method of forming a photoresist pattern on both surfaces and performing wet etching, but for forming the fine through holes 22, a forming method using a laser is more preferable. Is desirable. The forming method at this time is to irradiate a laser on the formation position of the through hole 22 in the film substrate 21,
This is a method of removing the irradiated portion. Further, as a forming method using a laser, there are a forming method by thermal decomposition using a YAG laser or the like and a forming method by cutting a molecular bond using an excimer laser or the like, but the latter is superior in a processed shape. Is desirable. Thus, the manufacturing of the film substrate 21 is completed.

Next, the semiconductor chip 11 and the film substrate 2
A method of connecting to 1 will be described with reference to FIGS. 4 (A) to 4 (C) in order. First, as shown in FIG. 4A, an adhesive 26 made of a thermosetting resin or a thermoplastic resin is applied to a predetermined portion on the lower surface of the film substrate 21 by a method such as screen printing to form the adhesive 26. Next, as shown in FIG. 4B, with the through holes 17 and 22 corresponding to the semiconductor chip 11 and the film substrate 21 aligned, the surface of the insulating film 16 of the semiconductor chip 11 and the film are aligned. The lower surface of the substrate 21 is adhered and fixed via the adhesive 26. In this case, since the surface of the insulating film 16 is flat, the adhesiveness between the semiconductor chip 11 and the film substrate 21 can be improved. In addition, the insulating film 16 also has a role of protecting the surface of the semiconductor chip 11.

Next, as shown in FIG. 4C, the screen mask 41 is aligned and arranged on the wiring patterns 24 and 25 of the film substrate 21. In this case, the pattern of the screen mask 41 is a pattern having a printing material passage permitting portion at portions corresponding to the through holes 22 and 17 aligned with each other. Next, a conductive resin (conductive member) 27 made of silver paste, carbon paste, or the like is rubbed out with a squeegee 42, and as shown in FIG. The resin 27 is provided by printing. Next, when heat treatment is performed to cure the conductive resin 27, the metal layer 1 of the semiconductor chip 11 is interposed via the cured conductive resin 27.
5 and the wiring patterns 24 and 25 of the film substrate 21 are conductively connected. Thus, the semiconductor chip 11
And the film substrate 21 are connected.

In the electronic component connection structure thus obtained, the conductive resin 27 is applied by screen printing to the insides of the through holes 22 and 17 of the film substrate 21 and the semiconductor chip 11 and their vicinity. Through the conductive resin 27 thus provided, the connection electrodes composed of the connection pads 14 of the semiconductor chip 11 and the metal layer 15 thereon can be conductively connected to the wiring patterns 24 and 25 of the film substrate 21. Therefore, compared with the conventional case where the bump forming process and the thermocompression bonding process are separate,
You can connect with a small number of processes, productivity is improved,
Cost can be reduced. In addition, since the connection can be made without using thermocompression bonding, the semiconductor chip 11 is less damaged, and defective products are less likely to occur in the connection process. Further, in the case of thermocompression bonding, since the film substrate 21 is heated to a considerably high temperature (about 230 to 310 ° C.), a material having low heat resistance cannot be used. It can be used even if it has low properties. Also, the TA shown in FIG.
In the case of the B tape, in consideration of the flatness of the thermocompression bonding surface of the thermocompression bonding head, it is not possible to easily cope with an increase in the size of the semiconductor chip 4, but in the case of this embodiment, the conductive resin 27 is used as a screen. Since it may be formed by printing, it is possible to easily cope with an increase in the size of the semiconductor chip 11. Further, in the case of the TAB tape shown in FIG. 6, generally, in order to improve reliability, the semiconductor chip 4 and the finger leads 3 are sealed with a sealing resin, so that the number of steps is increased. In the case of this embodiment, there is no such need.

Next, as a result of the operation test after completion, the semiconductor chip 11 is determined to be defective, or the conductive connection via the conductive resin 27 is determined to be defective, and another semiconductor chip 1 is determined.
The case of exchanging with 1 will be described. First, in the case of performing an operation test, although not shown, a probe for electrically connecting to a test device is brought into contact with the test wiring pattern 25 of the film substrate 21, and the wiring pattern 24 for connection is The surface can be protected from scratches.
Next, when the semiconductor chip 11 is replaced, the conductive resin 27 is made of silver paste, carbon paste, or the like. Therefore, if an organic solvent such as isopropylene alcohol or acetone is used, the conductive resin 27 is dissolved. be able to. Further, if a thermoplastic resin is used as the adhesive 26,
The heat treatment can soften the adhesive 26. Therefore, the defective semiconductor chip 11 is replaced by the film substrate 2.
It can be easily separated from 1. Next, if necessary, the film substrate 21 is washed with the same organic solvent as described above to completely remove the conductive resin 27 remaining on the film substrate 21. Next, another semiconductor chip 11 is connected to the film substrate 21 through the same connection process as in the above case, so that the generally good film substrate 21 can be easily reused.

Next, FIG. 5 shows an essential part of a connecting structure for electronic parts in another embodiment of the present invention. In this figure, the same reference numerals are given to the same names as those in FIG. 1, and the description thereof will be omitted as appropriate. In the semiconductor chip 11 of this embodiment, a first interlayer insulating film 51 is formed on the entire upper surfaces of the first connection pad 14 and the passivation film 13, and a wiring pattern 52 for relaying is formed on the upper surface of the first interlayer insulating film 51. Is formed by being connected to the connection pad 14 through the opening formed in the first interlayer insulating film 51, and the second interlayer insulating film is formed on the entire upper surfaces of the relay wiring pattern 52 and the first interlayer insulating film 51. The film 53 is formed, and the second connection pad 54 is formed on the upper surface of the second interlayer insulating film 53 by being connected to the relay wiring pattern 52 through the opening formed in the second interlayer insulating film 53. It has a structured structure. In this case, the first connection pad 14 is the planar chip body 1
The second connection pad 5 arranged along the four sides of the upper surface of
4 is arranged at a position different from at least the position where the first connection pad 14 is arranged. On the other hand, the through hole 22 is formed in the portion of the film substrate 21 corresponding to the second connection pad 54 of the semiconductor chip 11 and its vicinity.

The lower surface of the film substrate 21 and the upper surface of the second interlayer insulating film 53 of the semiconductor chip 11 are bonded to each other by the adhesive 2
Conductive resin 27 provided inside and in the vicinity of the through hole 22 of the film substrate 21 by being adhered and fixed via 6
Wiring pattern 24 for connection of the film substrate 21 via
And the second connection pad 54 of the semiconductor chip 11 are conductively connected. In this case, the structure of the semiconductor chip 11 is the same as that of the first chip provided on the upper surface of the chip body 12.
Since the second connection pad 54 is connected to the corresponding first connection pad 14 at a position different from at least the position where the connection pad 14 is arranged, the second connection pad 54 Can be relatively freely selected, and even if the number of pins is increased, the position of the wiring pattern 24 on the film substrate 21 is not restricted so much, and thus the number of pins can be coped with without difficulty.

[0018]

As described above, according to the present invention, when a conductive member is applied in the through hole of the substrate and in the vicinity thereof by screen printing, for example, an electronic component is provided through the provided conductive member. Since the connection electrode and the wiring pattern of the substrate can be conductively connected, the connection can be performed in a small number of steps, the productivity can be improved, and the cost can be reduced. Also, since the connection can be made without using thermocompression bonding, the damage to electronic parts is small,
It is possible to prevent defective products from occurring in the connection process. Further, when the conductive connection is made by the conductive member made of a conductive resin, the electronic component and the substrate can be easily separated after completion, and therefore, when the electronic component is replaced after completion, the electronic component can be easily replaced. You can According to the third aspect of the invention, the structure of the electronic component including the semiconductor chip and the like is arranged at a position different from at least a part of the position of the first connection electrode provided on the one surface in the second structure. Since the structure is such that the connection electrodes are connected to the corresponding first connection terminals respectively, the arrangement position of the second connection electrodes can be selected relatively freely, and even if the number of pins is increased, the board The arrangement position of the wiring pattern is not so restricted, so that it is possible to cope with the increase in the number of pins without difficulty.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main part of a connection structure for electronic components according to an embodiment of the present invention.

2A to 2E are cross-sectional views showing respective manufacturing steps of a semiconductor chip.

3A to 3D are cross-sectional views showing respective manufacturing steps of the film substrate.

4A to 4C are cross-sectional views showing respective connecting steps of the semiconductor chip and the film substrate.

FIG. 5 is a sectional view showing an essential part of a connection structure for an electronic component according to another embodiment of the present invention.

FIG. 6 shows T as an example of a conventional connection structure for electronic components.
Sectional drawing of AB tape.

[Explanation of symbols]

 11 Semiconductor Chip 14 Connection Pad 15 Metal Layer 16 Insulating Film 17 Through Hole 21 Film Substrate 22 Through Hole 24, 25 Wiring Pattern 26 Adhesive 27 Conductive Resin (Conductive Member)

Claims (5)

[Claims] 1. An electronic component having a plurality of connection electrodes on one surface, a substrate having a wiring pattern on the one surface, and a through hole at a portion corresponding to each of the connection electrodes of the electronic component, And a conductive member provided inside and in the vicinity of the through hole of the electronic component, and the electronic component is fixed to a surface opposite to the one surface of the substrate, and the electronic component is provided through the conductive member. A connection structure for an electronic component, wherein a connection electrode of the component and a wiring pattern of the substrate are conductively connected. 2. The electronic component according to claim 1, wherein an insulating film having a flat surface is provided on one surface of the electronic component excluding the connection electrode, and the substrate is fixed to the surface of the insulating film. Connection structure. 3. A plurality of first connection electrodes are provided on one surface, an interlayer insulating film is provided on the first connection electrodes, and at least a part of the position is the arrangement position of the first connection electrodes. An electronic component having second connection electrodes connected to different corresponding first connection terminals at different positions, and a second connection electrode of the electronic component having a wiring pattern on one surface. A substrate having through holes in corresponding portions, and a conductive member provided in the through holes of the substrate and in the vicinity thereof, respectively, the electronic component on the surface opposite to one surface of the substrate. A connection structure for an electronic component, wherein the second connection electrode of the electronic component and the wiring pattern of the substrate are conductively connected to each other via the conductive member. 4. The electronic component comprises a semiconductor chip,
The connection structure for electronic components according to claim 1, wherein the substrate is a film substrate. 5. When connecting the electronic component connection structure according to claim 1, after the electronic component and the substrate are fixed, the conductive member is provided in the through hole of the substrate and in the vicinity thereof. A method for connecting electronic components, wherein the method is applied by screen printing.