JP3201560U - 接着剤層ラミネート装置 - Google Patents
接着剤層ラミネート装置 Download PDFInfo
- Publication number
- JP3201560U JP3201560U JP2015005003U JP2015005003U JP3201560U JP 3201560 U JP3201560 U JP 3201560U JP 2015005003 U JP2015005003 U JP 2015005003U JP 2015005003 U JP2015005003 U JP 2015005003U JP 3201560 U JP3201560 U JP 3201560U
- Authority
- JP
- Japan
- Prior art keywords
- module
- adhesive layer
- lead frame
- transport module
- lateral movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104211871U TWM518818U (zh) | 2015-07-23 | 2015-07-23 | 膠材貼合裝置 |
TW104211871 | 2015-07-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3201560U true JP3201560U (ja) | 2015-12-17 |
Family
ID=54874222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015005003U Expired - Fee Related JP3201560U (ja) | 2015-07-23 | 2015-10-02 | 接着剤層ラミネート装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3201560U (zh) |
CN (1) | CN205028890U (zh) |
TW (1) | TWM518818U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109755140A (zh) * | 2019-02-27 | 2019-05-14 | 西安派瑞功率半导体变流技术股份有限公司 | 大功率电力半导体器件通用自动压装机构 |
CN111048448A (zh) * | 2019-11-30 | 2020-04-21 | 宁波启谱自动化科技有限公司 | 集成电路引线框架常温贴胶带机 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI607878B (zh) * | 2015-07-23 | 2017-12-11 | Youngtek Electronics Corp | Rubber adhesive system and method |
CN108878298A (zh) * | 2017-05-12 | 2018-11-23 | 鸿骐新技股份有限公司 | 生物辨识芯片模块封装设备及其封装方法 |
TWI760977B (zh) * | 2019-06-19 | 2022-04-11 | 萬潤科技股份有限公司 | 散熱膠墊貼合方法及設備 |
CN111688334A (zh) * | 2020-06-15 | 2020-09-22 | 歌尔股份有限公司 | 气泡修复设备及气泡修复方法 |
CN112208198A (zh) * | 2020-09-10 | 2021-01-12 | 许从平 | 一种用于耳机圆盖的商标移印机 |
TWI806167B (zh) * | 2021-09-23 | 2023-06-21 | 均華精密工業股份有限公司 | 晶片貼膜設備 |
-
2015
- 2015-07-23 TW TW104211871U patent/TWM518818U/zh unknown
- 2015-09-08 CN CN201520689928.5U patent/CN205028890U/zh not_active Expired - Fee Related
- 2015-10-02 JP JP2015005003U patent/JP3201560U/ja not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109755140A (zh) * | 2019-02-27 | 2019-05-14 | 西安派瑞功率半导体变流技术股份有限公司 | 大功率电力半导体器件通用自动压装机构 |
CN109755140B (zh) * | 2019-02-27 | 2023-10-17 | 西安派瑞功率半导体变流技术股份有限公司 | 大功率电力半导体器件通用自动压装机构 |
CN111048448A (zh) * | 2019-11-30 | 2020-04-21 | 宁波启谱自动化科技有限公司 | 集成电路引线框架常温贴胶带机 |
CN111048448B (zh) * | 2019-11-30 | 2023-06-02 | 宁波启谱自动化科技有限公司 | 集成电路引线框架常温贴胶带机 |
Also Published As
Publication number | Publication date |
---|---|
CN205028890U (zh) | 2016-02-10 |
TWM518818U (zh) | 2016-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3201560U (ja) | 接着剤層ラミネート装置 | |
JP5589045B2 (ja) | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 | |
JP4311522B2 (ja) | 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法 | |
JP5273791B2 (ja) | 基板への接着テープ貼り付け装置 | |
CN106043799B (zh) | 侧面周边仿形自动贴膜装置及其贴膜方法 | |
WO2010051723A1 (zh) | 一种电池电芯的自动叠片设备 | |
CN107600515B (zh) | 3d贴膜设备及3d贴膜方法 | |
CN107521207B (zh) | 玻璃摆片贴膜机及其摆片贴膜方法 | |
JP2009158879A (ja) | 基板への接着シートの貼付け装置 | |
US20100059183A1 (en) | Wafer taping and detaping machine | |
KR20140086361A (ko) | 다이 본딩 방법 및 장치 | |
WO2021036079A1 (zh) | 一种pcb板包边机构 | |
JP2006156633A (ja) | 脆質部材の処理装置 | |
CN107636821B (zh) | 片材剥离装置及剥离方法 | |
WO2014167947A1 (ja) | 半導体装置の製造方法 | |
KR101684288B1 (ko) | 웨이퍼 보호용 필름의 분리장치 | |
TWI744517B (zh) | 可撓性元件之製造裝置及製造方法 | |
JP6298381B2 (ja) | 基板貼合せ方法および基板貼合せ装置 | |
TWI607878B (zh) | Rubber adhesive system and method | |
JP2016082166A (ja) | 粘着テープ貼付け方法および粘着テープ貼付け装置 | |
JP2001267614A (ja) | 光電変換モジュールの出力取出し線取付け方法及び装置 | |
JP2016181613A (ja) | 基板への接着テープ貼り付け装置及び貼り付け方法 | |
JP2006319233A (ja) | 脆質部材の処理装置 | |
CN205833951U (zh) | 一种铜箔软连接自动加工装置 | |
KR101480099B1 (ko) | 연성회로기판의 핫프레스용 쿠션시트 합지장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R150 | Certificate of patent or registration of utility model |
Ref document number: 3201560 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |