JP3163213U - 液体浸漬冷却システム - Google Patents
液体浸漬冷却システム Download PDFInfo
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- JP3163213U JP3163213U JP2010003139U JP2010003139U JP3163213U JP 3163213 U JP3163213 U JP 3163213U JP 2010003139 U JP2010003139 U JP 2010003139U JP 2010003139 U JP2010003139 U JP 2010003139U JP 3163213 U JP3163213 U JP 3163213U
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- Prior art keywords
- computer
- coolant
- internal space
- liquid
- motherboard
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0204—Mounting supporting structures on the outside of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/908—Fluid jets
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
・人工流体(3M(登録商標)ノベック(登録商標)(3M(登録商標) Novec(登録商標))など)
・鉱油、
・シリコーン油、
・天然エステル系油(大豆系油を含む)、
・合成エステル系油
が挙げられるが、これらに限定されるものではない。これら誘電性流体の多くは、コンピュータ部品の火災を消火する能力も有する。コンピュータ部品を誘電性の消火流体に浸漬することにより、コンピュータ部品の故障に起因する火災の可能性が最小限に抑えられる。
・ペルチェ効果冷却
・ファンまたは他の空気移動機構を用いたラジエータ表面のアクティブ空冷
・周囲温度をできるだけ下げるように、熱伝導性を有する熱交換表面をできるだけ露出することによるパッシブ冷却。
Claims (11)
- コンピュータであって、
液密な内部空間を規定するハウジングと、前記内部空間の外部から前記内部空間への液体流入口と、前記内部空間からその外部への液体流出口と、
前記内部空間内に配置される前記コンピュータの完全な演算システムを形成し、演算プロセッサおよび電源を含む複数の電子的および熱的に稼動する部品と、
前記内部空間内にある誘電性冷却液であって、前記演算プロセッサおよび前記電源を含む前記稼動部品が前記冷却液に直接接触した状態で浸漬される誘電性冷却液と、
前記内部空間の外側で前記ハウジングに固定された熱交換器であって、前記内部空間の外部にある冷却液流入口と、前記内部空間の外部にある冷却液流出口と、前記冷却液流入口から前記冷却液流出口へ冷却液を流すための流路とを含む熱交換器と、
前記冷却液流出口を前記冷却液流入口に接続する第1の流体路と、前記冷却液流入口を前記冷却液流出口に接続する第2の流体路と
を含むコンピュータ。 - 前記部品は、メモリを含み、前記内部空間内にあるマザーボード上に配置されている、請求項1に記載のコンピュータ。
- 前記内部空間に配置され、前記誘電性冷却液に浸漬されるハードドライブ機構と、前記ハードドライブ機構に接続され、前記ハードドライブと外気圧との間の圧力平衡を実現するよう前記内部空間の外部と連通させたスノーケルとをさらに含む、請求項1に記載のコンピュータ。
- 冷却液を前記内部空間に対して流出入させるための流入口と流出口とを含むポンプをさらに含む、請求項1に記載のコンピュータ。
- 前記内部空間の上部を閉鎖するために前記ハウジングに取り外し可能に接続された蓋部であって、少なくとも1つのパススルーコネクタと、前記内部空間に配置され、かつ前記蓋部に取り付けられたマザーボードであって、入出力および/または電力を前記マザーボードに渡すことを可能にする前記パススルーコネクタに係合された電気的コンタクトを備えた上端部を有するマザーボードとを含む蓋部をさらに含む、請求項1に記載のコンピュータ。
- 前記誘電性冷却液の流れを前記演算プロセッサまたは前記電源上に直接導くための複数の管を含むインピンジ冷却システムをさらに含む、請求項1に記載のコンピュータ。
- 少なくとも部分的に前記内部空間の外において上昇位置にある前記マザーボードを保持するように構成された機構をさらに含み、前記マザーボードは、スライドをそれぞれ備えた側端部を含み、前記ハウジングは、互いに対向する壁のうちの2つの内面にそれぞれ配置されたマザーボードガイド溝を含み、前記スライドは前記マザーボードガイド溝内に位置しており、前記マザーボードを前記上昇位置で保持するように構成されたストップ部材が前記スライドの1つに設けられている、請求項5に記載のコンピュータ。
- コンピュータの演算システムを冷却する方法であって、
前記演算システムは、複数の電子的および熱的に稼動する部品を含み、前記複数の電子的および熱的に稼動する部品は、完全な演算システムを形成し、演算プロセッサおよび電源を含み、
前記方法は、
前記完全な演算システムの前記稼動部品を前記コンピュータ内の内部空間にある誘電性冷却液に浸漬して前記稼動部品を前記冷却液に直接接触させるステップと、
前記誘電性冷却液を冷却するため前記コンピュータに実装された外部熱交換器に前記誘電性冷却液を循環させるステップと
を含む方法。 - 液体浸漬冷却されたコンピュータ用マザーボードアセンブリであって、
第1の表面および第1の軸を有するマザーボードと、
前記第1の表面に実装された前記コンピュータの完全な演算システムを形成し、演算プロセッサおよび電源を含む複数の電子的および熱的に稼動する部品とを含み、
前記部品は、前記第1の軸に平行な複数の第1液体流路と、前記第1の軸に垂直な複数の第2液体流路とを形成するよう前記第1の表面に互いに対して並べられ、前記マザーボードが液体に浸漬されたときに、前記複数の第1および第2流路が液体の流れを促進し、
前記マザーボードに接続されたインピンジ冷却システムは、前記誘電性冷却液の流れを前記演算プロセッサまたは前記電源上に直接導くための複数の管を含み、
前記マザーボードは、入出力および/または電力を前記マザーボードに渡すことを可能にするパススルーコネクタと係合するための電気的コンタクトを備えた上端部を有する
マザーボードアセンブリ。 - 液体浸漬冷却されたコンピュータ用のハウジングであって、
液密な内部空間を規定する複数の壁であって、前記壁の1つの一部が前記コンピュータの外部から見え、前記内部空間内にある物体を見えるようにする材料からなり、互いに対向する前記壁のうちの2つの内面にマザーボードガイド溝がそれぞれ配置されている壁と、
前記内部空間の上部を閉鎖する取り外し可能な蓋部であって、前記複数の壁と共に液密シールを形成し、前記内部空間に配置されるマザーボードに取り付けられるとともに前記内部空間と前記筐体の外部との間で電気的接続が得られるよう構成された、前記蓋部に固定された密封電気コネクタを含む蓋部と
を含むハウジング。 - 前記蓋部は、前記蓋部が開けられたときに前記内部空間への電力を遮断する電力遮断機構を含む、請求項10に記載のハウジング。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80071506P | 2006-05-16 | 2006-05-16 | |
US11/736,947 US7403392B2 (en) | 2006-05-16 | 2007-04-18 | Liquid submersion cooling system |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009511190A Continuation JP2009537905A (ja) | 2006-05-16 | 2007-05-14 | 液体浸漬冷却システム |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3163213U true JP3163213U (ja) | 2010-10-07 |
Family
ID=38711268
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009511190A Pending JP2009537905A (ja) | 2006-05-16 | 2007-05-14 | 液体浸漬冷却システム |
JP2010003139U Expired - Lifetime JP3163213U (ja) | 2006-05-16 | 2010-05-13 | 液体浸漬冷却システム |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009511190A Pending JP2009537905A (ja) | 2006-05-16 | 2007-05-14 | 液体浸漬冷却システム |
Country Status (7)
Country | Link |
---|---|
US (3) | US7403392B2 (ja) |
EP (1) | EP2021898A4 (ja) |
JP (2) | JP2009537905A (ja) |
KR (1) | KR101437702B1 (ja) |
CN (1) | CN101443724B (ja) |
TW (1) | TWI468910B (ja) |
WO (1) | WO2007137018A1 (ja) |
Cited By (4)
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WO2018087903A1 (ja) * | 2016-11-12 | 2018-05-17 | 株式会社ExaScaler | 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム |
WO2018087904A1 (ja) * | 2016-11-12 | 2018-05-17 | 株式会社ExaScaler | 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム |
WO2018087902A1 (ja) * | 2016-11-12 | 2018-05-17 | 株式会社ExaScaler | 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム |
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2007
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WO2018087905A1 (ja) * | 2016-11-12 | 2018-05-17 | 株式会社ExaScaler | 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム |
WO2018087903A1 (ja) * | 2016-11-12 | 2018-05-17 | 株式会社ExaScaler | 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム |
WO2018087904A1 (ja) * | 2016-11-12 | 2018-05-17 | 株式会社ExaScaler | 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム |
WO2018087902A1 (ja) * | 2016-11-12 | 2018-05-17 | 株式会社ExaScaler | 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム |
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US11013143B2 (en) | 2016-11-12 | 2021-05-18 | Exascaler Inc. | Electronic device for liquid immersion cooling, power supply unit, and cooling system |
Also Published As
Publication number | Publication date |
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CN101443724A (zh) | 2009-05-27 |
US7911782B2 (en) | 2011-03-22 |
US20070267741A1 (en) | 2007-11-22 |
US8009419B2 (en) | 2011-08-30 |
US20110075353A1 (en) | 2011-03-31 |
KR101437702B1 (ko) | 2014-09-03 |
US20080196870A1 (en) | 2008-08-21 |
JP2009537905A (ja) | 2009-10-29 |
EP2021898A4 (en) | 2015-07-22 |
CN101443724B (zh) | 2016-02-17 |
EP2021898A1 (en) | 2009-02-11 |
TWI468910B (zh) | 2015-01-11 |
KR20090029214A (ko) | 2009-03-20 |
TW200821809A (en) | 2008-05-16 |
US7403392B2 (en) | 2008-07-22 |
WO2007137018A1 (en) | 2007-11-29 |
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