JP3163111U - Capillary structure of heat sink - Google Patents

Abstract

A heat sink capillary structure capable of improving the temperature lowering efficiency of a heat sink is provided. The heat dissipation plate has a capillary structure in which an accommodation space is formed by coupling two plate bodies 100 correspondingly to each other, and at least one first capillary layer 210 is formed in the accommodation space. At least one second capillary layer 220 is provided, and the first capillary layer and the second capillary layer are deposited on each other. [Selection] Figure 1A

Description

  The present invention relates to a heat sink capillary structure, and more particularly to a heat sink capillary structure applicable to electronic products.

  Currently, general electronic products tend to generate heat when used for a long time, and the solution is mainly to dissipate heat by attaching a heat sink, which has a high thermal conductivity, It has characteristics such as light weight and simple structure, and further has the advantage of not consuming electric power even if a large amount of heat is transmitted.

  The conventional heat sink capillary structure mainly includes a plate main body, a vacuum chamber is formed inside the plate main body, a capillary tissue is provided in the vacuum chamber, and a working fluid is filled, on one side of the plate main body. A seal tube (also referred to as a closed tube, an exhaust pipe or a filling exhaust pipe) is connected, and one end of the seal tube is connected to the plate body and communicated with the internal vacuum chamber, thereby radiating heat through the seal tube. In addition to injecting a working fluid from the outside into the inside of the plate (ie, the vacuum chamber), exhaust and vacuum operations can be performed to dissipate heat generated during use of the electronic product.

  The main object of the present invention is to provide a heat sink capillary structure capable of improving the temperature lowering efficiency of the heat sink.

  In order to achieve the above-described object, the capillary structure of the heat sink according to the present invention includes two plate bodies that are coupled to each other to form a storage space, and at least one first capillary layer provided in the storage space; It is provided in the accommodation space and includes the first capillary layer and at least one second capillary layer deposited on each other.

  The present invention increases the diffusion efficiency of steam, promotes uniform distribution of the working fluid, improves the temperature reduction efficiency, and has practicality, novelty, inventive step and convenience.

  In order to obtain a deeper understanding of the features, features, and technical contents of the present invention, reference can be made to the following detailed description and the accompanying drawings of the present invention. It is not limited.

FIG. 1A is an exploded perspective view showing a first embodiment of a capillary structure of a heat sink according to the present invention. FIG. 1B is a view showing a combination of two plate bodies of the first embodiment of the heat sink capillary structure according to the present invention. FIG. 1C is a perspective combination view showing a first embodiment of the capillary structure of the heat sink according to the present invention. 1D is a cross-sectional view taken along line A-A ′ of FIG. 1C. FIG. 2A is an exploded perspective view showing a second embodiment of the capillary structure of the heat sink according to the present invention. FIG. 2B is a diagram illustrating the deposition of the first capillary layer and the second capillary layer in the second embodiment of the capillary structure of the heat sink according to the present invention. FIG. 2C is a perspective combination view showing a second embodiment of the capillary structure of the heat sink according to the present invention. 2D is a cross-sectional view taken along line B-B ′ of FIG. 2C. FIG. 3 is an exploded perspective view showing a third embodiment of the capillary structure of the heat sink according to the present invention. FIG. 4 is an exploded perspective view showing a fourth embodiment of the heat sink capillary structure according to the present invention.

1A to 1D are an exploded perspective view showing a first embodiment of a heat sink capillary structure according to the present invention, a view showing a combination of two plate bodies, a perspective combination view, and a sectional view thereof, respectively.
As shown in FIGS. 1A to 1D, the capillary structure of the heat sink includes two plate bodies 100, a seal tube 110, at least one first capillary layer 210, and at least one second capillary layer 220. The heat source temperature is lowered, the amount of heat is efficiently conducted, and the temperature reduction efficiency is improved.

  The two plate main bodies 100 are coupled to each other and form a receiving space 101 between the two plate main bodies 100, and a concave groove 102 is formed in one of the two plate main bodies 100 in actual use. By providing the concave grooves 102 in both of the two plate main bodies 100, after the two plate main bodies 100 are coupled, a storage space 101 containing a working fluid is formed in a vacuum state. The bonding method of the two plate bodies 100 may be copper brazing or silver brazing, high temperature brazing, diffusion bounding, high temperature welding, or the like.

  The seal tube 110 (hollow tube) is provided on one side or any one corner of the two plate bodies 100, and one end of the seal tube 110 is communicated with the accommodation space 101. The working fluid is injected into the housing space 101 from the outside, and both phase changes of the working fluid are circulated between the first capillary layer 210 and the second capillary layer 220 in the two plate bodies 100 to lower the heat source temperature. And the effect of efficiently conducting heat and dissipating heat.

  Each first capillary layer 210 and each second capillary layer 220 are provided in the accommodation space 101, and the second capillary layer 220 and the first capillary layer 210 are deposited on each other, and the first capillary layer 210 and the second capillary layer 220 are The height of the first capillary layer 210 and the second capillary layer 220 is a metal rope (or the second capillary layer 220 is a powder (for example, a metal powder). The first capillary layer 210 is larger in thickness than the second capillary layer 220, and the number of meshes of the first capillary layer 210 is less than the number of meshes of the second capillary layer 220 (ie, The first capillary layer 210 is called the coarse capillary layer, and the second capillary layer 220 is called the fine capillary layer).

  In the present embodiment, two plate bodies 100, a first capillary layer 210, and a second capillary layer 220 are provided. A concave groove 102 is provided in one of the two plate main bodies 100, and the accommodation space 101 is formed after the two plate main bodies 100 are coupled to each other. The seal tube 11 is provided at one corner of the two plate bodies 100, one end of the seal tube 11 is communicated with the accommodation space 101, and the first capillary layer 210 and the second capillary layer 220 are in the accommodation space 101. The second capillary layer 220 is deposited below the first capillary layer 210, and the shapes of the first capillary layer 210 and the second capillary layer 220 correspond to the concave grooves 102 of the plate body 100, and the first capillary layer 210 is provided. The height after the second capillary layer 220 and the second capillary layer 220 are deposited is the same as that of the receiving space 101, so that the receiving space 101 is completely filled and its supportability is improved. Further, the working fluid (for example, water) is injected from the outside into the two plate main bodies 100 by the seal tube 110, and the heat source temperature is changed by circulating both phases of the working fluid and the capillary structure in the two plate main bodies 100. When the working fluid undergoes both phase changes (for example, water and water vapor), the working fluid in the vapor state (for example, water vapor) is moved upward by the first capillary layer 210. Diffusion to the plate body 100 improves the diffusion efficiency of the vapor, and distributes the working fluid in a liquid state (for example, water) uniformly to the lower plate body 100 by the second capillary layer 220, thereby making the working fluid uniform. Promote distribution and improve its temperature reduction efficiency.

(Second embodiment)
2A to 2D are an exploded perspective view, a volume diagram, a perspective combination diagram, and a cross-sectional view showing a second embodiment of the heat sink capillary structure according to the present invention, respectively.
As shown in FIGS. 2A to 2D, this embodiment is the same as the first embodiment, and the main difference is that the shape of the second capillary layer 220 corresponds to the concave groove 102 of the plate body 100, and the first embodiment The height after the capillary layer 210 and the second capillary layer 220 are deposited on each other is the same as that of the accommodating space 101, and the shape of the first capillary layer 210 is an arbitrary shape (for example, a T-shape). When the notch 211 is formed in the peripheral edge of the first capillary layer 210 and the second capillary layer 220 is deposited below the first capillary layer 210, the working fluid in a vapor state (for example, water vapor) quickly enters the notch 211. It is a point which passes through and improves the temperature lowering efficiency.

(Third embodiment)
FIG. 3 is an exploded perspective view showing a third embodiment of the capillary structure of the heat sink according to the present invention. As shown in FIG. 3, the present embodiment is the same as the first embodiment, the main difference being that the second capillary layer 220 is deposited on the first capillary layer 210 and below the first capillary layer 210, respectively. The shape of 220 corresponds to the concave groove 102 of the plate body 100, the shape of the first capillary layer 210 is an arbitrary shape (for example, a T shape), and a notch 211 is formed on the periphery of the first capillary layer 210. It is a point.

(5th Example)
FIG. 4 is an exploded perspective view showing a fourth embodiment of the heat sink capillary structure according to the present invention. As shown in FIG. 4, this embodiment is the same as the first embodiment, the main difference being that the shape of the first capillary layer 210 corresponds to the shape of the second capillary layer 220, that is, the first capillary. The shapes of the layer 210 and the second capillary layer 220 are all corresponding arbitrary shapes (for example, T-shape), the notches 211 are formed on the periphery of the first capillary layer 210, and the periphery of the second capillary layer 220 is formed. Also, a notch 221 is formed.

  In the capillary structure of the heat sink according to the present invention, the housing space 101 is formed so that the two plate bodies 100 correspond to each other, the first capillary layer 210 and the second capillary layer 220 are provided in the housing space 101, When the first capillary layer 210 and the second capillary layer 220 are deposited on each other and the working fluid in the accommodation space 101 undergoes both phase changes, the working fluid in a vapor state (for example, water vapor) is deposited on the first capillary layer 210. Passes quickly and improves the diffusion efficiency of the vapor, and the working fluid in a liquid state is uniformly diffused and flowed on the second capillary layer 220 to promote uniform distribution of the working fluid and improve its temperature lowering efficiency. It is characterized by that.

  The above description is merely a description of a preferred specific embodiment of the present invention, and is not intended to limit the scope of the present invention. Any person having ordinary skill in the art may However, it is needless to say that such implementation should be included in the present invention.

DESCRIPTION OF SYMBOLS 100 ... Plate body 101 ... Accommodating space 102 ... Concave groove 110 ... Seal tube 210 ... First capillary layer 211 ... Notch 220 ... 2nd capillary layer 2
221 ... Notch

Claims (10)

Two plate bodies that combine with each other to form an accommodation space;
At least one first capillary layer provided in the accommodation space;
A heat sink capillary structure including the first capillary layer and the at least one second capillary layer provided in the housing space and stacked on each other.   The heat sink capillary structure according to claim 1, wherein a thickness of the first capillary layer is greater than a thickness of the second capillary layer.   The heat dissipation according to claim 1 or 2, wherein the first capillary layer and the second capillary layer are metal ropes, and the number of meshes of the first capillary layer is smaller than the number of meshes of the second capillary layer. The capillary structure of the board.   The heat sink plate capillary structure according to claim 1, wherein the second capillary layer is deposited below the first capillary layer.   The heat sink plate capillary structure according to claim 1, wherein the second capillary layer is deposited above and below the first capillary layer.   The heat sink capillary structure according to claim 1, wherein a notch is formed in a peripheral edge of the first capillary layer.   The heat sink plate capillary structure according to claim 1, wherein a notch is formed in a peripheral edge of the second capillary layer.   The capillary structure of the heat sink according to claim 1, wherein a concave groove is provided in at least one of the two plate bodies.   2. The heat sink capillary structure according to claim 1, wherein a height after the first capillary layer and the second capillary layer are deposited on each other is the same as the accommodation space.   The heat sink capillary structure according to claim 1, wherein the second capillary layer is formed by sintering powder.

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