US20120031588A1

US20120031588A1 - Structure of heat plate

Info

Publication number: US20120031588A1
Application number: US12/805,540
Authority: US
Inventors: Yu-Po HUANG; Tung-Jung Kuo
Original assignee: Kunshan Jue Choung Electronics Co Ltd
Current assignee: Kunshan Jue-Choung Electronics Co Ltd; Kunshan Jue Choung Electronics Co Ltd
Priority date: 2010-08-05
Filing date: 2010-08-05
Publication date: 2012-02-09

Abstract

A structure of heat plate includes two boards, which mate and are coupled to each other to define therebetween an accommodation chamber and a plurality of capillary layers arranged in the accommodation chamber in such a way that the capillary layers are set on a common horizontal plane and the capillary layers form therebetween a plurality of passages. As such, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is improved, so that the efficiency of temperature reduction is improved.

Description

FIELD OF THE INVENTION

The present invention relates to a structure of heat plate, and in particular to a structure of heat plate applicable to an electronic device.

BACKGROUND OF THE INVENTION

An electronic device often generates a great amount of heat during a long term operation. A common solution for handling such a great amount of heat is installation of a heat plate that dissipates the heat. A heat plate is advantageous in respect of high heat conductivity, light weight, and simple construction and can carry out transfer of a large amount of heat without consuming electrical power.
A conventional heat plate structurally comprises a board, which has a hollow interior forming a chamber that receives and retains therein a capillary tissue and is filled with a working fluid. Mounted to one side of the board is a sealing tube (or referred to an opening sealing tube, a degassing tube, or a filling and degassing tube), which has an end mounted to the board and communicating the hollow interior chamber, so that the working fluid can be filled from the outside into the interior (namely the chamber) of the board through the sealing tube and degassing and air evacuation operations can also be performed through the sealing tube in order to realize the destination function of removal of heat from an electronic device.
Thus, the present invention aims to provide a structure of heat plate that helps increasing the efficiency of reduction of temperature in order to extend the lifespan of an electronic device.

SUMMARY OF THE INVENTION

A primary objective of the present invention is to provide a structure of heat plate that improves temperature reduction efficiency of the heat plate.
To realize the above objectives, the present invention provides a structure of heat plate that comprises two boards, which mate and are coupled to each other to define therebetween an accommodation chamber, and a plurality of first capillary layers, which is arranged in the accommodation chamber in such a way that the first capillary layers are set on a common horizontal plane and the first capillary layers form therebetween a plurality of passages. As such, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is improved, so that the efficiency of temperature reduction is improved to thereby offer practicability, novelty, improvement, and convenience.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be apparent to those skilled in the art by reading the following description of preferred embodiments thereof with reference to the drawings, in which:

FIG. 1A is an exploded view of a structure of heat plate according to a first embodiment of the present invention;

FIG. 1B is a perspective view of the heat plate according to the first embodiment of the present invention in an assembled form;

FIG. 2 is an exploded view of a structure of heat plate according to a second embodiment of the present invention;

FIG. 3 is an exploded view of a structure of heat plate according to a third embodiment of the present invention;

FIG. 4 is an exploded view of a structure of heat plate according to a fourth embodiment of the present invention;

FIG. 5A is an exploded view of a structure of heat plate according to a fifth embodiment of the present invention;

FIG. 5B is a perspective view of the heat plate according to the fifth embodiment of the present invention in an assembled form;

FIG. 5C is a cross-sectional view taken along line A-A′ of FIG. 5B; and

FIG. 5D is a cross-sectional view taken along line B-B′ of FIG. 5B.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

With reference to the drawings and in particular to FIGS. 1A-3, which respectively show an exploded view and an assembled perspective view of a structure of heat plate according to a first embodiment of the present invention and exploded views of structures of heat plate according to second and third embodiments of the present invention, the heat plate constructed in accordance with the present invention comprises two boards 100, a sealing tube 110, and a plurality of first capillary layers 210, and is provided for installation on an electronic device to realize functions of lowering temperature of a heat source, performing effective heat transfer, and improving temperature reduction efficiency.
The two boards 100 are mated and coupled to each other so that the two boards 100 defined an accommodation chamber 101 therebetween. In a practical arrangement, one of the two boards 100 can be structured to form a recess 102, or alternatively, both boards 100 are structured to form corresponding recesses 102, so that when the two boards 100 are coupled to each other, an accommodation chamber 101 that is in a vacuum condition and receives a working fluid therein is formed. The two boards 100 can be coupled in various ways, such as being jointed with copper paste or silver paste through blazing, diffusion bounding, or welding.
The sealing tube 110, which is a hollow tubular body, is mounted to any side or any corner of the two coupled boards 100. The sealing tube 110 has an end communicating the accommodation chamber 101 to allow the working fluid to be filled from the outside through the sealing tube 110 into the accommodation chamber 101, whereby through changes between two phases of the working fluid and circulation of the working fluid conducted by the capillary structure arranged between the two boards 100, the functions of lowering temperature of heat source and performing effective heat transfer and dissipation can be realized.
The first capillary layers 210 are arranged in the accommodation chamber 101. Preferably, the first capillary layers 210 are set on a common horizontal plane in such a way to form a plurality of passages 211 between the first capillary layers 210. The passages 211 between the first capillary layers 210 can be arranged parallel to each other (see FIG. 1), or perpendicular to each other (see FIG. 2), or in a radial pattern (see FIG. 3). In other words, the passages 211 between the first capillary layers 210 can be arranged in arbitrary directions. The first capillary layers 210 can be metal net or an object formed of sintered powders (such as metal powders). The first capillary layers 210 are of a thickness that is substantially identical to a depth of the accommodation chamber 101, so that the capillary layers can be snugly, or even tightly, received in the accommodation chamber 101 to improve structural stability for positioning and supporting the capillary layers.
As shown in FIG. 1, in the instant embodiment, two boards 100 and a plurality of first capillary layers 210 are included, wherein one of the two boards 100 forms a recess 102 so that the two boards 100, when mating and coupled to each other, form an accommodation chamber 101 therebetween, and a sealing tube 110 is mounted to a corner of the two coupled boards 100 and has an end communicating the accommodation chamber 101. The first capillary layers 210 are received in the accommodation chamber 101 and the first capillary layers 210 form therebetween a plurality of passages 211, which is arranged parallel to each other. Through the sealing tube 110, a working fluid (such as water) is filled into the chamber between the two boards 100, whereby through changes between two phases, the working fluid is circulated through the first capillary layers 210 arranged between the two boards 100, and the functions of lowering temperature of heat source and performing effective heat transfer can be realized. Meanwhile, when the working fluid undergoes changes between two phases (such as liquid water and vapor), the passages 211 serve as passageways for the vapor to allow the vapor phase of the working fluid (such as water vapor) to be quickly diffused to the upper board 100, thereby improving vapor diffusion efficiency, and, on the other hand, the liquid phase of the working fluid (such as water) is caused by the first capillary layers 210 to uniformly distribute over the lower board 100 to improve uniformity of distribution of the working fluid, thereby improving temperature reduction efficiency.
Referring to FIG. 4, an exploded view of a structure of heat plate according to a fourth embodiment of the present invention is shown. The fourth embodiment is substantially similar to the first embodiment with a major difference residing in that the heat plate of the fourth embodiment further comprises a plurality of second capillary layers 220, which form therebetween a plurality of passages 221. The first capillary layers 210 are metal nets, and the second capillary layers 220 can be metal nets (or objects formed of sintered powders (such as metal powders)). The second capillary layers 220 and the first capillary layers 210 are stacked over each other. In other words, the second capillary layers 220 are stacked on or under the first capillary layers 210. In the instant embodiment, the second capillary layers 220 are stacked under the first capillary layers 210 and the passages 221 between the second capillary layers 220 and the passages 211 between the first capillary layers 210 are set to correspond to each other or alternate or intersect each other. Further, the first capillary layers 210 has a thickness that is greater than a thickness of the second capillary layers 220 (namely, the first capillary layers 210 can be “coarse” capillary layers, while the second capillary layers 220 are “fine” capillary layers). The first capillary layers 210, which are metal nets, are of a mesh that is different from mesh of the second capillary layers 220.
Referring to FIGS. 5A-5D, which respectively show an exploded view, an assembled perspective view, and two cross-sectional views of a structure of heat plate according to a fifth embodiment of the present invention, the fifth embodiment is substantially similar to the fourth embodiment with a major difference residing in that besides being stacked on a first surface (such as top or bottom) of the first capillary layers 210, the second capillary layers 220 are also stacked on the opposite surface of the first capillary layers 210. In the instant embodiment, the second capillary layers 220 stacked on the top surface of the first capillary layers 210 form therebetween a plurality of passages 221, but those stacked under the bottom of the first capillary layers 210 do not. The overall height of the stacked first and second capillary layers 210, 220 is substantially identical to a depth of the accommodation chamber 101, so that the capillary layers can be snugly, or even tightly, received in the accommodation chamber 101 to improve structural stability for positioning and supporting the capillary layers, as shown in FIGS. 5C and 5D, wherein FIG. 5C is a view taken along a cross-section of the heat plate passing through the first capillary layers 210 and the second capillary layers 220 and FIG. 5D is a view taken along a cross-section extending through the passages 221 of the top second capillary layers 220, the passages 211 of the first capillary layers 210, and the bottom second capillary layers 220.
The present invention provides a structure of heat plate of which the features are that two boards 100 mate and are coupled to each other to form an internal accommodation chamber 101 and a plurality of first capillary layers 210 is received in the accommodation chamber 101 in such a way that the first capillary layers 210 form therebetween a plurality of passages 211, whereby when a working fluid contained in the accommodation chamber 101 undergoes phase change, the passages 211 serve as passageways for vapor or gaseous phase of the working fluid to allow the vapor of the working fluid (such as water vapor) to be quickly diffused to the upper board 100, thereby improving vapor diffusion efficiency, and, on the other hand, the liquid phase of the working fluid (such as water) is caused by the first capillary layers 210 to uniformly distribute over the lower board 100 to improve uniformity of distribution of the working fluid, thereby improving temperature reduction efficiency.
Although the present invention has been described with reference to the preferred embodiments thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.

Claims

1. A heat plate, comprising:

two boards, which are coupled to each other to form an accommodation chamber therebetween; and

a plurality of first capillary layers, which is arranged in the accommodation chamber, the first capillary layers being set on a common horizontal plane, the first capillary layers forming a plurality of passages therebetween.

2. The heat plate as claimed in claim 1, wherein the passages between the first capillary layers are arranged substantially parallel to each other.

3. The heat plate as claimed in claim 1, wherein the passages between the first capillary layers are arranged substantially perpendicular to each other.

4. The heat plate as claimed in claim 1, wherein the passages between the first capillary layers are arranged in a radial pattern.

5. The heat plate as claimed in claim 1, wherein the first capillary layers comprise metal nets.

6. The heat plate as claimed in claim 1, wherein the first capillary layers are formed of sintered powders.

7. The heat plate as claimed in claim 1, wherein the first capillary layers have a thickness that is substantially identical to a depth of the accommodation chamber.

8. The heat plate as claimed in claim 1 further comprising a plurality of second capillary layers, which is set on a common horizontal plane, the second capillary layers and the first capillary layers being stacked over each other.

9. The heat plate as claimed in claim 8, wherein the second capillary layers form a plurality of passages therebetween.

10. The heat plate as claimed in claim 8, wherein the second capillary layers comprise metal nets.

11. The heat plate as claimed in claim 8, wherein the second capillary layers are formed of sintered powders.

12. The heat plate as claimed in claim 8, wherein the stacked first and second capillary layers have a thickness that is substantially identical to a depth of the accommodation chamber.