JP2011112330A5 - - Google Patents

Download PDF

Info

Publication number
JP2011112330A5
JP2011112330A5 JP2009271445A JP2009271445A JP2011112330A5 JP 2011112330 A5 JP2011112330 A5 JP 2011112330A5 JP 2009271445 A JP2009271445 A JP 2009271445A JP 2009271445 A JP2009271445 A JP 2009271445A JP 2011112330 A5 JP2011112330 A5 JP 2011112330A5
Authority
JP
Japan
Prior art keywords
wick
layer
heat
sealed container
wick layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009271445A
Other languages
Japanese (ja)
Other versions
JP5568289B2 (en
JP2011112330A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2009271445A priority Critical patent/JP5568289B2/en
Priority claimed from JP2009271445A external-priority patent/JP5568289B2/en
Priority to US12/951,357 priority patent/US20110127013A1/en
Priority to CN2010105604052A priority patent/CN102080939A/en
Publication of JP2011112330A publication Critical patent/JP2011112330A/en
Publication of JP2011112330A5 publication Critical patent/JP2011112330A5/ja
Application granted granted Critical
Publication of JP5568289B2 publication Critical patent/JP5568289B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

上記の従来技術の課題を解決するため、本発明の一形態によれば、金属製の密閉容器の内壁に形成されたウイック層を備え、前記密閉容器の内部に作動流体を封入してなる放熱部品であって、前記ウイック層は、銅粉末を焼結してなる第1のウイックと、カーボンナノチューブ又はカーボンナノファイバが混入された銅めっき層からなり、前記第1のウイック内の空隙を部分的に充填するとともに前記第1のウイックの表層部分を覆うように形成された第2のウイックとが複合された構造からなることを特徴とする放熱部品が提供される。   In order to solve the above-described problems of the prior art, according to one aspect of the present invention, the heat dissipation is provided by including a wick layer formed on the inner wall of a metal hermetic container and enclosing a working fluid inside the hermetic container. The wick layer is composed of a first wick obtained by sintering copper powder and a copper plating layer mixed with carbon nanotubes or carbon nanofibers, and the voids in the first wick are partially formed. In addition, a heat dissipating component is provided which has a structure in which the second wick formed so as to cover and cover the surface layer portion of the first wick is combined.

また、本発明の他の形態によれば、金属製の密閉容器の内壁に形成されたウイック層を備え、前記密閉容器の内部に作動流体を封入してなる放熱部品を製造する方法において、
前記ウイック層を形成する工程が、前記密閉容器として所要の形状に成形される前の状態にある金属板の一方の面に、銅粉末を堆積させ焼結して第1のウイックを形成する工程と、カーボンナノチューブ又はカーボンナノファイバを分散させためっき液を用いて、前記第1のウイック内の空隙を部分的に充填するとともに前記第1のウイックの表層部分を覆うように第2のウイックを形成する工程とを含むことを特徴とする放熱部品の製造方法が提供される。
According to another aspect of the present invention, in the method of manufacturing a heat dissipation component comprising a wick layer formed on the inner wall of a metal sealed container, and enclosing a working fluid inside the sealed container,
The step of forming the wick layer is a step of forming a first wick by depositing and sintering copper powder on one surface of the metal plate in a state before being formed into a required shape as the sealed container. And using a plating solution in which carbon nanotubes or carbon nanofibers are dispersed, the gap in the first wick is partially filled and the second wick is covered so as to cover the surface layer portion of the first wick. The manufacturing method of the thermal radiation component characterized by including the process of forming is provided.

Claims (6)

金属製の密閉容器の内壁に形成されたウイック層を備え、前記密閉容器の内部に作動流体を封入してなる放熱部品であって、
前記ウイック層は、
銅粉末を焼結してなる第1のウイックと、
カーボンナノチューブ又はカーボンナノファイバが混入された銅めっき層からなり、前記第1のウイック内の空隙を部分的に充填するとともに前記第1のウイックの表層部分を覆うように形成された第2のウイックとが、
複合された構造からなることを特徴とする放熱部品。
A heat dissipating component comprising a wick layer formed on the inner wall of a metal hermetic container and enclosing a working fluid inside the hermetic container,
The wick layer is
A first wick obtained by sintering copper powder;
A second wick made of a copper plating layer mixed with carbon nanotubes or carbon nanofibers, partially filling the voids in the first wick and covering the surface portion of the first wick And
A heat dissipating part characterized by comprising a composite structure.
金属製の密閉容器の内壁に形成されたウイック層を備え、前記密閉容器の内部に作動流体を封入してなる放熱部品であって、
前記ウイック層は、カーボンナノチューブ又はカーボンナノファイバが混入された銅粉末を焼結してなる焼結ウイック層であることを特徴とする放熱部品。
A heat dissipating component comprising a wick layer formed on the inner wall of a metal hermetic container and enclosing a working fluid inside the hermetic container,
The wick layer is a sintered wick layer obtained by sintering a copper powder mixed with carbon nanotubes or carbon nanofibers.
前記ウイック層は、少なくとも、前記密閉容器の内壁上の、前記放熱部品が外部との間で熱交換を行う部分に対応する箇所に形成されていることを特徴とする請求項1又は2に記載の放熱部品。   The said wick layer is formed in the location corresponding to the part on the inner wall of the said airtight container corresponding to the part in which the said heat radiating component exchanges heat with the exterior. Heat dissipation parts. 金属製の密閉容器の内壁に形成されたウイック層を備え、前記密閉容器の内部に作動流体を封入してなる放熱部品を製造する方法において、
前記ウイック層を形成する工程が、前記密閉容器として所要の形状に成形される前の状態にある金属板の一方の面に、銅粉末を堆積させ焼結して第1のウイックを形成する工程と、カーボンナノチューブ又はカーボンナノファイバを分散させためっき液を用いて、前記第1のウイック内の空隙を部分的に充填するとともに前記第1のウイックの表層部分を覆うように第2のウイックを形成する工程とを含むことを特徴とする放熱部品の製造方法。
In a method of manufacturing a heat dissipating component comprising a wick layer formed on the inner wall of a metal sealed container and enclosing a working fluid inside the sealed container,
The step of forming the wick layer is a step of forming a first wick by depositing and sintering copper powder on one surface of the metal plate in a state before being formed into a required shape as the sealed container. And using a plating solution in which carbon nanotubes or carbon nanofibers are dispersed, the gap in the first wick is partially filled and the second wick is covered so as to cover the surface layer portion of the first wick. And a process for forming the heat dissipation component.
金属製の密閉容器の内壁に形成されたウイック層を備え、前記密閉容器の内部に作動流体を封入してなる放熱部品を製造する方法において、
前記ウイック層を形成する工程が、前記密閉容器として所要の形状に成形される前の状態にある金属板の一方の面に、ドライプロセスを用いて、銅粉末とカーボンナノチューブ又はカーボンナノファイバの混合体を密着させ焼結して焼結ウイック層を形成する工程を含むことを特徴とする放熱部品の製造方法。
In a method of manufacturing a heat dissipating component comprising a wick layer formed on the inner wall of a metal sealed container and enclosing a working fluid inside the sealed container,
The process of forming the wick layer is a mixture of copper powder and carbon nanotubes or carbon nanofibers on one side of the metal plate in a state before being formed into a required shape as the sealed container using a dry process. A method of manufacturing a heat-radiating component, comprising a step of forming a sintered wick layer by closely bonding a body.
前記ドライプロセスは、高速ガス混合法により銅粉末とカーボンナノチューブ又はカーボンナノファイバを均一に混合する処理と、銅パルス通電焼結を用いて、当該混合体を前記金属板の一方の面に押し当てながら密着させて焼結する処理を含むことを特徴とする請求項5に記載の放熱部品の製造方法。   In the dry process, copper powder and carbon nanotubes or carbon nanofibers are uniformly mixed by a high-speed gas mixing method, and copper pulse electric current sintering is used to press the mixture against one surface of the metal plate. The method of manufacturing a heat-radiating component according to claim 5, further comprising a process of sintering while closely contacting.
JP2009271445A 2009-11-30 2009-11-30 Heat dissipation component and manufacturing method thereof Active JP5568289B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009271445A JP5568289B2 (en) 2009-11-30 2009-11-30 Heat dissipation component and manufacturing method thereof
US12/951,357 US20110127013A1 (en) 2009-11-30 2010-11-22 Heat-radiating component and method of manufacturing the same
CN2010105604052A CN102080939A (en) 2009-11-30 2010-11-23 Heat-radiating component and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009271445A JP5568289B2 (en) 2009-11-30 2009-11-30 Heat dissipation component and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2011112330A JP2011112330A (en) 2011-06-09
JP2011112330A5 true JP2011112330A5 (en) 2012-09-20
JP5568289B2 JP5568289B2 (en) 2014-08-06

Family

ID=44067957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009271445A Active JP5568289B2 (en) 2009-11-30 2009-11-30 Heat dissipation component and manufacturing method thereof

Country Status (3)

Country Link
US (1) US20110127013A1 (en)
JP (1) JP5568289B2 (en)
CN (1) CN102080939A (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4881352B2 (en) * 2008-08-11 2012-02-22 ソニー株式会社 HEAT SPREADER, ELECTRONIC DEVICE, AND HEAT SPREADER MANUFACTURING METHOD
JP5902404B2 (en) * 2011-06-10 2016-04-13 株式会社フジクラ Flat heat pipe and method of manufacturing the same
US9170058B2 (en) * 2012-02-22 2015-10-27 Asia Vital Components Co., Ltd. Heat pipe heat dissipation structure
JP6477254B2 (en) 2014-05-30 2019-03-06 三菱マテリアル株式会社 Porous aluminum composite and method for producing porous aluminum composite
JP6237500B2 (en) * 2014-07-02 2017-11-29 三菱マテリアル株式会社 Porous aluminum heat exchange member
US20160010927A1 (en) * 2014-07-14 2016-01-14 Fujikura Ltd. Heat transport device
US10578293B2 (en) 2014-07-22 2020-03-03 Signify Holding B.V. Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling or a light source assembly
WO2016030956A1 (en) * 2014-08-26 2016-03-03 千住スプリンクラー株式会社 Sprinkler head
CN104195619A (en) * 2014-09-17 2014-12-10 朱忠良 Composite electroplating solution and electroplating method through composite electroplating solution
CN105091648A (en) * 2015-08-31 2015-11-25 华南理工大学 Groove and microstructure composite liquid absorption core and manufacturing method thereof
CN105928403B (en) * 2016-04-28 2017-09-29 安徽工业大学 A kind of compound porous capillary wick of powder microfibre applied to loop circuit heat pipe system
KR101755572B1 (en) * 2016-07-19 2017-07-19 천만식 Heat radiation sheet, the manufacturing method thereof and the driving method thereof
US20180170553A1 (en) * 2016-12-20 2018-06-21 Qualcomm Incorporated Systems, methods, and apparatus for passive cooling of uavs
WO2018198375A1 (en) * 2017-04-28 2018-11-01 株式会社村田製作所 Vapor chamber
KR102158614B1 (en) * 2017-07-03 2020-09-22 천만식 Heat radiation sheet, the manufacturing method thereof and the driving method thereof
CN107557825B (en) * 2017-07-21 2019-11-05 林进东 The copper powder coat of metal, metal substrate, energy-saving prevention are swollen quick-fried radiator and its preparation process
CN107462097B (en) * 2017-09-22 2022-07-05 安徽工业大学 Variable-aperture capillary core applied to loop heat pipe system and processing method thereof
JP2019163895A (en) * 2018-03-19 2019-09-26 ポーライト株式会社 Manufacturing method of wick
US11051431B2 (en) 2018-06-29 2021-06-29 Juniper Networks, Inc. Thermal management with variable conductance heat pipe
CN109524362A (en) * 2018-11-22 2019-03-26 广东工业大学 A kind of three-dimensional manometer carbon composite metal die bond material and its preparation method and application, semiconductor package
CN110010569B (en) * 2019-05-06 2023-11-21 扬州大学 Gradient-scale pore sintering core soaking plate heat exchanger and preparation method thereof
TWI692611B (en) * 2019-06-28 2020-05-01 新加坡商 J&J 資本控股有限公司 Heat conducting structure, manufacturing method thereof, and mobile device
TWI692920B (en) * 2019-06-28 2020-05-01 新加坡商 J&J 資本控股有限公司 Heat conducting structure, manufacturing method thereof, and mobile device
KR102125213B1 (en) * 2019-10-29 2020-07-07 이재석 Food Waste Disposal Apparatus
TWI731578B (en) * 2020-02-10 2021-06-21 優材科技有限公司 Heat conducting device and electronic device
CN113260216A (en) * 2020-02-10 2021-08-13 优材科技有限公司 Heat conduction device and electronic device

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137630A (en) * 1975-05-24 1976-11-27 Inoue Japax Res Production method for heat exchanger components
JPH0498093A (en) * 1990-08-14 1992-03-30 Furukawa Electric Co Ltd:The Electric insulation type heat pipe
JPH0790534A (en) * 1993-07-19 1995-04-04 Mitsubishi Materials Corp Corrosion resisting member for sulfuric acid dew point corrosion
JP3408033B2 (en) * 1995-10-12 2003-05-19 古河電気工業株式会社 heat pipe
JP4572287B2 (en) * 2001-03-23 2010-11-04 独立行政法人産業技術総合研究所 Method for producing high strength porous body and high strength porous body
JP4870282B2 (en) * 2001-07-05 2012-02-08 オムロン株式会社 Transaction processing system, transaction processing apparatus, and transaction processing method
KR20030065686A (en) * 2002-01-30 2003-08-09 삼성전기주식회사 Heat pipe and method thereof
JP4157468B2 (en) * 2003-12-12 2008-10-01 日立電線株式会社 Wiring board
EP1706699B1 (en) * 2003-12-22 2011-02-09 Entegris, Inc. Exchange device with potted hollow conduits and methods of application
CN100370207C (en) * 2004-02-20 2008-02-20 鸿富锦精密工业(深圳)有限公司 Heat pipe and its preparation method
US20060243426A1 (en) * 2004-04-21 2006-11-02 Hul-Chun Hsu Wick Structure of Heat Pipe
CN1705043B (en) * 2004-05-26 2010-06-23 财团法人工业技术研究院 Method for improving flowing property of working fluid inside liquid-vapor phase heat sink
JP4636816B2 (en) * 2004-06-03 2011-02-23 新光電気工業株式会社 Cemented carbide and method for producing the same
CN100413061C (en) * 2004-06-07 2008-08-20 鸿富锦精密工业(深圳)有限公司 Thermal tube and producing method thereof
US7032652B2 (en) * 2004-07-06 2006-04-25 Augux Co., Ltd. Structure of heat conductive plate
CN100413063C (en) * 2004-07-21 2008-08-20 鸿富锦精密工业(深圳)有限公司 Heat pipe and manufacturing method thereof
CN100453955C (en) * 2005-01-07 2009-01-21 鸿富锦精密工业(深圳)有限公司 Heat pipe and manufacturing method thereof
US20060197245A1 (en) * 2005-01-14 2006-09-07 Ching-Tai Cheng Method of manufacturing heat pipe having sintered powder wick
US20060175044A1 (en) * 2005-02-10 2006-08-10 Chin-Wei Lee Heat dissipating tube sintered with copper powders
JP2006315893A (en) * 2005-05-11 2006-11-24 Sumitomo Precision Prod Co Ltd Method for producing carbon nanotube-dispersed composite material
JP2007017115A (en) * 2005-07-11 2007-01-25 ▲玉▼成化工有限公司 Heat pipe
JP2007056302A (en) * 2005-08-24 2007-03-08 Fujikura Ltd Method for producing sintered wick layer of heat pipe
CN100554852C (en) * 2005-09-23 2009-10-28 鸿富锦精密工业(深圳)有限公司 Heat pipe and heat radiation module
CN1955628A (en) * 2005-10-24 2007-05-02 富准精密工业(深圳)有限公司 Heat pipe
WO2009075320A1 (en) * 2007-12-11 2009-06-18 Sumitomo Electric Industries, Ltd. Cooling device and method for manufacture thereof
JP4653187B2 (en) * 2008-01-31 2011-03-16 古河電気工業株式会社 Thin heat pipe and manufacturing method thereof
CN101556122B (en) * 2008-04-10 2011-05-04 台达电子工业股份有限公司 Heat dissipating device and heat transferring element thereof

Similar Documents

Publication Publication Date Title
JP2011112330A5 (en)
CN104610706B (en) A kind of bitter earth nano crystalline substance coated graphite alkene-epoxy resin composite material and preparation method thereof
CN104754913A (en) Heat-conductive composite material sheet and preparation method thereof
CN103594434B (en) power component with composite radiating layer
JP6580385B2 (en) Composite of aluminum and carbon particles and method for producing the same
JP2012243750A (en) Ceramic heating element manufacturing method
JP2012505299A5 (en)
KR101191806B1 (en) Heat-dissipating substrate and fabricating method of the same
CN101995182A (en) Uniform temperature plate and manufacturing method thereof
CN102400006A (en) Foamy carbon/copper matrix or aluminum matrix composite material and preparation method thereof
CN102586703A (en) Method for preparing graphite whisker reinforced aluminum matrix composite material
CN102412352A (en) High-power LED (light-emitting diode) light source packaging structure manufactured by graphene and production process thereof
JP5112374B2 (en) Heat dissipating device for electronic equipment and manufacturing method thereof
TW201104201A (en) Heat dissipation device and manufacturing method thereof
TWM296340U (en) Embedded lamp
CN103822513A (en) Antigravity heat pipe and manufacturing method thereof
TW201403016A (en) Heat pipe
CN202405254U (en) High power LED light source packaging structure made of graphene
KR20170050951A (en) Porous metal based heat radiating material and method for producing the same
JP6108533B2 (en) High thermal conductive plate
CN206516569U (en) The vacuum casting of HVDC relay
TWI640495B (en) Composite component, use and manufacturing method of the same
CN210328364U (en) Heat-dissipating copper foil
CN207083125U (en) A kind of heat sinking housing
CN207011175U (en) A kind of automobile power source conductive structure