201144739 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種熱板結構，特別是指一種可應用於電子產品之熱 板結構。 【先前技術】 目前，一般電子產品容易因長時間使用而產生熱量，其解決方式大多 係為加裝熱板進行散熱，該熱板具有高熱傳導率、重量輕、結構簡單等特 φ 性，且兼具有可傳遞大量熱量而不消耗電力之優點。 %知之熱板結構主要係包括板體，該板體之内部形成有真空容腔，並 該真空容腔設有毛細組織及填充有工作流體，且於該板體之一側連接有一 封管（又可稱為封口管、除氣管或填充除氣管），藉由該封管之一端與該板 體連接並與内部之真空容腔相互連通，藉由該封管可由外界對該熱板之内 部（即真空容腔)注入工作流體，並進行除氣及真空作業，並藉而將電子產 品使用中產生之熱量疏散。 鲁 本發明人乃和研思、設計_，舰提供—種可提高降溫效率之熱 板結構，藉峨長產品側壽命，為本侧所欲·之個動機者。 【發明内容】 本發明之主要目的，在提供—種熱板結構，可提高熱板降溫效率。 為達上述目的，本發明之熱板結構係包括：二板體，該二板體係彼此 2互結合形成一容置空間：以及複數第一毛細層係設於該容置空間中，該 、層位於同水平面上，且該些第一毛細層之間形成有複數通 道。猎此，使其可增加蒸氣擴散效率、促進工作流體均句分佈，進而提高 ' 1 201144739 其降溫效率，確具有實用性、新賴性、進步性和便利性。 為了能夠更進一步瞭解本發明之特 付做、特點和技術内容，請參閱以下 有關本發明之詳細說明與附圖，惟所 咐圖式僅提供參考與說明用，非用以 限制本發明。 【實施方式】 請參閱第1A至3圖所示，為本發明备 令赞月之熱板結構第一實施例之立體分解 示意圖、其板體結合示意圖及第二至二 —實施例之立體分解示意圖。該熱板 結構係包括二板體1〇〇、封管11〇、箱叔 復數第一毛細層210，以供可設置於電 子產品上’侧降低麟溫度、有輯熱量進行料以及提聽溫效率之 功效》 該-板體100係相互對應結合，並於該二板體1〇〇之間形成有一容置 空間101 ’於實際使用時’可於二板體⑽中的其中一板體謂設有一凹 槽102或疋於一板體too皆設有凹槽1〇2，使該二板體議結合後可形成 -呈真空狀態且具有工作流體之容置朗m，其中，該二板體之結 口方式可採用銅膏或銀膏南溫硬焊接合⑻犯⑽、擴散焊接(赌usi〇n bounding)、高溫熔接(weiding)等。 該封管110(為-中空管體)係設置於該二板體1〇〇之任一側邊或任一側 角，且該封管11〇之一端係與該容置空間1〇1相連通，以藉由該封管ιι〇 可由外界對絲置空間1〇1進行注人工作流體，並糊卫作流體的兩相變 化及該二板體1GG内之毛細結構賴環，使達到降低熱源溫度及有效對熱 量進行傳導疏散之功效。 該些第一毛細層210係設於該容置空間101中，該些第一毛細層21〇201144739 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a hot plate structure, and more particularly to a hot plate structure that can be applied to an electronic product. [Prior Art] At present, general electronic products are prone to generate heat due to long-term use, and most of the solutions are to add heat to heat, which has high thermal conductivity, light weight, simple structure, and the like. It also has the advantage of being able to transfer a large amount of heat without consuming power. The structure of the hot plate mainly comprises a plate body, a vacuum cavity is formed inside the plate body, and the vacuum cavity is provided with capillary structure and filled with a working fluid, and a tube is connected to one side of the plate body ( Also referred to as a sealing tube, a degassing tube or a filling degassing tube, one end of the sealing tube is connected to the plate body and communicates with the inner vacuum chamber, and the sealing tube can be externally connected to the inside of the hot plate (ie, the vacuum chamber) injects the working fluid, performs degassing and vacuuming operations, and thereby dissipates the heat generated by the use of the electronic product. Lu Ben inventor and research, design _, the ship provides a kind of hot plate structure that can improve the cooling efficiency, by the long product side life, is a motive for the side. SUMMARY OF THE INVENTION The main object of the present invention is to provide a hot plate structure that can improve the cooling efficiency of the hot plate. In order to achieve the above object, the hot plate structure of the present invention comprises: a two-plate system, wherein the two plate systems are combined with each other to form an accommodating space: and a plurality of first capillary layers are disposed in the accommodating space, the layer Located on the same horizontal plane, and a plurality of channels are formed between the first capillary layers. Hunting this, it can increase the vapor diffusion efficiency, promote the distribution of the working fluid, and improve the cooling efficiency of '1 201144739, which is practical, new, progressive and convenient. The detailed description and drawings of the present invention are to be understood by the claims [Embodiment] Please refer to FIGS. 1A to 3, which are schematic exploded perspective views of a first embodiment of a hot plate structure of the present invention, a schematic diagram of the combination of the plates, and a three-dimensional decomposition of the second to second embodiments. schematic diagram. The hot plate structure comprises a two-plate body 1〇〇, a sealing tube 11〇, and a box-uncomplex first capillary layer 210, which can be disposed on the electronic product to reduce the temperature of the lining, to heat the material, and to listen to the temperature. Efficacy of efficiency: The plate body 100 is coupled to each other, and an accommodation space 101 ' is formed between the two plates 1 'in actual use', and one of the plates in the second plate body (10) is said to be A groove 102 or a plate body too is provided with a groove 1〇2, so that the two plates can be combined to form a vacuum state and have a working fluid tolerance m, wherein the two plates The junction of the body can be made of copper paste or silver paste, south temperature hard solder joint (8) (10), diffusion welding (gambling usi〇n bounding), high temperature welding (weiding). The sealing tube 110 (which is a hollow tube body) is disposed on either side or any side angle of the two-plate body 1〇〇, and one end of the sealing tube 11〇 is connected to the accommodating space 1〇1 Connected to each other, so that the sealing fluid can be injected into the wire space 1〇1 by the outside, and the two-phase change of the fluid and the capillary structure of the two plates 1GG can be achieved. Reduce the heat source temperature and effectively conduct heat dissipation. The first capillary layer 210 is disposed in the accommodating space 101, and the first capillary layers 21〇
I I201144739 為同一水平面排列設置，且該些第一毛細層210之間形成有複數通道211， 其中，該些第一毛細層間210之通道211可為以平行排列（如第i圖所示）、 垂直排列（如第2圖所示）或以放射狀排列（如第3圖所示），亦即，該些第 一毛細層間210之通道211可以任意方向排列，而該些第一毛細層21〇可 為金屬網或由粉末（如金屬粉末）燒結而形成。又該些第一毛細層21〇之 南度與該容置空間相等，使其可完整填充於該容置空間，增加其支 撐性。 如第1圖所示，於本實施例中，主要係提供二板體1〇〇及複數第一毛 細層210’該二板體100的其中一板體100設有一凹槽1〇2，使該二板體1〇〇 相互對應結錢可形成有—容置如1G1，雌管110職置於該二板體 1〇〇之一側角，且該封管110之一端係與該容置空間1〇1相連通，而該些第 一毛細層210設於該容置空間1〇1中，並於該些第一毛細層21〇之間形成 有複數通道211 ’且該些通道211以平行排列，以藉由該封管⑽可由外界 對該二板體100内進行注入工作流體(如水），進而利用工作流體的兩相變 化於該二板體1G()之第一毛細層21G循環，使其降低熱源溫度及有效對熱 量進行傳導，同時，當虹佩體進行軸變化(如水、錢時，可藉 由該些通道211作為統通道’使蒸氣態之功流體(如水蒸氣)可快速擴 散至上方之板體⑽，增加錢氣擴散效率，而液態狀之讀流體(如水) 可藉由該些第-毛細層21〇均勻分佈於下方之板體.藉以促進工作流體 均勻分佈，進而提高其降溫效率。 另請參閱4圖所示，係為本發明之熱板結構第四實施例之立體分解示 意圖。其中，本實施例與第—實施例姻，其主要差職在於進—步包括 201144739 ,, 有複數第二毛細層220，該些第二毛細層220之間形成有複數通道221，該 些第一毛細層210為金屬網，而該些第二毛細層220可為金屬網（或由粉束 (如金屬粉末）燒結而形成）’且該些第二毛細層220與該些第一毛細層21〇 相互堆疊，亦即，該些第二毛細層220堆疊於該些第一毛細層21〇上方或 下方，本實施例中，該些第二毛細層220堆疊於該些第一毛細層21〇下方， 而該些第一毛細層220間之通道221與該些第一毛細層21〇間之通道211 可相互對應或交錯。再者，該些第一毛細層210之厚度為大於該些第二毛 細層220之厚度（亦即，該第一毛細層210可稱為粗毛細層，該第二毛細層 220則稱為細毛細層），而該第一毛細層21〇之網目數可不同於該第二毛細 層220之網目數。 再請參閱5A至5D圖所示’係為本發明之熱板結構第五實施例之立體 分解示意圖、其立體組合示意以及其剖面示意圖β其中，本實施例與第四 實施例相同，其主要差別係在於該些第二毛細層咖除僅堆叠於該些第一 毛細層210上方或下方之外，亦可同時於該些第一毛細層21〇之上、下方 堆疊有複數第二毛細層220，於本實施例中，堆叠於該些第—毛細層21〇上 方之第二毛細層22G間形成有複數通道221，且該第—毛細層2iq與該第二 毛細層220相互堆疊後之高度與該容置空間1〇1才目等，使其可完整填充於 該容置空間1G1 ’增加其支雜(如第5(：至5])圖所示其巾，第％圖表示 通過第-毛細層21〇與第二毛細層22_面，第邪圖表示通過第二毛細 層220之通道221、第-毛細㈣之通道211及第二毛細㈣之剖面）。 本發明之熱板結構的4植在於：將二板體⑽相互對應結合而形成有 -容置空間m ’並於該容置空間1G1中設有複數第—毛細層⑽，且該些 201144739, 第一毛細層210之間形成有複數通道211，當該容置空間ιοί中的工作流體 進行兩相變化時，可藉由該些通道211作為蒸氣通道，使蒸氣態之工作流 體(如水蒸氣）可快速擴散至上方之板體1〇〇，增加其蒸氣擴散效率，而液態 狀之工作流體（如水）可藉由該些第一毛細層210均勻分佈於下方之板體 100，藉以促進工作流體均勻分佈，進而提高其降溫效率。 以上所述僅為本發明之較佳可行實施例，非因此即偈限本發明之專利 範圍’舉凡運用本發明說明書及圖式内容所為之等效結構變化，均理同包 _ 含於本發明之範圍内，合予陳明。 201144739 【圖式簡單說明】 第Μ圖係為本發明之熱板結構第—實施例之立體分解示意圖。 第1β圖係為本發明之熱板結構第—實施例之板體結合示意圖。 第2圖係為本發明之熱板結二實施例之立體分解示意圖。 第3圖係為本發明之触結構第三實施例之立體分解示意圖。 第4圖係為本發明之熱板結構第四實施例之立體分解示意圖。 第5Α _為本侧之她結娜五實_之讀分解示意圖。 第5Β圖係為本發明之熱板結構第五實施例之立體組人八意 第5C圖係為第5Β圖之Α-Α’線剖面示意圓。 第5D圖係為第5Β圖之Β-Β’線剖面示意圖。 【主要元件符號說明】 100 板體 101 容置空間 102 凹槽 110 封管 210 第一毛細層 211 通道 220 第二毛細層 221 通道I I201144739 is arranged in the same horizontal plane, and a plurality of channels 211 are formed between the first capillary layers 210, wherein the channels 211 of the first capillary layers 210 may be arranged in parallel (as shown in FIG. Vertically arranged (as shown in FIG. 2) or radially arranged (as shown in FIG. 3), that is, the channels 211 of the first capillary layers 210 may be arranged in any direction, and the first capillary layers 21 The crucible may be formed of a metal mesh or sintered by a powder such as a metal powder. Moreover, the south of the first capillary layer 21 is equal to the accommodating space, so that it can be completely filled in the accommodating space to increase its support. As shown in FIG. 1 , in the present embodiment, a second plate body 1 〇〇 and a plurality of first capillary layers 210 ′ are provided, and one of the plate bodies 100 of the two plate bodies 100 is provided with a groove 1 〇 2, so that The two plates 1 〇〇 〇〇 〇〇 可 可 可 容 容 容 容 容 容 容 容 容 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌 雌The space 1〇1 is connected to each other, and the first capillary layer 210 is disposed in the accommodating space 1〇1, and a plurality of channels 211′ are formed between the first capillary layers 21〇 and the channels 211 are Parallelly arranged to inject a working fluid (such as water) into the two plates 100 from the outside by the sealing tube (10), and then circulate the first capillary layer 21G of the second plate 1G() by two-phase change of the working fluid. It reduces the heat source temperature and effectively conducts heat. At the same time, when the rainbow body changes its axis (such as water and money, the channel 211 can be used as a channel to make the vapor state fluid (such as water vapor) Rapid diffusion to the upper plate (10), increasing the efficiency of money diffusion, and the liquid reading fluid (such as water) can be used to The first capillary layer 21〇 is evenly distributed on the lower plate body, thereby promoting uniform distribution of the working fluid, thereby improving the cooling efficiency. See also FIG. 4, which is a three-dimensional decomposition of the fourth embodiment of the hot plate structure of the present invention. The present embodiment is in contact with the first embodiment, and the main difference is that the step further includes 201144739, and there are a plurality of second capillary layers 220, and a plurality of channels 221 are formed between the second capillary layers 220. The first capillary layer 210 is a metal mesh, and the second capillary layers 220 may be a metal mesh (or formed by sintering a powder bundle (such as metal powder)) and the second capillary layer 220 and the first The capillary layers 21 are stacked on each other, that is, the second capillary layers 220 are stacked above or below the first capillary layer 21, and in the embodiment, the second capillary layers 220 are stacked on the first capillary The layer 211 is located below, and the channel 221 between the first capillary layer 220 and the channel 211 between the first capillary layers 21 can correspond to each other or be staggered. Further, the thickness of the first capillary layer 210 is greater than The thickness of the second capillary layer 220 (ie, the A capillary layer 210 may be referred to as a coarse capillary layer, and the second capillary layer 220 is referred to as a fine capillary layer, and the number of meshes of the first capillary layer 21 may be different from the number of meshes of the second capillary layer 220. Please refer to FIG. 5A to FIG. 5D for a perspective exploded view of a fifth embodiment of the hot plate structure of the present invention, a three-dimensional combination thereof, and a schematic cross-sectional view thereof. The present embodiment is the same as the fourth embodiment, and the main difference is the same. The second capillary layer is stacked on top of or below the first capillary layer 210, and a plurality of second capillary layers 220 are stacked on the lower surface of the first capillary layer 21A. In this embodiment, a plurality of channels 221 are formed between the second capillary layers 22G stacked above the first capillary layer 21, and the height of the first capillary layer 2iq and the second capillary layer 220 are stacked on each other. And the accommodating space is 1 〇1, so that it can be completely filled in the accommodating space 1G1 'increasing its branching (as shown in the 5th (:5 to 5)), the first figure shows the passage - the capillary layer 21〇 and the second capillary layer 22_ face, the first evil figure indicates the second hair Layer 220, passage 221, the - (iv) of the capillary passage 211 and the cross section of the second capillary (iv)). The thermal plate structure of the present invention is characterized in that the two plates (10) are combined with each other to form an accommodating space m', and a plurality of first capillary layers (10) are disposed in the accommodating space 1G1, and the 201144739, A plurality of channels 211 are formed between the first capillary layers 210. When the working fluid in the accommodating space ιοί changes in two phases, the channels 211 can be used as a vapor channel to make a working fluid (such as water vapor) in a vapor state. It can be quickly diffused to the upper plate 1〇〇 to increase its vapor diffusion efficiency, and the liquid working fluid (such as water) can be evenly distributed to the lower plate 100 by the first capillary layer 210, thereby promoting the working fluid. Evenly distributed, thereby improving its cooling efficiency. The above description is only a preferred embodiment of the present invention, and thus the scope of the present invention is not limited to the equivalent structural changes of the present specification and the contents of the drawings. Within the scope of the agreement, Chen Ming. 201144739 [Simple description of the drawings] The second drawing is a perspective exploded view of the first embodiment of the hot plate structure of the present invention. The first β-graph is a schematic diagram of the plate body combination of the first embodiment of the hot plate structure of the present invention. Fig. 2 is a perspective exploded view showing the second embodiment of the hot plate of the present invention. Fig. 3 is a perspective exploded view showing the third embodiment of the touch structure of the present invention. Fig. 4 is a perspective exploded view showing the fourth embodiment of the hot plate structure of the present invention. The fifth Α _ is the side of her side of the knot five real _ reading decomposition diagram. The fifth drawing is a three-dimensional group of the fifth embodiment of the hot plate structure of the present invention. The fifth drawing is a schematic circle of the Α-Α' line of the fifth drawing. The 5D figure is a schematic cross-sectional view of the Β-Β' line of the fifth figure. [Main component symbol description] 100 plate 101 accommodating space 102 groove 110 sealing tube 210 first capillary layer 211 channel 220 second capillary layer 221 channel