JP3163110U - Heat sink structure - Google Patents

Abstract

The present invention provides a structure of a heat sink that increases the diffusion efficiency of steam, promotes uniform distribution of a working fluid, and improves the temperature lowering efficiency. The structure of the heat radiating plate is mainly composed of two plate bodies 100 coupled to each other so as to form a housing space, and a plurality of first capillary layers 210 are provided in the housing space, These first capillary layers are located on the same horizontal plane, and a plurality of passages 211 are formed between these first capillary layers. [Selection] Figure 1A

Description

  The present invention relates to a structure of a heat radiating plate, and more particularly to a structure of a heat radiating plate that can be applied to an electronic product.

  At present, general electronic products are likely to generate heat when used for a long time, and the solution is mainly to radiate heat by attaching a heat sink. The heat radiating plate has characteristics such as high thermal conductivity, light weight, and simple structure, and further has an advantage that power is not consumed even if a large amount of heat is transmitted.

  The structure of a conventional heat sink mainly includes a plate body, a vacuum chamber is formed inside the plate body, a capillary tissue is provided in the vacuum chamber and a working fluid is filled, and a seal is provided on one side of the plate body. A tube (also referred to as a closed tube, an exhaust pipe or a filling exhaust pipe) is connected, and one end of the seal tube is connected to the plate body and communicated with the internal vacuum chamber, thereby allowing the heat sink to pass through the seal tube. In addition, the working fluid is injected into the inside (ie, the vacuum chamber) from the outside, and exhaust and vacuum operations are performed to dissipate heat generated during use of the electronic product.

  The present invention has been made in view of the above points, and provides a structure of a heat sink that can improve the efficiency of lowering the temperature and extend the service life of the product.

  A main object of the present invention is to provide a structure of a heat radiating plate capable of improving the temperature lowering efficiency of the heat radiating plate.

  In order to achieve the above object, the structure of the heat dissipation plate according to the present invention includes two plate bodies that are coupled to each other to form an accommodation space, and a capillary layer that is provided in the accommodation space and is positioned on the same horizontal plane. And a plurality of first capillary layers in which a plurality of passages are formed between the capillary layers. Therefore, it increases steam diffusion efficiency, promotes uniform distribution of working fluid, improves temperature reduction efficiency, and certainly has practicality, novelty, inventive step and convenience.

FIG. 1A is an exploded perspective view showing a first embodiment of the structure of a heat sink according to the present invention. FIG. 1B is a view showing the coupling of the plate bodies of the first embodiment of the structure of the heat sink according to the present invention. FIG. 2 is an exploded perspective view showing a second embodiment of the structure of the heat sink according to the present invention. FIG. 3 is an exploded perspective view showing a third embodiment of the structure of the heat sink according to the present invention. FIG. 4 is an exploded perspective view showing a fourth embodiment of the structure of the heat sink according to the present invention. FIG. 5A is an exploded perspective view showing a fifth embodiment of the structure of the heat sink according to the present invention. FIG. 5B is a perspective combination view showing a fifth embodiment of the structure of the heat sink according to the present invention. FIG. 5C is a cross-sectional view taken along line A-A ′ of FIG. 5B. FIG. 5D is a cross-sectional view taken along line B-B ′ of FIG. 5B.

1A to 3 are exploded perspective views showing a first embodiment of the structure of the heat sink according to the present invention, a view showing the coupling of plate bodies, an exploded perspective view showing the second embodiment, and the third embodiment, respectively. It is.
As shown in FIGS. 1A to 3, the structure of the heat radiating plate includes two plate main bodies 100, a seal tube 110, and a plurality of first capillary layers 210. , And conducts heat efficiently and reaches the effect of improving the temperature reduction efficiency.

  The two plate main bodies 100 are coupled to each other and form a receiving space 101 between the two plate main bodies 100, and a concave groove 102 is formed in one of the two plate main bodies 100 in actual use. By providing the concave groove 102 in both of the two plate main bodies 100, the two plate main bodies 100 are joined to each other, and after that, the vacuum space is formed and the accommodation space 101 containing the working fluid is formed. As the bonding method of the plate body 100, copper brazing or silver brazing, high temperature brazing, diffusion bounding, high temperature welding or the like may be employed.

  The seal tube 110 (hollow tube) is provided on one side or any one corner of the two plate bodies 100, and one end of the seal tube 110 is communicated with the accommodation space 101. By injecting the working fluid into the housing space 101 from the outside, the heat source temperature is lowered and the amount of heat is efficiently conducted and radiated by the both phases of the working fluid and the circulation of the capillary structure in the two plate bodies 100. Reach.

  These first capillary layers 210 are provided in the accommodation space 101 and arranged in the same horizontal plane, and a plurality of passages 211 are formed between the first capillary layers 210, and the passages between the first capillary layers 210. 211 may be arranged in parallel (as shown in FIG. 1), but may be arranged vertically (as shown in FIG. 2) or radially (as shown in FIG. 3). That is, the passages 211 between the first capillary layers 210 may be arranged in any direction. These first capillary layers 210 are formed by sintering a metal rope or powder (for example, metal powder). Moreover, the height of these 1st capillary layers 210 is the same as the height of the accommodation space 101, and the accommodation space 101 is completely filled, and the supportability is improved.

  As shown in FIG. 1, in the present embodiment, mainly two plate bodies 100 and a plurality of first capillary layers 210 are provided, and a concave groove 102 is provided in one of the two plate bodies 100. An accommodation space 101 is formed after the two plate bodies 100 are coupled to each other, the seal tube 11 is provided at one corner of the two plate bodies 100, and one end of the seal tube 11 is the accommodation space. 101, the first capillary layers 210 are provided in the accommodating space 101, a plurality of passages 211 are formed between the first capillary layers 210, the passages 211 are arranged in parallel, and the seal A working fluid (for example, water) is injected from the outside into the two plate main bodies 100 by the tube 110, and circulates to the capillary structure in the two plate main bodies 100 due to both phase changes of the working fluid, and the heat source temperature is lowered. And heat quantity efficiently In addition, when the working fluid undergoes a two-phase change (for example, water, steam), the working fluid (for example, steam) in a vapor state is diffused into the upper plate body 100 using these passages 211 as steam passages. , Improving the diffusion efficiency of the vapor, and distributing the working fluid in a liquid state (for example, water) uniformly to the lower plate body 100 by the first capillary layer 210, thereby facilitating uniform distribution of the working fluid. , Improve its temperature reduction efficiency.

FIG. 4 is an exploded perspective view showing a fourth embodiment of the structure of the heat sink according to the present invention.
As shown in FIG. 4, the present embodiment is the same as the first embodiment, and the main difference is that it further includes a second capillary layer 220, and a plurality of passages between these second capillary layers 220. 221 is formed. These first capillary layers 210 are metal ropes, and these second capillary layers 220 are metal ropes (or formed by sintering powder (eg, metal powder)). These second capillary layers 220 are deposited with each other with these first capillary layers 210. That is, these second capillary layers 220 are deposited above or below these first capillary layers 210. In this embodiment, these second capillary layers 220 are deposited below these first capillary layers 210, and the passages between these second capillary layers 220 and the passages between these first capillary layers 210 are mutually connected. A point that corresponds or intersects.
Further, the thickness of these first capillary layers 210 is larger than the thickness of these second capillary layers 220 (that is, the first capillary layer 210 is called a coarse capillary layer, and the second capillary layer 220 is a fine capillary layer). In addition, the number of meshes of the first capillary layer 210 is different from the number of meshes of the second capillary layer 220.

5A to 5D are an exploded perspective view, a perspective combination view, and a cross-sectional view showing a fifth embodiment of the structure of the heat dissipation plate according to the present invention.
As shown in FIGS. 5A to 5D, this embodiment is the same as the fourth embodiment, the main difference being that these second capillary layers 220 are deposited above or below these first capillary layers 210. In addition, a plurality of second capillary layers 220 are simultaneously deposited above and below these first capillary layers 210.
In the present embodiment, a plurality of passages 221 are formed between the second capillary layers 220 deposited above the first capillary layers 210, and the first capillary layers 210 and the second capillary layers 220 are deposited on each other. The height after this is the same as the height of the accommodating section 101, and the accommodating space 101 is completely filled. As shown in FIGS. 5C to 5D, FIG. 2D shows the cross section of the second capillary layer 220, and FIG. 5D shows the improvement in the passage 221 of the second capillary layer 220, the passage 211 of the first capillary layer 210, and the cross section of the second capillary layer 220).

  In the structure of the heat dissipation plate according to the present invention, the two plate main bodies 100 correspond to each other to form an accommodation space 101, and a plurality of first capillary layers 210 are provided in the accommodation space 101. A plurality of passages 211 are formed between the first capillary layers 210, and when the working fluid in the accommodation space 101 undergoes both-phase changes, these passages 211 serve as a steam passage (for example, a working fluid in a vapor state (for example, , Water vapor) is diffused to the upper plate body 100, the diffusion efficiency of the vapor is improved, and the liquid working fluid (for example, water) is uniformly distributed to the lower plate body 100 by these first capillary layers 210. Thus, the uniform distribution of the working fluid is promoted, and the temperature lowering efficiency is improved.

  The above description is merely a description of a preferred specific embodiment of the present invention, and is not intended to limit the scope of the present invention. Any person having ordinary skill in the art may However, it is needless to say that such implementation should be included in the present invention.

DESCRIPTION OF SYMBOLS 100 ... Plate body 101 ... Accommodating space 102 ... Concave groove 110 ... Seal tube 210 ... First capillary layer 211 ... Passage 220 ... 2nd capillary layer 2
221: Passage

Claims (12)

Two plate bodies that combine with each other to form an accommodation space;
A structure of a heat radiating plate including a plurality of first capillary layers that are provided in the housing space and are located on the same horizontal plane and in which a plurality of passages are formed between the capillary layers.   The structure of the heat sink according to claim 1, wherein the passages between the first capillary layers are arranged in parallel.   The structure of the heat sink according to claim 1, wherein the passages between the first capillary layers are arranged vertically.   The structure of the heat sink according to claim 1, wherein the passages between the first capillary layers are arranged radially.   The heat sink structure according to claim 1, wherein the first capillary layer is a metal rope.   The heat sink structure according to claim 1, wherein the first capillary layer is formed by sintering powder.   The heat sink structure according to claim 1, wherein a height of the first capillary layer is the same as the accommodation space.   The heat sink structure according to claim 1, further comprising a second capillary layer positioned on the same horizontal plane and deposited on the first capillary layer.   The heat sink structure according to claim 8, wherein a plurality of passages are formed between the second capillary layers.   The structure of the heat sink according to claim 8, wherein the second capillary layer is a metal rope.   The structure of the heat sink according to claim 8, wherein the second capillary layer is formed by sintering powder.   The heat sink structure according to claim 8, wherein the height of the first capillary layer and the second capillary layer deposited on each other is the same as that of the housing space.

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