JP3137823B2 - Chip component type LED and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component type LED for surface mounting and a method of manufacturing the same, and relates to various display panels,
It is used as a light source such as a backlight of a liquid crystal display device and an illumination switch.

[0002]

2. Description of the Related Art Chip component type LEDs have conventionally been used as light sources for various display panels, backlights of liquid crystal display devices, illumination switches, and the like.

FIGS. 14 to 16 show an example of the structure of such a conventional chip component type LED.

In a chip component type LED shown in FIG. 14, an LED chip 61 is mounted on one lead frame terminal 60 on the cathode side with an Ag paste, and this LED chip 61 and the other lead frame terminal 62 on the anode side.
Are connected by a thin metal wire (Au wire or the like) 63, and the whole is sealed with a transparent resin 64.

[0005] A chip component type LED shown in FIG.
Is to bond an LED chip 71 onto one wiring pattern 74 formed on the surface of an insulating substrate 70, and connect the other pair of wiring patterns 75 and this LED chip 71 to a thin metal wire (such as an Au wire) 72. And the surface of an insulating substrate 70 including the LED chip 71 and the fine metal wires 72 is sealed with a transparent resin 73.

A chip component type LED shown in FIG.
Is a two-layer structure of the insulating substrates 81 and 82. A through-hole 83 is formed in the upper insulating substrate 82, and the through-hole 83 is formed.
One of the wiring patterns 84 is formed to extend to the bottom portion (that is, the upper surface of the insulating substrate 81), and the LED chip 85 is mounted on the wiring pattern 84 in the through hole 83. The other wiring pattern 86 is connected with a thin metal wire (Au wire or the like) 87, and the surface of an insulating substrate 82 including the LED chip 85 and the thin metal wire 87 is sealed with a transparent resin 88.

[0007]

However, FIG.
The chip component type LED shown in FIG.
In order to obtain a sufficient strength, at least the lead frame terminals 6 are required.
0 must be thicker, and each lead frame 6
It is necessary to seal the entire LED chip 61 including the ends of 0 and 62 with resin, so that the entire LED chip 61 becomes thicker. Also,
When the LED chip 61 is turned on, the light leaks to the side surface and the back surface, and there is a problem that the reflection efficiency upward is low.

Further, a chip component type LED shown in FIG.
Since the LED chip 71 is provided on the insulating substrate 70, the light leaks to the side surface when the LED chip 71 is turned on, so that there is a problem that the reflection efficiency upward is correspondingly low.

A chip component type LED shown in FIG.
Although the thinning is achieved by mounting the LED chip 85 in the through hole 83, the lighting of the LED chip 85 is performed because the inner peripheral surface of the through hole 83 is formed perpendicular to the bottom surface. There is a problem that the efficiency of reflection of light upward at the time is low. Further, since two insulating substrates 81 and 82 are required, there is a problem that it is difficult to reduce the thickness and the cost is increased.

Further, in the chip component type LEDs shown in FIGS. 15 and 16, the LED chips 71 and 85 are mounted on the insulating substrates 70 and 82, respectively.
Requires the minimum thickness that can be mounted.

The present invention has been made in order to solve such a problem, and an object of the present invention is to eliminate the thickness of a substrate for mounting an LED chip and achieve a reduction in thickness.
Chip component type LE with improved light reflection efficiency during lighting
D and its manufacturing method.

[0012]

According to the present invention, there is provided a chip component type LED according to the present invention.
A metal thin plate forming one wiring pattern is attached to the back surface of the insulating substrate having the through hole formed therein, and an LED chip is mounted on the metal thin plate in the through hole.
The D chip and the other wiring pattern formed on the surface of the insulating substrate are electrically connected and sealed with a transparent resin.

According to a second aspect of the present invention, there is provided a chip component type LED according to the present invention, wherein a metal thin plate for forming one wiring pattern is provided on the back surface of the insulating substrate having the through hole formed therein. An LED chip is mounted on the thin metal plate, and the LED chip and the other wiring pattern formed on the surface of the insulating substrate are electrically connected and sealed with a transparent resin. The inner circumference of
The insulating substrate is formed on an inclined surface that gradually expands from the back side to the front side.

According to a third aspect of the present invention, there is provided a method of manufacturing a chip component type LED according to the present invention, comprising the steps of: forming a through hole in an insulating substrate; A second step of forming a plating layer on the front surface, the back surface, and the side surface of the insulating substrate and the inner peripheral surface of the through hole by using electrolysis and electrolytic plating, and the metal sheet attached to the back surface of the insulating substrate; LED chip using the surface of the insulating substrate, a third step of forming a rear surface and a pair of electrodes to separate the plating layer formed on the side surfaces, the conductive material to the metal sheet a bottom surface of the through hole the implementation, in the fourth step and the LED chip and the conductive material and the translucent resin which connects and electrodes other formed on the surface of this LED chip the insulating substrate with conductive material And a fifth step of sealing.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a chip component type LED according to the present invention, wherein a metal layer is formed on a front surface, a back surface, and a side surface of an insulating substrate except for a portion on the front surface where an LED chip is mounted. A first step of irradiating a laser beam to the LED chip mounting portion of the insulating substrate to form a through hole reaching the metal layer on the back surface; and forming a metal layer on the inner peripheral surface of the through hole. A third step of forming a pair of electrode layers by separating the metal layers formed on the front surface, the back surface, and the side surface of the insulating substrate; and forming the metal layer on the bottom surface in the through hole. A fifth step of mounting an LED chip using a conductive material on a layer and connecting the LED chip and the other electrode layer formed on the surface of the insulating substrate with a conductive material; Is sealed with a translucent resin. It is intended to and a sixth step.

[0016]

The operation of the first aspect will be described.

A thin metal plate for forming one wiring pattern is attached to the back surface of the insulating substrate having the through hole formed therein, and an LED chip is mounted on the thin metal plate in the through hole. Is electrically connected to the other wiring pattern formed on the substrate and sealed with a transparent resin. That is, by attaching a thin metal plate to the back surface of the insulating substrate, the shape of the thin metal plate is maintained by the insulating substrate. Therefore, the LED chip can be easily mounted on the thin metal plate, and the LED chip is not deformed even when connected by a thin metal wire. That is, by holding the thin metal plate by the insulating substrate, operations such as mounting of the LED chip on the thin metal plate, connection of the thin metal wire, and sealing with the translucent resin can be easily performed.

In addition, since the LED chip is mounted on the metal thin plate at the bottom of the through hole, L which is conventionally required
Substrates for mounting ED chips (mainly in FIGS. 13 and 1)
4) is unnecessary, and an extremely thin structure can be achieved. That is, the thickness of the conventional chip component type LED is about 1.1 mm in the one shown in FIG. 14 and about 0.8 mm in the ones shown in FIGS. It is possible to reduce the thickness.

The operation of the invention described in claim 2 will be described.

A thin metal plate for forming one of the wiring patterns is attached to the back surface of the insulating substrate having the through hole, and an LED chip is mounted on the thin metal plate in the through hole. Is electrically connected to the other wiring pattern formed on the substrate and sealed with a transparent resin. At this time, the inner peripheral surface of the through hole is formed as an inclined surface that gradually expands from the back surface side to the front surface side of the insulating substrate. Accordingly, when the LED chip is turned on, the light traveling toward the side surface is reflected by the inclined surface and travels upward, so that the efficiency of upward reflection is improved. By the way, the reflection efficiency when the LED chip is turned on by making the inner peripheral surface of the through hole an inclined surface is 30 compared with the case where the LED chip is mounted on the flat board (the case shown in FIGS. 14 to 16). It can be increased by more than a percentage.

The operation of the invention described in claim 3 will be described.

In the first step, after a through hole is formed in the insulating substrate, a thin metal plate is attached to the back surface. As described above, since the through hole is first formed in the insulating substrate, the through hole can also be formed by a mechanical drill or the like. This means
This makes it possible to form a through hole at a time by stacking a number of insulating substrates, so that cost reduction can be realized. Also,
As a method of additionally provided a metal sheet on the back surface of the insulating substrate can simple method such bonding by simply glue the sheet metal.

Next, in a second step, a plating layer is formed on the front, back and side surfaces of the insulating substrate and the inner peripheral surface of the through hole by using electroless and electrolytic plating methods. in the metal sheet and the insulating surface of the substrate that is additionally provided on the rear surface of the insulating substrate, and separating the plating layer formed on the back surface and side surfaces forming a pair of electrodes. And in the fourth step,
Wherein a bottom surface of the through hole with a conductive material to the metal sheet by mounting the LED chip, connect and electrodes other formed on the surface of this LED chip the insulating substrate with a conductive material, the following first In step 5, the LED chip and the conductive material are sealed with a translucent resin, and the chip component type LE is sealed.
The manufacture of D is completed.

The operation of the present invention described in claim 4 will be described.

In the first step, a metal layer is formed on the front, back and side surfaces of the insulating substrate except for the portion where the LED chips are mounted on the front surface, and in the next second step, laser light is applied to the insulating substrate. Irradiates the LED chip mounting portion to form a through hole reaching the metal layer on the back surface. When the target area of the insulating substrate is removed by the laser light, the laser light removes the insulating part so as to spread from the center, so that the inner peripheral surface of the formed through hole is naturally formed as an inclined surface. That is, by irradiating the laser beam from the front surface side of the insulating substrate, the inner peripheral surface of the through hole is formed as an inclined surface that gradually expands from the back surface side to the front surface side of the insulating substrate.

Next, in a third step, a metal layer is formed on the inner surface (peripheral surface and bottom surface) of the through hole, and in a fourth step, the metal layer is formed on the front surface, the back surface, and the side surface of the insulating substrate. The metal layer is separated to form a pair of electrode layers, and in the next fifth step, an LED chip is mounted on the metal layer, which is the bottom surface in the through hole, using a conductive material. The other electrode layer formed on the surface of the insulating substrate is connected with a conductive material. Then, in a sixth step, the LED chip and the conductive material are sealed with a translucent resin, and the manufacture of the chip component type LED is completed.

[0027]

Embodiments of the present invention will be described below with reference to the drawings. [Embodiment 1] FIGS. 1 and 2 show a chip part type L according to the present invention.
3 shows a sectional view and a plan view of the ED.
This is an embodiment corresponding to FIG.

In the figure, metal layers 7 and 8 are formed on a front surface 102 of an insulating substrate 10 in which a through hole 12 is formed, and thin metal plates 5 and 6 are provided on a back surface 101. The inner peripheral surface of the through hole 12 is formed as an inclined surface 121 that gradually expands from the back surface 101 side to the front surface 102 side of the insulating substrate 10.

The metal layer 7 on the front surface 102 and the back surface 101
And the inclined surface 12 of the through hole 12.
1 and one wiring pattern 9 are formed so as to extend to the bottom surface 122 (the thin metal plate 5).
The other wiring pattern 4 is formed so as to connect to the metal thin plate 6 on the back surface 101.

Then, the through-hole 12 formed as described above is formed.
The LED chip 1 is mounted on a bottom surface 122 (metal thin plate 5) inside the LED chip 1 and the LED chip 1 and the surface 102 of the insulating substrate 10.
Is connected to the other wiring pattern 4 formed by a thin metal wire 2 such as Au, and the LED chip 1 and the thin metal wire 2 are sealed by a transparent resin (translucent resin) 11. I have. Note that reference numeral 16 in the drawing denotes a resist layer for securing insulation during soldering, and reference numeral 17 denotes Ag.
It is a conductive material such as a paste.

Next, a method of manufacturing the chip component type LED having the above configuration will be described with reference to FIG. This manufacturing method corresponds to claim 3.

In the first step, the metal layer 7,
A through-hole 12 whose inner peripheral wall is an inclined surface 121 is formed in the insulating substrate 10 having the inner surface 8, and thin metal plates 5 and 6 are bonded to the back surface 101. However, the metal sheets 5 and 6 at this time are
At this point, it is a single continuous metal sheet [FIG.
(A)].

The through hole 12 is formed before the metal sheets 5 and 6 are bonded to the back surface 101, so that the through hole 12 can be formed by a mechanical drill or the like. Therefore, many insulating substrates 10 are stacked, and each insulating substrate 10
Can be opened at once. However, the opening 12 in this case is cylindrical, and its inner peripheral surface is a vertical surface. Therefore, processing for forming an inclined surface is required, but cost reduction can be realized.

In the second step, the surface 102, the back surface 101 and the side surfaces 103 and 104 of the insulating substrate 10 having the above structure, the inclined surface 121 and the bottom surface 122 in the through-hole 12 are formed by using electroless and electrolytic plating methods. Then, a plating layer 15 is formed.
Here, the surface of the insulating substrate 10 is specifically the surface 10
2 means the surfaces of the metal layers 7 and 8, and the back surface of the insulating substrate 10 specifically means the surfaces of the thin metal plates 5 and 6 (see FIG. 3B).

In the third step, the back surface 10 of the insulating substrate 10
The plating layer 15 on one side is separated from the metal sheets 5 and 6 to form wiring patterns (a pair of electrodes on the anode side and the cathode side) 9 and 4, respectively. Similarly, the plating layer on the surface 102 side of the insulating substrate 10 is also separated into the metal layers 7 and 8. The separation process is performed by removing a metal portion by, for example, etching or laser processing. If necessary, a metal layer is stacked on the remaining metal portion by an electrolytic plating method. For example, a wiring pattern 9,
After the formation of Ni, Ag or A on the metal layer
u, palladium, etc. are laminated. This is for protection of the metal surface or connectivity with the metal wire. This allows
Complete processing of the substrate. Also, the back surface 10 of the insulating substrate 10
In FIG. 1, a resist layer 16 for securing insulation during soldering is formed (see FIG. 3C).

In the fourth step, the bottom surface 122 (specifically, on the wiring pattern 9 formed on the thin metal plate 5) in the through hole 12 of the insulating substrate 10 thus formed)
Then, the LED chip 1 is mounted using a conductive material 17 such as an Ag paste, and the LED chip 1 and the other wiring pattern 4 formed on the surface 102 of the insulating substrate 10 are connected to Au.
(See FIG. 3D).

In a fifth step, the surface 102 of the insulating substrate 10 is filled with a transparent resin (translucent resin) 11 so as to enclose the LED chip 1 and the fine metal wires 2,
The ED chip 1 and the fine metal wire 2 are completely sealed. Thus, a chip component type LED having the structure shown in FIG. 1 is manufactured. Example 2 Figures 4 and 5 are a sectional view and a plan view showing another embodiment of a chip-type LED of the present invention.

In the figure, an insulating substrate 30 in which a through hole 32 is formed is placed on a side surface 303, 30 from the surface 302 thereof.
4, metal layers 27 and 28 reaching the back surface 301 are formed. In this embodiment, the metal layer 27 is on the cathode side, and the metal layer 28 is on the anode side. The inner peripheral surface of the through hole 32 is formed as a curved surface 321 gradually expanding from the back surface 301 side to the front surface 302 side of the insulating substrate 30.

A metal layer 29 is formed on the inner peripheral surface of the through hole 32 so as to extend the metal layer 27 on the cathode side.

The through-hole 32 formed as described above
The LED chip 21 is mounted on the inner bottom surface 322 (specifically, the metal layer 29 formed on the metal layer 27), and the LED chip 21 and the anode-side metal formed on the surface 302 of the insulating substrate 30. The layer 28 is made of a thin metal wire 22 such as Au.
The LED chip 21 and the fine metal wire 22 are sealed by a transparent resin (translucent resin) 31. Reference numeral 36 in the figure denotes a resist layer for securing insulation during soldering, and reference numeral 37 denotes Ag.
It is a conductive material such as a paste.

Next, a method of manufacturing the chip component type LED having the above configuration will be described with reference to FIG. This manufacturing method corresponds to claim 4.

In the first step, the surface 30 of the insulating substrate 30 is
2, the metal layer 2 on the back surface 301 and both side surfaces 303 and 304
7 and 28 are formed, and thereafter, the metal layer of the portion 23 of the surface 302 where the LED chip 21 is mounted is removed. However,
At this point, the metal layers 27 and 28 after the metal layer of the portion 23 on which the LED chip 21 is mounted are removed
0 is a single continuous metal layer on the back surface 301 side of FIG.
(A)].

In the second step, a laser beam is irradiated on the LED chip mounting portion 23 of the insulating substrate 30 to
A through-hole 32 reaching the first metal layer 27 is formed. When the target area of the insulating substrate 30 is removed with the laser light, the laser light removes the insulating portion so as to spread from the center, so that the inner peripheral surface of the formed through hole 32 naturally has a curved surface 32.
1 (see FIG. 6B). That is, by irradiating the laser beam from the front surface 302 side of the insulating substrate 30, the inner peripheral surface of the through hole 32 is
Curved surface 32 gradually expanding from the side toward the surface 302 side
1 is formed.

However, the formation of the through hole 32 may be performed by etching the resin portion with a chemical or machining (drilling with a drill, etc.) in addition to machining with a laser beam. In the case of etching, the inner peripheral wall of the formed through hole 32 is naturally formed on the curved surface 321 in order to remove the insulating portion so as to spread from the central portion, similarly to the processing by the laser beam.

In the third step, a metal layer 29 is formed on the inner surface (peripheral surface and bottom surface) of the through hole 32 so as to extend the metal layer 27 (see FIG. 6C). Metal layer 2 in through hole 32
The reason why 9 is formed is to improve the reflection efficiency of light when the LED chip 21 is turned on. When the insulating substrate 30 is a white resin, the inner peripheral surface of the through hole 32 is also white. Therefore, in this case, the metal layer 29 may not be provided (see FIG. 7).

In the fourth step, the surface 30 of the insulating substrate 30 is
2 and the metal layer formed on the back surface 301 are separated from each other to form a pair of electrode layers (final shapes of the cathode-side metal layer 27 and the anode-side metal layer 28) [FIG.
(D)].

Thereafter, a resist layer 36 for securing insulation during soldering is formed on the back surface 301 of the insulating substrate 30 (see FIG. 6E). That is, the resist layer 36
This prevents a short circuit on the back surface when soldering the completed chip component type LED.

In the fifth step, the bottom surface 32 in the through hole 32
The conductive material 37 such as an Ag paste is
The LED chip 21 is mounted by using the above-mentioned method, and the LED chip 21 and the other metal layer 28 formed on the surface 302 of the insulating substrate 30 are connected by a thin metal wire 22 such as Au. Then, in a sixth step, the LED chip 21 and the fine metal wires 22 are sealed with a translucent resin 31. Thus, a chip component type LED having a structure shown in FIG. 4 is manufactured. The figure
7 is a modification example of the chip component type LED corresponding to the second embodiment.
Is shown. Third Embodiment FIG. 8 is a cross-sectional view showing another example of the chip component LED of the present invention, which is a modification of the chip component LED shown in FIG.

In the figure, metal layers 47 and 48 are formed on a front surface 502 of an insulating substrate 50 in which a through hole 52 is formed, and thin metal plates 45 and 46 are provided on a back surface 501. The inner peripheral surface of the through hole 52 is formed in a cylindrical shape in this embodiment, and is not an inclined surface.

The metal layer 47 on the front surface 502 and the back surface 50
One wiring pattern 49 is formed so as to connect the first metal sheet 45 and extend to the inner peripheral surface and the bottom surface 522 (metal sheet 45) of the through hole 52, and the metal layer 48 on the front surface 502 and the back surface 501. The other wiring pattern 44 is formed so as to connect with the thin metal plate 46 of FIG.

Then, the through-hole 52 thus formed is formed.
The LED chip 41 is mounted on the inner bottom surface 522 (metal thin plate 45), and the LED chip 41 and the other wiring pattern 44 formed on the surface 502 of the insulating substrate 50 are connected by a thin metal wire 42 such as Au. .

A reflection case plate 53 is additionally provided on the surface 502 of the insulating substrate 50.
In addition, a large-diameter through hole 54 containing the LED chip 41 and the thin metal wire 42 is formed. The through hole 54 is formed in an inclined surface 541 that gradually expands from the back surface 531 side of the reflection case plate 53 toward the front surface 532 side. The through hole 52 of the insulating substrate 50 and the through hole 54 of the reflection case plate 53 are filled with the transparent resin 51, and the LED chip 41 and the fine metal wires 42 are sealed with resin. Reference numeral 56 in the figure is a resist layer for securing insulation during soldering, and reference numeral 57 is a conductive material such as an Ag paste.

Next, a method of manufacturing the chip component type LED having the above configuration will be described with reference to FIG.

In the first step, the metal layer 4
A through hole 52 is formed in an insulating substrate 50 having 7, 48, and thin metal plates 45, 46 are bonded to a back surface 501.
However, the metal sheets 45 and 46 at this time are one continuous metal sheet at this time [FIG. 9 (a)].

The through hole 52 is formed before the metal sheets 45 and 46 are bonded to the back surface 501, so that the through hole 52 can be formed by a mechanical drill or the like. Therefore, it becomes possible to stack a number of insulating substrates 50 and to form the through holes 52 in each insulating substrate 50 at one time,
Cost reduction can be realized.

In the second step, the front surface 502, the back surface 501 and both side surfaces 503 and 504 of the insulating substrate 50 having the above structure, the inner peripheral surface 521 and the bottom surface 522 of the through hole 52 are formed by electroless and electrolytic plating. Then, a plating layer 55 is formed.
Here, the surface of the insulating substrate 50 specifically refers to the surface 50.
2 are the surfaces of the metal layers 47 and 48 formed in
The back surface of the insulating substrate 50 specifically refers to the thin metal plates 45 and 4.
6 (FIG. 9B).

[0057] In the third step, the back surface side of the plating layer 55 of the insulating substrate 50 [see FIG. 9 (b)] to the sheet metal 45 and 46
Together with the wiring patterns 44 and 49, respectively.
To form The separation process is performed by removing a metal portion by, for example, etching or laser processing. Thus, the processing of the substrate is completed. Further, a resist layer 56 is formed on the back surface 501 of the insulating substrate 50 to ensure insulation during soldering (FIG. 9C).

In the fourth step, a reflective case plate 53 having a large-diameter through hole 54 containing the LED chip 41 and the fine metal wire 42 is formed on the surface 502 of the insulating substrate 50 thus formed. Attached [FIG. 9 (d)].

In the fifth step, the through holes 5 in the insulating substrate 50 are formed.
The LED chip 41 is mounted on a bottom surface 522 (specifically, a plating layer formed on the thin metal plate 45) using a conductive material 57 such as an Ag paste.
1 and the other wiring pattern 44 formed on the surface 502 of the insulating substrate 50 are connected by a thin metal wire 42 such as Au (FIG. 9E).

In the sixth step, the through holes 5 of the insulating substrate 50 are formed.
The transparent resin 51 is injected into the through-hole 54 of the second case 2 and the reflection case plate 53, and the LED chip 41 and the fine metal wires 42 are completely resin-sealed. Thus, a chip component type LED having a structure shown in FIG. 8 is manufactured.

In the structure shown in FIG. 8, since the reflection case plate 53 is provided separately from the insulating substrate 50, the through hole 54 formed in the reflection case plate 53 can be enlarged, so that the inclined surface 541 is also large and wide. The reflection efficiency in the upward direction is improved. In addition, the resin sealing is performed through the through hole 5.
It is only necessary to inject the resin into 2 and 54, and there is no need for a mold for maintaining the shape. Incidentally, the conventional chip component type LEDs shown in FIGS. 14 to 16 require a mold for resin sealing.

Further, since the LED chip 41 is directly mounted on the metal thin plate 45, a conventional substrate is not required,
Accordingly, the thickness can be reduced, and the material cost can be reduced. Furthermore, since the portion other than the peripheral portion where the LED chip 41 is mounted is held by the insulating substrate 53, sufficient strength can be secured, and the attachment of the thin metal wires 42 and resin sealing can be performed stably.

The configuration in which the reflection case plate 53 is provided can be applied to a chip component type LED having a structure shown in FIGS. The manufacturing method at this time is as follows: after the fifth step (FIG. 6E) of forming the resist layer 36 shown in the second embodiment, the fourth step [FIG.
(D)] to the sixth step may be performed. [Embodiment 4] FIGS. 10 to 13 show further modified examples of the chip component type LED shown in FIGS. 1 and 4, wherein the surfaces of the sealing resins 11 and 31 are formed in a lens shape.
Accordingly, when the LED chips 1 and 21 are turned on, light emitted in a scattered state obliquely upward is collected by the lens surface and travels upward, so that the upward reflection efficiency is further improved.

FIGS. 10 and 11 show the case where the sealing resins 11 and 31 are formed in a semi-cylindrical shape (so-called kamaboko type), and FIG.
13 is processed into a lens shape (indicated by a broken line) 58 by depressing a part of the top surface (indicated by a broken line), and the one shown in FIG. 59 is added. When processed into an inner lens as shown in FIG. 12, in addition to the improvement of the reflection efficiency, there is also an effect that it is easy to be fixed by suction at the time of surface mounting with a chip mounter or the like.

In the present embodiment, 1 to the insulating substrate
Although it was a one-chip LED lamp having a pair of patterns,
When a plurality of patterns are formed by the same method and a plurality of LED chips are connected, an LED lamp that emits multicolor (multiple LED chips) can be easily configured.

[0066]

According to the chip component type LED of the present invention, a metal sheet for forming one of the wiring patterns is provided on the back surface of the insulating substrate having the through-hole formed therein, and L is provided on the metal sheet in the through-hole.
The ED chip is mounted, and the LED chip and the other wiring pattern formed on the surface of the insulating substrate are electrically connected and sealed with a transparent resin. Therefore, the LED chip is mounted directly on a thin metal plate. This eliminates the need for a conventional substrate, thereby making it possible to reduce the thickness and to reduce the material cost. Further, since the portion other than the peripheral portion where the LED chip is mounted is held by the insulating substrate, sufficient strength can be secured, and the attachment of the thin metal wire and the resin sealing can be performed stably.

Further, in the chip component type LED of the present invention, in addition to the above-described configuration, the inner peripheral surface of the through hole is formed as an inclined surface that gradually expands from the back surface side to the front surface side of the insulating substrate. When the LED chip is turned on, light traveling toward the side surface is reflected by the inclined surface and travels upward, so that the upward reflection efficiency is improved.

Further, a chip component type LED according to the present invention
Is a method of forming a through hole in an insulating substrate, then attaching a thin metal plate to the back surface, and forming the through hole in the insulating substrate using electroless and electrolytic plating methods. A second step of forming a plating layer on the inner peripheral surface of the hole;
A third step of forming the sheet metal and the surface of the insulating substrate, and separating the plating layer formed on the back surface and side surfaces a pair of electrodes that is additionally provided on the rear surface of the insulating substrate, the bottom surface of the through hole the LED chip is mounted using a certain conductive material in the metal sheet, a fourth step of coupling the LED chip and the insulating other electrodes formed on the surface of the substrate with a conductive material, and the LED chip And a fifth step of sealing the conductive material with a translucent resin. In the first step, a through-hole is formed in the insulating substrate, and then a thin metal plate is added to the back surface. Since it is provided , the through hole can also be opened by a mechanical drill or the like. For this reason, it is possible to form a through-hole at a time by stacking a number of insulating substrates, so that cost reduction can be realized. Further, as a method of additionally provided a metal sheet on the back surface of the insulating substrate, it is possible to use a simple method such as bonding with simply glue the sheet metal.

Also, a chip component type LED according to the present invention
Is a first step of forming a metal layer on the front, back, and side surfaces of the insulating substrate except for a portion on the front surface where the LED chip is mounted, and irradiating a laser beam to the LED chip mounting portion of the insulating substrate. Then, a second step of forming a through hole reaching the metal layer on the back surface, a third step of forming a metal layer on the inner peripheral surface of the through hole, and a step of forming the through hole on the front surface, the back surface, and the side surface of the insulating substrate. A fourth step of separating the metal layer to form a pair of electrode layers, and mounting an LED chip using a conductive material on the metal layer serving as a bottom surface in the through hole;
A fifth step of connecting the D chip and the other electrode layer formed on the surface of the insulating substrate with a conductive material, and a sixth step of sealing the LED chip and the conductive material with a translucent resin.
In the second step, the laser light is applied to the LED chip mounting portion of the insulating substrate in the second step.
Since a through hole reaching the metal layer on the back side is formed, if the target area of the insulating substrate is removed with laser light, the laser light will remove the insulating part so as to spread from the center,
The inner peripheral surface of the formed through hole can be simultaneously formed as an inclined surface (curved surface). That is, only by irradiating the laser beam, the formation of the through hole and the formation of the inclined surface of the inner peripheral wall can be performed at the same time.

[Brief description of the drawings]

FIG. 1 is a chip component type LE corresponding to a first embodiment of the present invention.
It is sectional drawing of D.

FIG. 2 is a chip component type LE corresponding to the first embodiment of the present invention.
It is a top view of D.

FIG. 3 is a process chart for explaining a method of manufacturing the chip component type LED having the structure shown in FIG.

FIG. 4 is a chip component type LE corresponding to a second embodiment of the present invention.
It is sectional drawing of D.

FIG. 5 is a chip component type LE corresponding to the second embodiment of the present invention.
It is a top view of D.

6 is a process chart for explaining a method of manufacturing the chip component type LED having the structure shown in FIG.

FIG. 7 shows a chip component type LE corresponding to the second embodiment of the present invention.
It is sectional drawing which shows the modification of D.

FIG. 8 shows a chip part type LE corresponding to the third embodiment of the present invention.
It is sectional drawing of D.

FIG. 9 is a process chart for explaining a method of manufacturing the chip component type LED having the structure shown in FIG.

FIG. 10 is a front view showing a further modification of the chip component type LED shown in FIGS. 1 and 4, and showing an example in which the shape of a sealing resin is formed in a semi-cylindrical shape.

FIG. 11 is a side view showing a further modification of the chip component type LED shown in FIGS. 1 and 4 and showing an example in which a sealing resin is formed in a semi-cylindrical shape.

FIG. 12 is a front view showing a further modification of the chip component type LED shown in FIGS. 1 and 4 and showing an example in which a part of the top surface of the sealing resin is recessed and processed into a lens shape.

FIG. 13 is a front view showing a further modified example of the chip component type LED shown in FIGS. 1 and 4, in which a hemispherical lens is added to a top surface of a sealing resin.

FIG. 14 is a cross-sectional view showing an example of the structure of a conventional chip component type LED.

FIG. 15 is a sectional view showing an example of the structure of a conventional chip component type LED.

FIG. 16 is a sectional view showing an example of the structure of a conventional chip component type LED.

[Explanation of symbols]

 1,21 LED chip 2,22 Metal thin wire 4,9 Wiring pattern 5,6 Metal thin plate 7,8,27,28 Metal layer 10,30 Insulating substrate 11,31 Transparent resin 12,32 Through hole 121,321 Inclined surface 11 , 31 transparent resin

Claims (4)

(57) [Claims] An LED chip mounted on an outer surface of an insulating substrate.
Chip that forms a wiring pattern that is electrically connected to the
In the component-type LED, a through hole is formed in the insulating substrate, and the through hole is formed.
Connected to the wiring pattern on the back surface of the insulated substrate
A metal sheet is attached, and the metal on the bottom surface in the through hole is provided.
A chip component type LED comprising the LED chip mounted on a thin plate . 2. The chip component type LE according to claim 1, wherein the inner peripheral surface of the through hole is formed as an inclined surface that gradually expands from the back surface to the front surface of the insulating substrate.
D. 3. A first step of forming a through hole in the insulating substrate and then attaching a thin metal plate to the back surface, and the front surface, the back surface and the side surface of the insulating substrate using electroless and electrolytic plating methods. A second step of forming a plating layer on the inner peripheral surface of the hole;
A third step of forming the sheet metal and the surface of the insulating substrate, and separating the plating layer formed on the back surface and side surfaces a pair of electrodes that is additionally provided on the rear surface of the insulating substrate, the bottom surface of the through hole the LED chip is mounted using a certain conductive material in the metal sheet, a fourth step of coupling the LED chip and the insulating other electrodes formed on the surface of the substrate with a conductive material, and the LED chip And a fifth step of sealing the conductive material with a light-transmissive resin. 4. A first step of forming a metal layer on the front, back and side surfaces of the insulating substrate except for a portion on the front surface where the LED chip is mounted, and irradiating the laser light to the LED chip mounting portion of the insulating substrate. Then, a second step of forming a through hole reaching the metal layer on the back surface, a third step of forming a metal layer on the inner peripheral surface of the through hole, and a step of forming the through hole on the front surface, the back surface, and the side surface of the insulating substrate. A fourth step of separating the metal layer to form a pair of electrode layers, and mounting an LED chip using a conductive material on the metal layer serving as a bottom surface in the through hole;
A fifth step of connecting the D chip and the other electrode layer formed on the surface of the insulating substrate with a conductive material, and a sixth step of sealing the LED chip and the conductive material with a translucent resin.
Chip type LE comprising the steps of:
Method for producing D.