JP2017157684A - Light-emitting device and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of achieving efficient light emission, and excellent in heat dissipation.SOLUTION: A light-emitting device includes a resin case 100 having a bottom face 101, a side face 102, a top face 103 and a recess 110 recessed from the top face 103, a first metal terminal board 200 having an exposure face 201 exposed to the bottom face 101 of the case 100, a second metal terminal board 300 having an exposure face 301 exposed to the bottom face 101 of the case 100, a first conductor film 410 covering a part of the top face of the first metal terminal board 200 at the bottom 111 of the recess 110, and covering a part of the inside surface 112 of the recess 110, a second conductor film 420 covering a part of the top face of the second metal terminal board 300 at the bottom 111 of the recess 110, and covering a part of the inside surface 112 of the recess 110, an LED bare chip 500 bonded onto the first conductor film 410 at the bottom 111 of the recess 110, and a conductive member 510 conducting the LED bare chip 500 and second conductor film 420.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light emitting device and a manufacturing method thereof, and more particularly to a light emitting device including an LED bare chip as a light source element and a manufacturing method thereof.

  This type of light-emitting device is disclosed in Patent Document 1, for example. The light emitting device disclosed in the same document includes an insulating substrate having a parabolic concave portion, an LED bare chip disposed at the bottom of the concave portion of the insulating substrate, and an upper surface of the insulating substrate so as to close the opening of the concave portion. A cemented lens. On the insulating substrate, a conductive film formed by gold plating or the like is formed over the inner surface of the recess and the upper surface, side surface, or bottom surface of the insulating substrate. The conductive film is divided into a first conductive film on one side of the insulating substrate and a second conductive film on the other side of the insulating substrate. An LED bare chip is bonded to a portion of the first conductive film positioned at the bottom of the recess, and a portion of the second conductive film positioned at the bottom of the recess has a wire having one end connected to the upper surface of the LED bare chip. The other end is connected. A portion of the first conductive film located on the bottom surface of the insulating substrate functions as a first terminal for the mother substrate, and a portion of the second conductive film located on the bottom surface of the insulating substrate functions as a second terminal for the mother substrate. To do. The part located in the inner surface of the said recessed part of a 1st electrically conductive film and a 2nd electrically conductive film functions as a parabolic reflection surface.

  When the LED bare chip emits light by power feeding through the first conductive film and the second conductive film, the light is reflected by the parabolic reflecting surface and is incident on the incident surface of the lens in a condensed state. It is emitted with more directivity.

  The light emitting device disclosed in Patent Document 1 is excellent in downsizing and efficient light emission, but is a light emitting source, and the LED bare chip, which is also a heat generating source, has poor heat conductivity with the thin first conductor film sandwiched between them. Since it is provided on the insulating substrate, it cannot be said that the heat dissipation performance is excellent, and there is a concern that this adversely affects the life.

JP 2012-109475 A

  The present invention has been conceived under the above circumstances, and it is an object of the present invention to provide a light emitting device capable of efficient light emission and excellent in heat dissipation and a method for manufacturing the same. To do.

  In order to solve the above problems, the present invention employs the following technical means.

  That is, the light emitting device provided by the first aspect of the present invention includes a resin case having a bottom surface, a side surface, a top surface, and a recess recessed from the top surface, and a metal having an exposed surface exposed on the bottom surface of the case. A first terminal plate made of metal, a metal second terminal plate having an exposed surface exposed on the bottom surface of the case, and a part of the top surface of the first terminal plate at the bottom of the recess, A first conductor film covering a portion of the inner surface; a second conductor film covering a portion of the upper surface of the second terminal plate and covering a portion of the inner surface of the recess at the bottom of the recess; and the recess The LED bare chip bonded on the first conductor film and a conductive member for conducting between the LED bare chip and the second conductor film are provided at the bottom of the first conductor film.

  In a preferred embodiment, the exposed surface of the first terminal plate and the exposed surface of the second terminal plate are flush with or substantially flush with the bottom surface of the case.

  In a preferred embodiment, the inner surface of the recess is parabolic.

  In a preferred embodiment, the LED bare chip has a bottom electrode and a top electrode, the bottom electrode is bonded onto the first conductor film, and the top electrode is connected to the first electrode via a wire. Two conductor films are connected.

  In a preferred embodiment, the first conductor film extends to the upper surface of the case, and the second conductor film extends to the upper surface of the case.

  In a preferred embodiment, the first conductor film and the second conductor film are opposed to each other with a slit in plan view.

  In a preferred embodiment, the inner surface of the recess is covered with the first conductor film and the second conductor film sandwiching the slit.

  In a preferred embodiment, the first conductor film and the second conductor film are a plating film or a sputtered film.

  In a preferred embodiment, the first conductor film and the second conductor film have a thickness of 5000 to 40000 nm.

  In a preferred embodiment, the material of the first conductor film and the second conductor film is gold or an alloy containing gold as a main component.

  In a preferred embodiment, the bottom surface of the first terminal plate and the bottom surface of the second terminal plate are located in the same plane.

  In another preferred embodiment, the second terminal plate has an inner portion covered with the second conductor film displaced upward with respect to the bottom surface of the case, and below the inner portion, The resin constituting the case is contained.

  In a preferred embodiment, the first terminal plate and the second terminal plate are derived from a manufacturing frame.

  In a preferred embodiment, a lens member is placed on the upper surface of the case so as to close the opening of the recess.

  In a preferred embodiment, the lens member has a convex lens portion.

  In preferable embodiment, it has a rectangular parallelepiped shape as a whole.

  In a preferred embodiment, in the recess, the LED bare chip and the conductive member are covered with a protective resin.

  A method for manufacturing a light-emitting device provided by the second aspect of the present invention is a method for manufacturing a light-emitting device using a manufacturing frame having a first terminal portion and a second terminal portion facing the first terminal portion. The insert molding has a bottom surface, a top surface, and a recess recessed from the top surface, and a part of the first terminal portion and the second terminal portion are exposed to the bottom surface, and the first terminal is formed at the bottom of the recess. And forming a case so that a part of each upper surface of the first terminal plate and the second terminal part are exposed, and covering the part of the upper surface of the first terminal plate at the bottom of the concave part and the concave part A conductor film forming step of forming a first conductor film covering a part of the inner surface of the first terminal and a second conductor film covering a part of the upper surface of the second terminal plate and covering a part of the inner surface of the recess. , At the bottom of the recess, A chip bonding step of bonding the LED bare chip serial first conductive film, characterized in that it comprises a and a conduction step of conducting the conductive member between the LED bare chip and the second conductive film.

  In a preferred embodiment, in the case forming step, the concave portion is formed in a parapolar shape.

  In a preferred embodiment, in the conductor film forming step, the first conductor film and the second conductor film are formed by plating or sputtering.

  In a preferred embodiment, in the conductor film forming step, gold or an alloy containing gold as a main component is used as a material for the first conductor film and the second conductor film.

  In a preferred embodiment, the conductor film forming step includes forming a conductor film on the entire upper surface of the case or the entire bottom surface and inner surface of the recess, and then forming the slit to form the first conductor film. And the second conductor film.

  In a preferred embodiment, the conduction step is performed by connecting a wire between the upper electrode of the LED bare chip and the second conductor film.

  In a preferred embodiment, after the conduction step, a lens member installation step is performed in which a lens member is provided on the upper surface of the case so as to close the opening of the recess.

  In a preferred embodiment, after the conducting step, a protective resin filling step of covering the LED bare chip and the conductive member with a protective resin is performed.

  In the light emitting device having the above-described configuration, the inner surface of the recess provided in the case is covered with the first conductor film and the second conductor film, and the first conductor film and the second conductor film are preferably made of gold or gold. Since it is formed of the material used as the main component, it can function as a suitable reflecting surface that reflects the light emitted from the LED bearer chip disposed at the bottom of the recess toward the opening of the recess. Thereby, the luminous efficiency of the light emitting device is improved.

  The LED bare chip is bonded to the first conductor film in the recess of the case, but the first conductor film covers a part of the upper surface of the first terminal plate inserted in the bottom of the case, and the LED The second conductor film connected to the bare chip via the conductive member also covers the upper surface of the second terminal plate inserted in the bottom of the case. Therefore, in a state where the light emitting device is mounted on the mother board, power can be supplied from the first terminal plate and the second terminal plate to the LED bare chip through the first conductor film and the second conductor film without any problem.

  Since the first conductor film to which the LED bare chip is bonded covers a part of the upper surface of the first terminal board at the bottom of the concave portion of the case, the LED bare chip is mounted in a state where the light emitting device is mounted on the mother substrate. The generated heat can be effectively released to the mother board through the first terminal board. Therefore, the heat dissipation performance of the light emitting device is improved.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the drawings.

It is a top view of the light-emitting device concerning a 1st embodiment of the present invention, and omits and shows a lens member. It is sectional drawing which follows the II-II line of FIG. FIG. 3 is a partial plan view of an example of a manufacturing frame used for manufacturing the light emitting device shown in FIGS. 1 and 2. It is explanatory drawing of the manufacturing method of the light-emitting device shown in FIG. 1 and FIG. 2, and is a top view which shows the step which insert-molded the case part in the manufacturing frame. It is sectional drawing which follows the VV line of FIG. It is explanatory drawing of the manufacturing method of the light-emitting device shown in FIG.1 and FIG.2, and is a top view which shows the step which formed the conductor film in the upper surface of a case part and the whole region of a recessed part. It is sectional drawing which follows the VII-VII line of FIG. It is explanatory drawing of the manufacturing method of the light-emitting device shown to FIG. 1 and FIG. 2, and is a top view which shows the step which formed the slit in the conductor film. It is sectional drawing which follows the IX-IX line of FIG. It is explanatory drawing of the manufacturing method of the light-emitting device shown to FIG. 1 and FIG. 2, and is a top view which shows the step which bonded and bonded the LED bare chip to the recessed part of the case part. It is sectional drawing which follows the XI-XI line of FIG. It is explanatory drawing of the manufacturing method of the light-emitting device shown to FIG. 1 and FIG. 2, and sectional drawing which shows the step which attached the lens member. It is explanatory drawing of the manufacturing method of the light-emitting device shown in FIG. 1 and FIG. 2, and is a top view for demonstrating the step divided | segmented into each light-emitting device. It is a top view of the light-emitting device concerning a 2nd embodiment of the present invention, and omits and shows a lens member. It is sectional drawing which follows the XV-XV line | wire of FIG. It is sectional drawing of the light-emitting device which concerns on 3rd Embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 and 2 show a light emitting device A1 according to the first embodiment of the present invention, and FIGS. 3 to 13 show a method for manufacturing the light emitting device A1.

  The light emitting device A1 includes a resin case 100, a first terminal plate 200, a second terminal plate 300, a first conductor film 410, a second conductor film 420, an LED bare chip 500, a lens member 600, including.

  The case 100 has a bottom surface 101, a side surface 102, an upper surface 103, and a concave portion 110 that is recessed from the upper surface 103, and is made of, for example, a plating adhesive resin such as a liquid crystal polymer, and has a rectangular parallelepiped shape as a whole. . The recess 110 has a circular bottom 111 and an inner side 112 rising from the periphery of the bottom 111. The inner side 112 has a parabolic shape.

  The first terminal board 200 and the second terminal board 300 are inserted into the case 100 so as to have exposed surfaces 201 and 301 exposed at the bottom surface 101 of the case 100 at the lower part of the case 100, respectively. As shown in FIG. 1, the first terminal board 200 includes a terminal base 210 having a rectangular shape in plan view, and a rectangular terminal peninsula 220 extending inwardly from the terminal base 210. The tip of the terminal peninsula 220 is partially overlapped with the circular bottom 111 of the recess 110. As shown in FIG. 1, the second terminal plate 300 also has a terminal base portion 310 that is rectangular in plan view, and a rectangular terminal peninsula portion 320 that extends inwardly from the terminal base portion 310. The terminal peninsula 320 is overlapped with the circular bottom 111 such that the tip thereof extends further to the first terminal board 200 side than the center of the circular bottom 111 of the recess 110. As shown in FIG. 1, the tip 221 of the terminal peninsula 220 of the first terminal board 200 and the tip 321 of the terminal peninsula 210 of the second terminal board 300 are opposed to each other in parallel at a predetermined interval. Yes.

  The first terminal board 200 and the second terminal board 300 are located in the same plane with the same thickness. Therefore, the exposed surface 201 of the first terminal board 200 is the same as the planar shape of the first terminal board 200, and the exposed surface 301 of the second terminal board 300 is also the same as the planar shape of the second terminal board 300. In the present embodiment, as shown in FIG. 2, the exposed surface 201 of the first terminal board 200 and the exposed surface 301 of the second terminal board 300 are flush with or substantially flush with the bottom surface 101 of the case 100. It has become. The outer end surface 211 of the terminal base 210 of the first terminal plate 200 and the outer end surface 311 of the terminal base 310 of the second terminal plate 300 are exposed on the opposite side surface 102 of the case 100 in a flush manner. The thicknesses of the first terminal plate 200 and the second terminal plate 300 correspond to the thickness of the bottom 111 of the recess 110 of the case 100, that is, the distance between the bottom 111 of the recess 110 and the bottom surface 101 of the case 100. Therefore, the first terminal plate 200 and the second terminal plate 300 are exposed in a flush manner at the bottom 111 of the recess 110. The first terminal board 200 and the second terminal board 300 are made of metal such as 4-2 alloy, for example, and are derived from the manufacturing frame 700 as described later.

  The first conductor film 410 and the second conductor film 420 are opposed to each other with the slit 401 extending linearly between the terminal peninsula portion 220 of the first terminal plate 200 and the terminal peninsula portion 320 of the second terminal plate 300. Thus, it is formed over the bottom 111 of the recess 110, the inner side surface 112, or the upper surface 103 of the case 100. The first conductor film 410 and the second conductor film 420 are made of, for example, gold or an alloy containing gold as a main component, and as will be described later, the upper surface 103 of the case 100 or the entire surface of the recess 110 is plated or sputtered. After the conductor film 400 having a thickness of about 5000 to 40000 nm is formed, the slit 401 is formed by, for example, laser irradiation. By forming in this way, in the present embodiment, the first conductor film 410 and the second conductor film 420 are formed over the upper surface 103 of the case 100 as well as the recess 110. As described above, since the first terminal plate 200 and the second terminal plate 300 are exposed at the bottom 111 of the recess 110, the first conductor film 410 is exposed to the first terminal plate 200 and the second conductor film 420. Are respectively conducted to the second terminal board 300.

  The LED bare chip 500 is a known light emitting element having a lower surface electrode and an upper surface electrode, and is bonded onto the first conductor film 410 at the bottom 111 of the recess 110. Preferably, as can be seen from FIG. 1, the LED bare chip 500 is bonded to a region corresponding to the terminal peninsula 220 of the first terminal board 200 in the bottom 111 of the recess 110. One end of a wire 510 as a conductive member is connected to the upper electrode of the LED bare chip 500, and the other end of the wire 510 is connected to the second conductor film 420 at the bottom 111 of the recess 110. Preferably, as can be seen from FIG. 1, the other end of the wire 510 is connected to a region corresponding to the terminal peninsula 320 of the second terminal plate 300 in the bottom 111 of the recess 110.

  The lens member 600 has the same planar shape as the case 100 and is installed on the upper surface 103 of the case 100 by a technique such as adhesion so as to close the opening of the concave portion 110. In the present embodiment, the lens member 600 is made of, for example, a transparent resin having a convex lens portion 610 by forming a convex bulge portion on the lower surface.

  Next, an example of a manufacturing method of the light emitting device A1 having the above configuration will be described with reference to FIGS.

  FIG. 3 is a partial plan view of a manufacturing frame 700 used for manufacturing the light emitting device A1. The manufacturing frame 700 is made of metal such as 4-2 alloy having a predetermined thickness, and the first terminal portion 200a and the second terminal portion 300a are separated from the side supports 710 and 710 spaced apart by a predetermined interval. It extends in the direction of each other. The first terminal portion 200a has a rectangular base portion 210a and a rectangular peninsula portion 220a extending from the base portion. The second terminal portion 300a also has a rectangular base portion 310a and a rectangular peninsula portion 320a extending from the base portion 310a. A plurality of pairs of the first terminal portion 200a and the second terminal portion 300a facing each other are arranged in a direction in which the side support 710 extends. In FIG. 3, a plurality of rectangular areas surrounded by the virtual line 750 are areas occupied by the light emitting device A1.

  As shown in FIGS. 4 and 5, a case portion 100a is formed on the manufacturing frame 700 by an insert molding technique. As described above, the case portion 100a is formed of a plating adhesive resin such as a liquid crystal polymer. In the present embodiment, the case portion 100a is formed as a series of configurations to be a plurality of cases 100, but may be formed so that the individual cases 100 are independent. The case portion 100a has a recess 110 that is recessed from the upper surface 103 thereof, and the peninsula portions 220a and 320a of the first terminal portion 200a and the second terminal portion 300a are flush with the bottom portion 111 of the recess portion 110. To be exposed.

  Next, as shown in FIGS. 6 and 7, for example, gold or gold as a main component is formed by plating or sputtering on the entire surface of the recess 110 from the upper surface 103 of the case portion 100a. In this embodiment, since the case part 100a is formed with plating adhesive resin, it is possible to form the conductor film 400 by plating. The thickness of the conductor film 400 is, for example, 5000 to 40000 nm.

  Next, as shown in FIGS. 8 and 9, the conductor film 400 is divided into a first conductor film 410 and a second conductor film 420 by forming slits 401 in the conductor film 400. The slit 401 is formed to extend linearly between the tips 221a and 321a of the peninsula portions 220a and 320a of the first terminal portion 200a and the second terminal portion 300a. The slit 401 can be formed by, for example, laser irradiation.

  Next, as shown in FIGS. 10 and 11, the LED bare chip 500 is bonded onto the first conductor film 410 at the bottom 111 of the recess 110, and the upper electrode of the LED bare chip 500 and the second conductor film 420 are bonded together. They are connected by a wire 510.

  Next, as shown in FIG. 12, the lens member 600 is installed on the upper surface 103 of the case portion 100a. The lens member 600 may have a form in which a plurality of portions corresponding to the individual light emitting devices A1 are connected in the same manner as the case portion 100a.

  Finally, as shown in FIG. 13, unnecessary portions of the manufacturing frame 700 are cut along the line L1, and cut along the line L2 and divided to obtain the individual light emission shown in FIG. 1 and FIG. Device A1 is obtained.

  Next, the operation of the light emitting device A1 will be described.

  In the light emitting device A1 configured as described above, the inner surface 112 of the recess 110 provided in the case 100 is covered with the first conductor film 410 and the second conductor film 420 in almost the entire area except the slit 401. Since the conductor film 410 and the second conductor film 420 are made of gold or a material whose main component is gold, the light emitted from the LED bare chip 500 disposed on the bottom 111 of the recess 110 is directed toward the opening of the recess 110. It can function as a suitable reflecting surface that reflects. Further, since the recess 110 has a parabolic shape, the reflection efficiency can be further increased. Furthermore, since the convex lens portion 610 of the lens member 600 is located in the opening of the concave portion 110, light with improved efficiency can be emitted with good directivity. For these reasons, the light emitting device A1 has excellent light emission efficiency.

  The LED bare chip 500 is bonded to the first conductor film 410 in the recess 110 of the case 100, but the first conductor film 410 covers a part of the first terminal board 200 inserted in the case 100. The second conductor film 420 connected to the LED bare chip 500 via the wire 510 also covers the second terminal plate 300 inserted in the case 100. Therefore, in a state where the light emitting device A1 is mounted on the mother board, the LED bare chip 500 is fed with no problem from the first terminal board 200 and the second terminal board 300 via the first conductor film 410 and the second conductor film 420. It can be performed.

  Since the first conductor film 410 to which the LED bare chip 500 is bonded covers a part of the first terminal board 200 at the bottom 111 of the recess 110 of the case 100, the light emitting device A1 is mounted on the mother substrate. , The heat generated by the LED bare chip 500 can be effectively released to the mother board via the metal first terminal board 200. Therefore, the heat dissipation performance of the light emitting device A1 is improved. As a result, the lifetime of the light emitting device A1 can be extended.

  14 and 15 show a light emitting device A2 according to the second embodiment of the present invention. In these drawings, members or portions that are the same as or similar to those of the light emitting device A1 according to the first embodiment shown in FIG. 1 and FIG. Detailed description is omitted.

  In the light emitting device A2, the configuration of the concave portion 110 of the case 100 is configured such that the bottom portion 111 has a low-order part 111a on the first terminal board 200 side and a high-order part 111b on the second terminal board 300 side. The terminal peninsula 320 of the second terminal board 300 is raised. More specifically, the upper surface of the raised terminal peninsula 320 of the second terminal plate 300 is exposed to be flush with the higher portion 111b of the bottom 111 of the recess 110, and the lower portion 111a of the bottom 111 of the recess 110 is exposed. Further, the upper surface of the terminal peninsula 220 of the first terminal board 200 is exposed in a flush manner.

  The first conductor film 410 and the second conductor film 420 are formed by forming the conductor film 400 over the entire upper surface 103 and the recess 110 of the case 100 and then forming the slit 401 in the conductor film 400. The slit 401 is a straight line between the terminal peninsula portion 220 of the first terminal plate 200 and the distal ends 221 and 321 of the terminal peninsula portion 320 of the second terminal plate 300 so as to pass through the distal end portion of the higher portion 111 b of the bottom portion 111 of the recess 110. It is formed in a shape.

  The light emitting device A2 according to the present embodiment also exhibits the following operation in addition to the same operation as described above for the light emitting device A1 according to the first embodiment.

  As shown in FIG. 15, since the resin forming the case 100 has entered under the raised terminal peninsula 320 of the second terminal board 300, the first terminal board 200 is formed on the bottom surface of the light emitting device A <b> 2. The distance between the exposed surface 201 and the exposed surface 301 of the second terminal board 300 becomes longer. Therefore, when the light emitting device A2 is mounted on the mother substrate by, for example, a solder reflow technique, it is difficult to cause a problem that the first terminal board 200 and the second terminal board 300 are short-circuited by the solder.

  FIG. 16 shows a light emitting device A3 according to a third embodiment of the present invention. In this figure, members or portions that are the same as or similar to those of the light emitting device A1 according to the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and are described in detail with a focus on the differences. The detailed explanation is omitted.

  In the light emitting device A3, without providing the lens member 600, the concave portion 110 of the case 100 is filled with a protective resin 800 including, for example, a silicone resin including the LED bare chip 500 and the wire 510.

  With this configuration, the LED bare chip 500 and the wire 510 can be appropriately protected without providing the lens member 600.

  Note that the light-emitting device A3 according to the present embodiment can also exhibit the same operation as described above for the light-emitting device A1 according to the first embodiment, except for the operation relating to the lens member 600.

  In the light emitting device A3 according to the present embodiment, the lens member 600 can be added as in the light emitting device A1 according to the first embodiment.

  Of course, the scope of the present invention is not limited to the above-described embodiments, and all design changes within the scope of matters described in the claims are all included in the scope of the present invention.

  For example, the conductor film 400 is composed of a single layer of gold or an alloy containing gold as a main component, a base layer of copper (for example, about 20 μm thick), and a nickel layer (for example, a thickness of 5 to 10 μm) thereon. Of course, a multilayer structure made of a conductive material in which a surface layer made of gold (for example, 0.1 to 1.0 μm) is further laminated thereon may be used.

A1 Light-emitting device A2 Light-emitting device A3 Light-emitting device 100 Case 100a Case portion 101 Bottom surface 102 Side surface 103 Top surface 110 Recess 111 Bottom portion 111b Higher portion 112 Inner side surface 200 First terminal plate 200a First terminal portion 201 Exposed surface 210 Terminal base portion 210a Rectangular base 211 Outer end surface 220 Terminal peninsula 220a Peninsula 221 Tip 221a Tip 300 Second terminal board 300a Second terminal 301 Exposed surface 310 Terminal base 310a Rectangular base 311 Outer end 320 Terminal peninsula 320a Peninsula 321 Tip 321a Tip 400 Conductor film 401 Slit 410 First conductor film 420 Second conductor film 500 LED bare chip 510 Conductive member (wire)
600 Lens member 610 Convex lens part 700 Manufacturing frame 710 Side support 750 Area 800 Protective resin L1 line L2 line

Claims (25)

A resin case having a bottom surface, a side surface, a top surface and a recess recessed from the top surface;
A metal first terminal board having an exposed surface exposed on the bottom surface of the case;
A metal second terminal plate having an exposed surface exposed at the bottom of the case;
A first conductor film covering a part of the upper surface of the first terminal plate and a part of the inner surface of the recess at the bottom of the recess;
A second conductor film covering a part of the upper surface of the second terminal plate and a part of the inner surface of the recess at the bottom of the recess;
LED bare chip bonded on the first conductor film at the bottom of the recess,
A conductive member that conducts between the LED bare chip and the second conductor film;
A light-emitting device comprising:   2. The light emitting device according to claim 1, wherein an exposed surface of the first terminal plate and an exposed surface of the second terminal plate are flush with or substantially flush with the bottom surface of the case.   The light emitting device according to claim 1, wherein an inner side surface of the concave portion has a parabolic shape.   The LED bare chip has a bottom electrode and a top electrode, the bottom electrode is bonded onto the first conductor film, and the top electrode is connected to the second conductor film via a wire. The light-emitting device according to claim 1.   5. The light emitting device according to claim 1, wherein the first conductor film extends to an upper surface of the case, and the second conductor film extends to an upper surface of the case.   The light emitting device according to claim 1, wherein the first conductor film and the second conductor film are opposed to each other with a slit interposed therebetween in a plan view.   The light emitting device according to claim 6, wherein an inner surface of the recess is covered with the first conductor film and the second conductor film sandwiching the slit.   The light emitting device according to claim 1, wherein the first conductor film and the second conductor film are a plating film or a sputtered film.   The light emitting device according to claim 8, wherein the first conductor film and the second conductor film have a thickness of 5000 to 40000 nm.   The light emitting device according to any one of claims 1 to 9, wherein a material of the first conductor film and the second conductor film is gold or an alloy containing gold as a main component.   The light emitting device according to claim 1, wherein a bottom surface of the first terminal plate and a bottom surface of the second terminal plate are located in the same plane.   In the second terminal plate, an inner portion covered with the second conductor film is displaced upward with respect to the bottom surface of the case, and a resin constituting the case enters below the inner portion. The light-emitting device according to claim 1.   The light emitting device according to claim 1, wherein the first terminal plate and the second terminal plate are derived from a manufacturing frame.   The light-emitting device according to claim 1, wherein a lens member is placed on an upper surface of the case so as to close an opening of the concave portion.   The light emitting device according to claim 14, wherein the lens member has a convex lens portion.   The light emitting device according to claim 14 or 15, which has a rectangular parallelepiped shape as a whole.   The light emitting device according to claim 1, wherein the LED bare chip and the conductive member are covered with a protective resin in the recess. A method of manufacturing a light emitting device using a manufacturing frame having a first terminal portion and a second terminal portion facing the first terminal portion,
The resin insert molding has a bottom surface, a top surface, and a recess recessed from the top surface, and a part of the first terminal portion and the second terminal portion are exposed on the bottom surface, and the first portion is formed on the bottom portion of the recess. A case forming step of forming a case such that a part of each upper surface of the terminal portion and the second terminal portion is exposed;
A first conductor film that covers a part of the upper surface of the first terminal plate and a part of an inner surface of the recess and covers a part of the upper surface of the second terminal plate at the bottom of the recess, and A conductor film forming step of forming a second conductor film covering a part of the inner surface of the recess;
A chip bonding step of bonding an LED bare chip on the first conductor film at the bottom of the recess;
A conduction step of conducting between the LED bare chip and the second conductor film by a conductive member;
The manufacturing method of the light-emitting device characterized by including.   The method of manufacturing a light emitting device according to claim 18, wherein in the case forming step, the concave portion is formed in a parapolar shape.   The method for manufacturing a light emitting device according to claim 18 or 19, wherein, in the conductor film forming step, the first conductor film and the second conductor film are formed by plating or sputtering.   21. The method of manufacturing a light-emitting device according to claim 18, wherein in the conductor film forming step, gold or an alloy containing gold as a main component is used as a material of the first conductor film and the second conductor film. .   The conductor film forming step includes forming a conductor film on the entire upper surface of the case or the bottom and inner side surfaces of the recess, and then forming slits to form the conductor film as the first conductor film and the second conductor film. The method for manufacturing a light-emitting device according to any one of claims 18 to 21, wherein the method is performed separately.   The method of manufacturing a light emitting device according to any one of claims 18 to 22, wherein the conducting step is performed by connecting the upper surface electrode of the LED bare chip and the second conductor film with a wire.   The method for manufacturing a light emitting device according to any one of claims 1 to 23, wherein a lens member installation step of providing a lens member on an upper surface of the case so as to close the opening of the concave portion is performed after the conduction step.   The manufacturing method of the light-emitting device according to any one of claims 18 to 23, wherein a protective resin filling step of covering the LED bare chip and the conductive member with a protective resin is performed after the conduction step.

Images