JP2015079835A - Optical semiconductor device, lead frame for optical semiconductor device, and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical semiconductor device and a lead frame used for the same, capable of suppressing infiltration of moisture or the like from a bonding interface between a reflector part and an electrode part, suppressing corrosion of the reflector part, and thereby obtaining a high total luminous flux value based on a high reflectance of the reflector part.SOLUTION: A lead frame for an optical semiconductor device and the optical semiconductor device are configured to include: a first terminal part having an element placing part on one surface side thereof; a second terminal part positioned separately from the first terminal part; and a reflector part which is provided so as to surround the element placing part on the one surface side of the first terminal part, and has an insulative wall part and a metal thin film layer provided on a reflection surface which is a surface of the wall on the side of the element placing part. A wall on the side of the second terminal part is provided so as to cross the gap between the first terminal part and the second terminal part, and thereby the first terminal part and the second terminal part are connected with each other. The metal thin film layer is provided so as to cover the interface between the element placing part and the reflection surface.

Description

  The present invention relates to an optical semiconductor device used for a lighting fixture, a display, a backlight of a mobile phone, a moving image illumination auxiliary light source, other general consumer light sources, a lead frame suitable for the optical semiconductor device, and a manufacturing method thereof.

  A surface-mounted light-emitting device using a light-emitting element emits light of a bright color that is small and power efficient. In addition, since this light emitting element is a semiconductor element, there is no fear of a broken ball. Further, it has excellent initial driving characteristics and is strong against vibration and repeated on / off lighting. Because of such excellent characteristics, an optical semiconductor device using a light emitting element such as a light emitting diode (LED) or a laser diode (LD) is used as various light sources.

  A conventional optical semiconductor device and a lead frame used in the conventional optical semiconductor device are obtained by molding a thermosetting resin by injection molding on a metal substrate constituting an electrode portion, and using the molding resin as a reflector portion (light reflector) The structure used as the mainstream has become the mainstream (see Patent Document 1).

  However, in the configuration as described above, since there is a bonding interface between the reflector part and the metal substrate, that is, the electrode part, moisture or the like permeates into the reflector part from the bonding interface and corrodes the reflector part. There is a case to let you. Therefore, there is a problem that the total luminous flux emitted from the reflector portion is reduced.

  In addition, since the reflector portion is formed by injection molding, there is a problem that it is difficult to align and miniaturize the reflector portion.

JP 2006-156704 A

  The present invention is a simple method and inherently has a high reflectance, suppresses penetration of moisture and the like from the bonding interface between the reflector part and the electrode part, suppresses corrosion of the reflector part, and the reflector part An object of the present invention is to provide a small optical semiconductor device and a lead frame used in the optical semiconductor device.

In order to achieve the above object, the present invention provides:
A first terminal portion having an element mounting portion on one surface side;
A second terminal portion positioned away from the first terminal portion;
Provided on the one surface of the first terminal portion so as to surround the element mounting portion, and provided on a wall portion which is an insulator and a reflection surface which is a surface of the wall portion on the element mounting portion side. A reflector portion having a metal thin film layer;
A light emitting device disposed on the device mounting portion and electrically connected to the metal thin film layer and the second terminal portion;
Sealing resin provided so as to cover the light emitting element and the metal thin film layer,
By providing the wall portion on the second terminal portion side so as to straddle the gap between the first terminal portion and the second terminal portion, the first terminal portion and the second terminal portion are provided. Is connected to the terminal
The metal thin film layer is provided so as to cover an interface between the element mounting portion and the reflection surface.

The present invention also provides:
A first terminal portion having an element mounting portion on one surface side;
A second terminal portion positioned away from the first terminal portion;
Provided on the one surface of the first terminal portion so as to surround the element mounting portion, and provided on a wall portion which is an insulator and a reflection surface which is a surface of the wall portion on the element mounting portion side. A reflector portion having a metal thin film layer,
By providing the wall portion on the second terminal portion side so as to straddle the gap between the first terminal portion and the second terminal portion, the first terminal portion and the second terminal portion are provided. Is connected to the terminal
The metal thin film layer relates to a lead frame for an optical semiconductor device, wherein the metal thin film layer is provided so as to cover an interface between the element mounting portion and the reflection surface.

  According to the optical semiconductor device and the optical semiconductor device lead frame of the present invention, the metal provided on the reflection surface, which is the surface on the element mounting portion side of the first electrode portion of the wall portion, which is the insulator, of the reflector portion. The thin film layer is provided so as to cover the interface between the element mounting portion of the first terminal portion and the reflecting surface of the reflector portion. That is, since the metal thin film layer is formed at the coupling interface between the reflector unit and the electrode unit, the metal thin film layer can suppress the penetration of moisture and the like from the coupling interface to the reflector unit. It is possible to suppress corrosion and obtain a high total luminous flux value based on the high reflectance of the reflector portion.

  In addition, since the metal thin film layer is disposed on the reflecting surface of the reflector portion, high reflectivity due to the metal thin film layer is associated with the effect of suppressing the corrosion of the reflector portion as described above. It is possible to obtain a high total luminous flux value based on.

  Further, since the metal thin film layer is formed on the reflecting surface of the reflector portion, the heat from the light emitting element can be dissipated not only from the surface of the electrode portion but also from the metal thin film layer, that is, from the reflector portion. Can also dissipate heat. Accordingly, it is possible to prevent malfunction of the light emitting element due to the heat generation, dissolution of the sealing resin of the optical semiconductor device, and the like.

  Furthermore, according to the lead frame for an optical semiconductor device and the optical semiconductor device of the present invention, the wall portion on the second terminal portion side is provided so as to straddle the gap between the first terminal portion and the second terminal portion. Since the first terminal portion and the second terminal portion are connected to each other, an effect of being able to take an integrated package form can be obtained.

  In one embodiment of the present invention, a second metal thin film layer is provided from the second terminal portion to a surface that is not a reflecting surface of the wall portion, and the light emitting element and the second terminal portion are formed of the second metal. It can be electrically connected through a thin film layer. Thereby, in this case, the length of the terminal portion (wire or the like) for connecting the light emitting element and the second terminal portion can be shortened.

  In one embodiment of the present invention, the height of the wall portion on the second terminal portion side can be made lower than the height on the side that is not on the second terminal portion side. Thereby, for example, when the light emitting element and the metal thin film layer are covered with the sealing resin and the second terminal portion is covered, even if a part of the sealing resin is deposited on the wall portion on the second terminal side, The height of the deposition portion can be reduced. Therefore, the height of the optical semiconductor device can be reduced, and the optical semiconductor device can be downsized.

  Furthermore, in one aspect of the present invention, the first terminal portion may have a copper surface on one surface side, and the metal thin film layer may have a copper thin film layer and a silver thin film layer that are sequentially stacked from the reflective surface side. . Thereby, the light emitted from the light emitting element is reflected by the silver thin film layer, so that the light emission efficiency is increased. In addition, since the first terminal portion and the metal thin film layer contain the same component and are firmly bonded, even if corrosive gas or moisture penetrates into the interface between the element mounting portion and the reflecting surface. It becomes difficult to reach the surface (copper thin film layer) of the reflecting surface. Therefore, corrosion of the reflector portion can be more effectively suppressed.

  In one embodiment of the present invention, the metal thin film layer can be provided over the entire reflective surface. In this case, even if the corrosive gas or moisture permeates through the interface from the terminal side, there is no outlet for the corrosive gas up to the upper part of the wall. Therefore, it is difficult to reach the surface opposite to the reflecting surface, that is, the surface that reflects the light from the light emitting element. Therefore, corrosion of the reflector portion can be more effectively suppressed.

  Furthermore, in one embodiment of the present invention, the first terminal portion has a third terminal portion that is positioned away from the first terminal portion on the side that is not the second terminal portion side, By providing the wall on the terminal portion side so as to straddle the gap between the first terminal portion and the third terminal portion, the first terminal portion and the third terminal portion are connected, and light emission Instead of being electrically connected to the metal thin film layer, the element can be electrically connected to the third terminal portion. Accordingly, since the electrical connection between the light emitting element and the terminal portion can be performed outside the reflective surface, it is not necessary to provide a region necessary for electrical connection on the reflective surface. For this reason, reflection efficiency can be improved. Moreover, since the element mounting portion can be made compact, the distance between the light emitting element and the reflecting surface can be shortened, and the reflection efficiency can be further improved.

  The above-described lead frame for an optical semiconductor device and the optical semiconductor device can be manufactured by any manufacturing method, but can be preferably obtained by the following manufacturing method.

That is,
The manufacturing method of the optical semiconductor device is as follows:
A first step of preparing a laminate having a metal layer and an insulating layer laminated on one surface of the metal layer;
A second step of forming a wall provided so as to surround the element mounting portion on the one surface by providing a mask on the insulating layer and etching the insulating layer;
A plating process is performed on the element mounting portion and the wall portion to form a metal thin film layer that covers an interface between the element mounting portion and a reflection surface that is a surface of the wall portion on the element mounting portion side. A third step of forming a reflector portion having the wall portion and the metal thin film layer;
By providing a mask on the metal layer and performing an etching process on the metal layer, the first terminal portion and the first terminal portion are located apart from the first terminal portion by the wall portion. A fourth step of forming a second terminal portion connected to
A fifth step of mounting a light emitting element on the element mounting portion;
A sixth step of filling the element mounting portion with a resin and sealing the light emitting element and the metal thin film layer;
It is characterized by having.

Moreover, the manufacturing method of the lead frame for optical semiconductor devices is as follows:
A first step of preparing a laminate having a metal layer and an insulating layer laminated on one surface of the metal layer;
A second step of forming a wall provided so as to surround the element mounting portion on the one surface by providing a mask on the insulating layer and etching the insulating layer;
A plating process is performed on the element mounting portion and the wall portion to form a metal thin film layer that covers an interface between the element mounting portion and a reflection surface that is a surface of the wall portion on the element mounting portion side. A third step of forming a reflector portion having the wall portion and the metal thin film layer;
By providing a mask on the metal layer and performing an etching process on the metal layer, the first terminal portion and the first terminal portion are located apart from the first terminal portion by the wall portion. A fourth step of forming a second terminal portion connected to
It is characterized by having.

  As described above, according to the present invention, by a simple method, it inherently has high reflectivity, suppresses penetration of moisture and the like from the coupling interface between the reflector part and the electrode part, and suppresses corrosion of the reflector part. In addition, it is possible to obtain a high total luminous flux value based on the high reflectance of the reflector section, and it is possible to provide a more compact optical semiconductor device and a lead frame used therefor.

It is sectional drawing which shows schematic structure of an example of the lead frame for optical semiconductor devices in embodiment. It is an upper top view showing a schematic structure of an example of a lead frame for optical semiconductor devices in an embodiment. It is a bottom plan view showing a schematic configuration of an example of a lead frame for an optical semiconductor device in an embodiment. It is sectional drawing which shows schematic structure of the other example of the lead frame for optical semiconductor devices in embodiment. It is an upper top view which shows schematic structure of the other example of the lead frame for optical semiconductor devices in embodiment. It is a bottom plan view showing a schematic structure of another example of a lead frame for optical semiconductor devices in an embodiment. It is sectional drawing which shows schematic structure of an example of the optical semiconductor device in embodiment. It is an upper top view showing a schematic structure of an example of an optical semiconductor device in an embodiment. It is a bottom plan view showing a schematic structure of an example of an optical semiconductor device in an embodiment. It is sectional drawing which shows schematic structure of the other example of the optical semiconductor device in embodiment. It is an upper top view which shows schematic structure of the other example of the optical semiconductor device in embodiment. It is a bottom plan view showing a schematic structure of another example of a lead frame for optical semiconductor devices in an embodiment. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. 1 is an upper plan view showing a schematic configuration of a multi-chip lead frame for an optical semiconductor device in an embodiment. FIG. FIG. 22 is a bottom plan view showing a schematic configuration of the lead frame for an optical semiconductor device shown in FIG. 21. It is sectional drawing along the II line which shows schematic structure of the lead frame for optical semiconductor devices shown in FIG. 1 is an upper plan view showing a schematic configuration of a multi-chip optical semiconductor device in an embodiment. FIG. 25 is a lower plan view illustrating a schematic configuration of the optical semiconductor device illustrated in FIG. 24. It is sectional drawing along the II-II line | wire which shows schematic structure of the optical semiconductor device shown in FIG. It is sectional drawing which shows schematic structure of the other example of the lead frame for optical semiconductor devices in embodiment. It is an upper top view which shows schematic structure of the other example of the lead frame for optical semiconductor devices in embodiment. It is a bottom plan view showing a schematic configuration of another example of the lead frame for optical semiconductor devices in the embodiment. It is sectional drawing which shows schematic structure of the other example of the lead frame for optical semiconductor devices in embodiment. It is an upper top view which shows the other schematic structure of the lead frame for optical semiconductor devices in embodiment. It is a bottom plan view showing a schematic configuration of another example of the lead frame for optical semiconductor devices in the embodiment. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. It is sectional drawing which shows 1 process of the manufacturing method of the lead frame for optical semiconductor devices in an embodiment, and an optical semiconductor device. 1 is an upper plan view showing a schematic configuration of a multi-chip lead frame for an optical semiconductor device in an embodiment. FIG. FIG. 39 is a lower plan view showing a schematic configuration of the lead frame for an optical semiconductor device shown in FIG. 38. It is sectional drawing along the III-III line | wire which shows schematic structure of the lead frame for optical semiconductor devices shown in FIG. 1 is an upper plan view showing a schematic configuration of a multi-chip optical semiconductor device in an embodiment. FIG. 42 is a lower plan view illustrating a schematic configuration of the optical semiconductor device illustrated in FIG. 41. FIG. 44 is a cross-sectional view taken along line IV-IV showing a schematic configuration of the optical semiconductor device shown in FIG. 42. It is sectional drawing which shows schematic structure of the other example of the optical semiconductor device in embodiment. It is an upper top view which shows schematic structure of the other example of the optical semiconductor device in embodiment. It is a bottom plan view showing a schematic structure of another example of a lead frame for optical semiconductor devices in an embodiment. It is sectional drawing which shows schematic structure of the other example of the optical semiconductor device in embodiment. It is an upper top view which shows schematic structure of the other example of the optical semiconductor device in embodiment. It is a bottom plan view showing a schematic configuration of another example of the lead frame for optical semiconductor devices in the embodiment. It is sectional drawing which shows schematic structure of an example of the lead frame for multi-surface manufacture type optical semiconductor devices in embodiment. It is sectional drawing which shows schematic structure at the time of dividing into a VV line the lead frame for optical semiconductor devices of the multi-surface manufacture type shown in FIG. It is sectional drawing which shows schematic structure of the optical semiconductor device in embodiment. FIG. 53 is an upper plan view showing a schematic configuration of the optical semiconductor device shown in FIG. 52. FIG. 53 is a lower plan view showing a schematic configuration of the optical semiconductor device shown in FIG. 52.

(First embodiment)
FIG. 1 is a cross-sectional view showing a schematic configuration of an optical semiconductor device lead frame in the present embodiment, FIG. 2 is an upper plan view showing a schematic configuration of the optical semiconductor device lead frame, and FIG. It is a bottom plan view showing a schematic configuration of the lead frame for an optical semiconductor device.

  As shown in FIGS. 1 to 3, the optical semiconductor device lead frame 10 of the present embodiment is separated from the first terminal portion 11 having the element mounting portion 11 </ b> A on one surface side and the first terminal portion 11. And a second terminal portion 12 positioned at the same position. In addition, the first wall portion 131 and the second wall portion which are provided so as to surround the element mounting portion 11A of the first terminal portion 11 and are made of an insulator and spaced apart from the second terminal portion 12. The metal thin film layer provided on the reflection surfaces 131A and 132A which are the surfaces on the element mounting portion 11A side in the second wall portion 132 on the terminal portion 12 side, the first wall portion 131, and the second wall portion 132. The reflector part 13 having 133 is provided.

  The second wall portion 132 on the second terminal portion 12 side is provided so as to straddle the gap between the first terminal portion 11 and the second terminal portion 12, and the second wall portion 132. Thus, the first terminal portion 11 and the second terminal portion 12 are connected. Furthermore, the metal thin film layer 133 is provided so as to cover the interface IS between the element mounting portion 11A and the reflecting surfaces 131A and 132A.

  Further, as shown in FIGS. 1 and 2, in the present embodiment, the second wall portion 132 is located on the second terminal portion 12 and is opposed to the second wall portion 132. The third wall portion 16 is located, and a part 12A of the upper surface of the second terminal portion 12 is exposed in the space formed by the second wall portion 132 and the third wall portion 16. The second metal thin film layer 17 is disposed on the opposing surfaces of the second wall portion 132 and the third wall portion 16. The second metal thin film layer 17 extends to the upper surface of the second wall 132 without reaching the reflecting surface 132A.

  In addition, the 2nd terminal part 12 side takes such a structure in order to shorten the length of the terminal part (wire etc.) for connecting the light emitting element mounted later and the 2nd terminal part. .

  In the present embodiment, the metal thin film layer 133 is provided so as to cover the interface IS between the element mounting portion 11 </ b> A in the first terminal portion 11 and the reflecting surfaces 131 </ b> A and 132 </ b> A in the reflector portion 13. Therefore, the metal thin film layer 133 can suppress the penetration of moisture and the like from the interface IS into the reflector portion 13, suppress the corrosion of the reflector portion 13, and increase the total luminous flux based on the high reflectance of the reflector portion 13. A value can be obtained.

  In addition, since the metal thin film layer 133 is disposed on the reflecting surfaces 131A and 132A of the reflector portion 13, the metal thin film layer 133 is coupled with the effect of suppressing the corrosion of the reflector portion 13 as described above. It becomes possible to obtain a high total luminous flux value based on the resulting high reflectance.

  Further, since the metal thin film layer 133 is formed on the reflecting surfaces 131A and 132A of the reflector unit 13, heat from the light emitting element to be formed later is transmitted not only from the surface of the first electrode unit 11, but also from the metal thin film layer 133. Can also be dissipated, that is, the reflector 13 can also dissipate heat. Accordingly, it is possible to prevent malfunction of the light emitting element due to the heat generation, dissolution of the sealing resin of the optical semiconductor device, and the like.

  Furthermore, in the optical semiconductor device lead frame 10 of the present embodiment, the first wall portion 132 is provided so as to straddle the gap between the first terminal portion 11 and the second terminal portion 12. Thus, since the first terminal portion 11 and the second terminal portion 12 are connected to each other, it is possible to obtain an operational effect that it is possible to take an integrated package form.

  Further, as shown in FIGS. 1 and 2, etc., the metal thin film layer 133 is provided on the entire reflecting surfaces 131A and 132A. Therefore, even if corrosive gas or moisture permeates through the interface IS from the first terminal portion 11 side, the corrosive gas or the like reaches the top of the first wall portion 131 and the second wall portion 132. Therefore, the corrosive gas or the like reaches the surface of the metal thin film layer 133 on the side facing the reflecting surfaces 131A and 132A and the surface (surface) on the side that reflects the light from the light emitting element mounted later. It becomes difficult to do. Therefore, corrosion of the reflector part 13 can be suppressed more effectively.

  The insulators constituting the first wall portion 131, the second wall portion 132, and further the third wall portion 16 are preferably etchable in consideration of the manufacturing method described below. Although it can be comprised from a polyimide resin, an epoxy resin, an acrylate resin, etc., a polyimide resin and an epoxy resin are more preferable in consideration of heat resistance. The etching in this embodiment includes both wet etching and dry etching. For example, when the insulating member is made of a polyimide resin, an etching solution such as a hydrazine-based alkaline solution can be used in the case of wet etching, and in the case of dry etching, a method such as RIE using oxygen or the like is used. be able to.

  The metal thin film layer 133, the second metal thin film layer 17, the first terminal portion 11 and the second terminal portion 12 are preferably etchable in consideration of the manufacturing method described below, for example, Cu , Ag, Au, Al and the like. The etching in this case includes both wet etching and dry etching. For example, when the first metal member and the second metal member are made of Cu, an etching solution such as a ferric chloride solution can be used in the case of wet etching. When the first metal member and the second metal member are made of Al, dry etching can be performed using a technique such as RIE using a chlorine-based gas or the like.

  In the method of manufacturing a lead frame for an optical semiconductor device described below, the reflector portion 13 is formed by etching by making the insulator etchable and allowing the metal thin film layer 133 and the like to be etched. Therefore, the reflector portion 13 can be formed very easily as compared with the conventional injection molding method in which positioning and shape control are difficult.

  Moreover, since the reflector part 13 can be formed by the said etching method, the thickness of the reflector part 13 is adjusted by adjusting the thickness of the 1st wall part 131 and the 2nd wall part 132 which comprise the reflector part 13. It can be adjusted freely, and the thickness of the reflector portion 13 can be reduced, which has been difficult with the conventional injection molding method. Therefore, it is possible to reduce the thickness of the lead frame 10 for optical semiconductor devices.

(Second Embodiment)
4 is a cross-sectional view showing a schematic configuration of the optical semiconductor device lead frame in the present embodiment, FIG. 5 is an upper plan view showing the schematic configuration of the optical semiconductor device, and FIG. 6 is the optical semiconductor device. It is a lower top view which shows schematic structure of these.

  As shown in FIGS. 4 to 6, the lead frame 20 for an optical semiconductor device according to the present embodiment is the same as the lead frame 10 for the semiconductor device according to the first embodiment shown in FIGS. The first terminal portion 11 includes a copper thin film layer 133-1 and a silver thin film layer 133-2 that are sequentially stacked from the reflecting surfaces 131A and 132A of the first wall portion 131 and the second wall portion 132, respectively. The difference is that the surface on which the element mounting portion 11A is formed is a silver surface, and the other components are the same. Therefore, hereinafter, features of the present embodiment will be described focusing on the above differences.

  In addition, the same code | symbol is used about the component similar or the same as the component shown in FIGS. 1-3.

  In the optical semiconductor device lead frame 20 according to the present embodiment, light emitted from a light emitting element to be mounted later is reflected by the silver thin film layer based on the above configuration, so that the light emission efficiency is increased. Further, since the first terminal portion 11 and the copper thin film layer 133-1 include the same component and are firmly bonded, even if the interface IS between the element mounting portion 13A and the reflecting surfaces 131A and 132A is corroded. Even if a property gas or moisture permeates, it is difficult to reach the surfaces (copper thin film layers) of the reflecting surfaces 131A and 132A. Therefore, corrosion of the reflector portion can be more effectively suppressed.

  In the present embodiment, as shown in FIGS. 4 to 6, the second metal thin film layer 17 disposed on the upper portion of the second terminal portion 12 is also in the same manner as the metal thin film layer 133. It is comprised so that it may have the 2nd copper thin film layer 17-1 and the 2nd silver thin film layer 17-2 which were formed in order on the wall surface of the wall part 132 and the 3rd wall part 16. As shown in FIG. The reason why the second terminal portion 12 side adopts such a configuration is to shorten the length of a terminal portion (wire or the like) for connecting a light emitting element to be mounted later and the second terminal portion.

  Since other features and configurations are the same as those of the lead frame 10 for optical semiconductor devices in the first embodiment, description thereof is omitted in this embodiment.

  Also, the optical semiconductor device lead frame 20 of the present embodiment is the same as that of the first embodiment except that the metal thin film layer 133 is composed of a copper thin film layer 133-1 and a silver thin film layer 133-2. Since it has the same configuration as the lead frame 10 for optical semiconductor devices, the same operational effects as the lead frame 10 for optical semiconductor devices are obtained. That is, the copper thin film layer 133-1 of the metal thin film layer 133 is provided so as to cover the interface IS between the element mounting portion 11A in the first terminal portion 11 and the reflecting surfaces 131A and 132A in the reflector portion 13. Therefore, the metal thin film layer 133 can suppress the penetration of moisture and the like from the interface IS into the reflector portion 13, and the corrosion of the reflector portion 13 can be suppressed. In particular, since the surface of the first terminal portion 11 where the element mounting portion 11A is formed is a silver surface, the reflectance of the reflector portion 13 is further improved as compared with the case of a copper surface or the like. And a higher total luminous flux value can be obtained.

(Third embodiment)
FIG. 7 is a cross-sectional view illustrating a schematic configuration of the optical semiconductor device according to the present embodiment, FIG. 8 is an upper plan view illustrating a schematic configuration of the optical semiconductor device, and FIG. 9 is a schematic diagram of the optical semiconductor device. It is a bottom plan view which shows a structure.

  As shown in FIGS. 7 to 9, the optical semiconductor device 30 of the present embodiment is an element of the first terminal portion 11 in the optical semiconductor device lead frame 10 of the first embodiment shown in FIGS. 1 to 3. The light emitting element 36 is mounted on the mounting surface 11A, and the first element terminal portion 36A of the light emitting element 36 is electrically connected (wire bonding) to the element mounting surface 11A with a wire 37, and the second element terminal portion 36B. Is electrically connected (wire bonded) to the second metal thin film layer 17 of the second terminal portion 12 by the wire 38 at the upper portion of the second wall portion 132, and the light emitting element 36 and the reflector portion 13 are sealed. It is sealed with a resin 39.

  The light emitting element 36 is a group III-V semiconductor material LED in which a semiconductor such as GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN is formed as a light emitting layer on a substrate. And so on.

  The sealing resin 39 is not particularly limited as long as it can protect the light emitting element 36 and the reflector unit 13 from external force, dust, moisture, and the like from the external environment. For example, an epoxy resin, a modified epoxy resin, a silicone resin, A polyimide resin and an epoxy resin are more preferable in consideration of heat resistance, which can be composed of a modified silicone resin, an acrylate resin, a urethane resin, or the like.

  In the optical semiconductor device 30 of the present embodiment, the light emitting element 36 is mounted on the element mounting portion 11A of the first terminal portion 11 of the optical semiconductor device lead frame 10 shown in FIGS. It has the same configuration as the above-described lead frame 10 for an optical semiconductor device except that it is electrically connected and the light emitting element 36 is sealed with a sealing resin 39. Therefore, the optical semiconductor device 30 of this embodiment has the same effects as the lead frame 10 for optical semiconductor devices.

  Specifically, in the optical semiconductor device 30 of the present embodiment, the metal thin film layer 133 covers the interface IS between the element mounting portion 11A in the first terminal portion 11 and the reflecting surfaces 131A and 132A in the reflector portion 13. Is provided. Therefore, the metal thin film layer 133 can suppress the penetration of moisture and the like from the interface IS into the reflector portion 13, suppress the corrosion of the reflector portion 13, and increase the total luminous flux based on the high reflectance of the reflector portion 13. A value can be obtained.

  In addition, since the metal thin film layer 133 is disposed on the reflecting surfaces 131A and 132A of the reflector portion 13, the metal thin film layer 133 is coupled with the effect of suppressing the corrosion of the reflector portion 13 as described above. It becomes possible to obtain a high total luminous flux value based on the resulting high reflectance.

  Further, since the metal thin film layer 133 is formed on the reflecting surfaces 131A and 132A of the reflector unit 13, the heat from the light emitting element 36 is radiated not only from the surface of the first electrode unit 11 but also from the metal thin film layer 133. In other words, heat can also be radiated from the reflector 13. Therefore, it is possible to prevent malfunction of the light emitting element 36 due to the heat generation and dissolution of the sealing resin of the optical semiconductor device.

  Furthermore, in the optical semiconductor device 30 of the present embodiment, the first wall portion 132 is provided so as to straddle the gap between the first terminal portion 11 and the second terminal portion 12. Since the 1 terminal part 11 and the 2nd terminal part 12 are made to connect, the effect that it can take the integrated package form can be acquired.

  Further, as shown in FIGS. 7 and 8, etc., since the metal thin film layer 133 is provided on the entire reflection surfaces 131A and 132A, the metal thin film layer 133 is transmitted from the first terminal portion 11 side through the interface IS and corrosive gas or moisture. Even if the gas penetrates, there is no outlet for the corrosive gas and the like up to the top of the first wall 131 and the second wall 132, so that the corrosive gas or the like is reflected on the reflective surface of the metal thin film layer 133. It becomes difficult to reach the surfaces facing 131A and 132A, that is, the surfaces (surfaces) that reflect the light from the light emitting element 36. Therefore, corrosion of the reflector part 13 can be suppressed more effectively.

  In the method of manufacturing an optical semiconductor device described below, a reflector portion is formed by making the insulator constituting the first wall portion 131 etc. etchable and allowing the metal thin film layer 133 etc. to be etched. Since 13 can be formed by etching, the reflector portion 13 can be formed extremely easily as compared with a conventional injection molding method in which alignment and shape control are difficult.

  Moreover, since the reflector part 13 can be formed by the said etching method, the thickness of the reflector part 13 is adjusted by adjusting the thickness of the 1st wall part 131 and the 2nd wall part 132 which comprise the reflector part 13. It can be adjusted freely, and the thickness of the reflector portion 13 can be reduced, which has been difficult with the conventional injection molding method. Therefore, the optical semiconductor device 30 can be thinned.

  In addition, since the second terminal portion 36B is electrically connected (wire bonded) to the second metal thin film layer 17 of the second terminal portion 12 by the wire 38 at the upper portion of the second wall portion 132, The length of the wire 38 can be shortened.

(Fourth embodiment)
FIG. 10 is a cross-sectional view illustrating a schematic configuration of the optical semiconductor device according to the present embodiment, FIG. 11 is an upper plan view illustrating the schematic configuration of the optical semiconductor device, and FIG. 12 is a schematic diagram of the optical semiconductor device. It is a bottom plan view which shows a structure.

  As shown in FIGS. 10 to 12, the optical semiconductor device 40 of the present embodiment is an element of the first terminal portion 11 in the optical semiconductor device lead frame 20 of the second embodiment shown in FIGS. 4 to 6. The light emitting element 36 is mounted on the mounting surface 11A, and the first element terminal portion 36A of the light emitting element 36 is electrically connected (wire bonding) to the element mounting surface 11A with a wire 37, and the second element terminal portion 36B. Is electrically connected (wire bonded) to the silver thin film layer 17-2 of the second terminal portion 12 by the wire 38 at the upper portion of the second wall portion 132, and the light emitting element 36 and the reflector portion 13 are sealed with a sealing resin. It is sealed by 39.

  In the optical semiconductor device 40 of this embodiment, the light emitting element 36 is mounted on the element mounting portion 11A of the first terminal portion 11 of the optical semiconductor device lead frame 20 shown in FIGS. The optical semiconductor device has the same configuration as that of the lead frame 20 for an optical semiconductor device except that it is electrically connected and the light emitting element 36 is sealed with a sealing resin 39. Therefore, the optical semiconductor device 40 of this embodiment has the same effects as the lead frame 20 for optical semiconductor devices.

  Specifically, the metal thin film layer 133 is composed of a copper thin film layer 133-1 and a silver thin film layer 133-2 that are sequentially laminated from the reflecting surfaces 131A and 132A of the first wall portion 131 and the second wall portion 132, respectively. In the first terminal portion 11, since the surface on which the element mounting portion 11A is formed is a silver surface, the light emitted from the light emitting element 36 is reflected by the silver thin film layer 133-1. As a result, the luminous efficiency is higher than in the case of a copper surface or the like. In addition, since the first terminal portion 11 and the copper foil film layer 133-1 include the same component and are firmly bonded, even at the interface IS between the element mounting portion 13A and the reflecting surfaces 131A and 132A. Even if corrosive gas or moisture permeates, it is difficult to reach the surfaces (copper thin film layers) of the reflecting surfaces 131A and 132A. Therefore, corrosion of the reflector part 13 can be suppressed more effectively.

  Since other features and configurations are the same as those of the lead frame 20 for optical semiconductor devices in the second embodiment, description thereof is omitted in this embodiment.

  In addition, the optical semiconductor device 40 of this embodiment also includes the copper thin film layer 133-1 and the silver thin film layer 133 that are laminated in order from the reflective surfaces 131A and 132A of the first wall portion 131 and the second wall portion 132, respectively. The optical semiconductor according to the third embodiment except that the surface of the first terminal portion 11 on which the element mounting portion 11A is formed is a silver surface. Since it has the same configuration as that of the device 30, it has the same characteristics as the optical semiconductor device 30 described in the third embodiment and has the same operational effects.

(Fifth embodiment)
13 to 20 are cross-sectional views illustrating the steps of the method for manufacturing the optical semiconductor device lead frame and the method for manufacturing the optical semiconductor device manufacturing apparatus according to the present embodiment.

  13 to 18 are process diagrams relating to the method for manufacturing the lead frame for an optical semiconductor device in the first embodiment, and FIGS. 13 to 19 are steps related to the manufacture of the optical semiconductor device in the third embodiment. FIG. FIGS. 13 to 18 and 20 are process diagrams relating to the method of manufacturing the lead frame for an optical semiconductor device according to the second embodiment, and FIGS. 13 to 20 illustrate the optical semiconductor device according to the fourth embodiment. It is process drawing regarding manufacture.

  First, as shown in FIG. 13, a laminated body 10 </ b> X is prepared by laminating an insulating layer 13 </ b> X on one surface of the metal layer 11 </ b> X and the metal layer 11 </ b> X. The metal layer 11X can be made of an etchable metal such as Cu, Ag, Au, and Al. Moreover, the insulating layer 13X can be comprised from the insulator which can be etched, such as a polyimide resin, an epoxy resin, and an acrylate resin, for example.

  The thickness of the first metal layer 11X is set to be substantially the same as that of the first terminal portion 11 and the second terminal portion 12 to be formed later, and the thickness of the insulating layer 13X is set to the reflector portion 13 to be formed later. The thicknesses of the first wall 131 and the second wall 132 are set substantially the same.

  Next, as shown in FIG. 14, a mask 51 is formed on the surface of the stacked body 10, specifically, the surface of the insulating layer 13X, and the stacked body 10, specifically, the insulating layer 13X is etched. As shown in FIG. 15, the first wall 131, the second wall 132, and the third wall disposed so as to surround the element mounting portion 11 </ b> A formed on one surface of the metal layer 11 </ b> X. Part 16 is formed.

  Etching in this embodiment includes both wet etching and dry etching. However, when the insulating layer 13X is made of a polyimide resin, an etching solution such as a hydrazine-based alkaline solution can be used in the case of wet etching. In the case of dry etching, a method such as RIE using oxygen or the like can be used.

  Next, as shown in FIG. 16, the element placement portion 11A, the first wall portion 131, and the second wall portion 132 of the metal layer 11X are subjected to plating treatment, and the element placement portion 11A and the first wall are then plated. By forming the metal thin film layer 133 that covers the interface IS between the reflection surface 131A of the portion 131 and the reflection surface 132A of the second wall portion 132, the first wall portion 131, the second wall portion 132, and the metal thin film layer are formed. The reflector part 13 which has 133 is formed. At this time, since the plating process is also performed on the third wall portion 16, the second metal thin film layer 17 is also continuous with the metal thin film layer 133 on the third wall portion 16. It is formed.

  Next, as shown in FIG. 17, a mask 52 is provided on the metal layer 11 </ b> X, and the metal layer 11 </ b> X is subjected to an etching process, whereby the first terminal portion 11 and the first terminal portion are shown in FIG. 18. The second terminal portion 12 that is located away from the first terminal portion 11 and is connected to the first terminal portion 11 by the second wall portion 132 is formed. At this time, the metal thin film layer 133 and the second metal thin film layer 17 are separated by forming the mask 53 on the metal thin film layer 133 and the second metal thin film layer 17 and performing the etching process.

  Etching in the present embodiment includes both wet etching and dry etching. For example, when the metal layer 11X is made of Cu, an etching solution such as a ferric chloride solution is used in the case of wet etching. it can. When the first metal member and the second metal member are made of Al, dry etching can be performed using a technique such as RIE using a chlorine-based gas or the like. Through the above operation, the optical semiconductor device lead frame 10 according to the first embodiment can be obtained.

  Next, as shown in FIG. 19, in the optical semiconductor device lead frame 10 obtained in FIG. 18, the light emitting element 36 is mounted on the element mounting surface 11 </ b> A of the first terminal portion 11, and the light emitting element 36 The first element terminal portion 36A and the second element terminal portion 36B are electrically connected to the second metal thin film layer 17 on the element mounting surface 11A and the second wall portion 132 through wires 37 and 38, respectively. (Wire bonding), the element mounting portion 11A is filled with the sealing resin 39, and the light emitting element 36, the metal thin film layer 133, and the like are sealed to obtain the optical semiconductor device 30 as shown in FIG. .

  As described above, the sealing resin 39 can be made of, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, a urethane resin, or the like.

  Further, in order to obtain the optical semiconductor device lead frame 20 in the second embodiment, the copper thin film layer 133-1 is formed by plating in place of the metal thin film layer 133 or the like in the steps shown in FIGS. 18, the silver thin film layer 133-2 is formed on the copper thin film layer 133-1, etc. by plating as shown in FIG. 20, and the metal thin film layer 133, etc. is formed as the copper thin film layer 133-. 1 and the silver thin film layer 133-2.

  Furthermore, in order to obtain the optical semiconductor device 40 in the fourth embodiment, the light emitting element 36 is mounted on the element mounting surface 11A of the first terminal portion 11 in the optical semiconductor device lead frame 20 obtained in FIG. In addition, the first element terminal portion 36A and the second element terminal portion 36B of the light emitting element 36 are connected to the second metal on the element mounting surface 11A and the second wall portion 132 through the wires 37 and 38, respectively. The thin film layer 17 is electrically connected (wire bonding), and the element mounting portion 11A is filled with a sealing resin 39.

(Sixth embodiment)
In the first to fifth embodiments, the case where the optical semiconductor device and the lead frame for an optical semiconductor device are obtained as a single piece has been described. However, in this embodiment, the lead frame for an optical semiconductor device is a multi-piece. A case of having a chip configuration will be described.

  FIG. 21 is an upper plan view showing a schematic configuration of the lead frame for an optical semiconductor device in the present embodiment, FIG. 22 is a lower plan view showing a schematic configuration of the lead frame for an optical semiconductor device, and FIG. FIG. 3 is a cross-sectional view taken along line II showing the schematic configuration of the lead frame for an optical semiconductor device.

  In addition, the same code | symbol is used about the same or the same component as the component shown in FIGS.

  As shown in FIGS. 21 to 23, in the multi-chip optical semiconductor device lead frame 110 of this embodiment, a plurality of optical semiconductor device lead frames 10 are arranged in parallel along the y direction in the figure. ing. The plurality of lead frames 10 for optical semiconductor devices share the first terminal portion 11, the second terminal portion 12, the second wall portion 132 on the second terminal portion 12 side, and the metal thin film layer 133. The optical thin film layer 133 is disposed along the y direction in the drawing and is divided by a wall portion 134 made of an insulator extending in the x direction perpendicular to the y direction. A reflector portion 13 and an element placement portion 11A belonging to the device lead frame 10 are defined.

  Also in the lead frame 110 for an optical semiconductor device formed into a multichip according to the present embodiment, the lead frame 110 includes the first terminal portion 11, the second terminal portion 12, and the second terminal portion 12 side second lead. Since the plurality of lead frames 10 for optical semiconductor devices sharing the wall portion 132 and the metal thin film layer 133 are included, the features and operational effects of the lead frame 10 are exhibited.

  Since the features and operational effects of the optical semiconductor device lead frame 10 are as described in the first embodiment, description thereof is omitted here.

  In addition, the multi-chip lead frame 110 for an optical semiconductor device shown in FIG. 21 to FIG. 23 is the same as the pattern of the wall 134 in the manufacturing method in the case of a single piece shown in FIG. Can be obtained through the same manufacturing method as described above.

  Further, when the metal thin film layer 133 includes the copper thin film layer 133-1 and the silver thin film layer 133-2, for example, the metal thin film layer 133 in FIG. 23 is the copper thin film layer 133-1 and the silver thin film layer 133-2. Except for being a layer, it has the same configuration as described above.

(Seventh embodiment)
In the first to fifth embodiments, the case where the optical semiconductor device and the lead frame for the optical semiconductor device are obtained as a single piece has been described. However, in this embodiment, the optical semiconductor device is made into a multichip. A case of having the above configuration will be described.

  24 is an upper plan view showing a schematic configuration of the optical semiconductor device in the present embodiment, FIG. 25 is a lower plan view showing a schematic configuration of the lead frame for an optical semiconductor device, and FIG. It is sectional drawing which followed the II-II line | wire which shows schematic structure of the lead frame for semiconductor devices.

  In addition, the same code | symbol is used about the same or the same component as the component shown in FIGS.

  As shown in FIGS. 24 to 26, in the multi-chip optical semiconductor device 130 of this embodiment, the multi-chip optical semiconductor device lead frame of the sixth embodiment shown in FIGS. In each lead frame 10 for an optical semiconductor device 110, the light emitting element 36 is mounted on the element mounting surface 11A of the first terminal portion 11, and the first element terminal portion 36A of the light emitting element 36 is connected to the element mounting surface 11A. The second element terminal portion 36B is electrically connected to the second metal thin film layer 17 of the second terminal portion 12 by the wire 38 above the second wall portion 132. Electrically connected (wire bonding), and the light emitting element 36 and the reflector portion 13 are sealed with a sealing resin 39.

  Also in the multi-chip optical semiconductor device 130 of the present embodiment, the optical semiconductor device 130 includes the multi-chip optical semiconductor device lead frame 110 relating to the sixth embodiment, that is, the first terminal portion 11. Since the second terminal portion 12, the second wall portion 132 on the second terminal portion 12 side, and the plurality of lead frames 10 for optical semiconductor devices sharing the metal thin film layer 133 are included, the features and functions of the lead frame 10 are included. It comes to have an effect.

  The features, functions, and effects of the optical semiconductor device lead frame 10 are as described in the first embodiment, and the other features, functions, and effects of the multi-chip optical semiconductor device lead frame 110 are described in the first embodiment. Since it is as having described in embodiment 6, description is abbreviate | omitted here.

(Eighth embodiment)
FIG. 27 is a cross-sectional view showing a schematic configuration of the optical semiconductor device lead frame in the present embodiment, FIG. 28 is an upper plan view showing a schematic configuration of the optical semiconductor device lead frame, and FIG. It is a bottom plan view showing a schematic configuration of the lead frame for an optical semiconductor device. FIG. 30 is a cross-sectional view showing a schematic configuration of the optical semiconductor device in the present embodiment, FIG. 31 is an upper plan view showing the schematic configuration of the optical semiconductor device, and FIG. 32 is the optical semiconductor device. It is a lower top view which shows schematic structure of these.

  As shown in FIGS. 27 to 29, the lead frame 50 for the optical semiconductor device of this embodiment is the second terminal portion 12 in the lead frame 10 for the semiconductor device of the first embodiment according to FIGS. The height of the second wall portion 132 on the side is lower than the height of the first wall portion 131 that is not on the second terminal portion 12 side.

  Therefore, the light emitting element 36 is mounted on the element mounting surface 11A of the first terminal portion 11 of the lead frame 10 for an optical semiconductor device, and the first element terminal portion 36A of the light emitting element 36 is wired to the element mounting surface 11A. The second element terminal portion 36B is electrically connected to the second metal thin film layer 17 of the second terminal portion 12 by the wire 38 above the second wall portion 132. In the optical semiconductor device 60 shown in FIGS. 30 to 32, the sealing resin 39 is connected to the second wall (wire bonding), and the light emitting element 36 and the reflector portion 13 are sealed with the sealing resin 39. Even when deposited on the portion 132, the height of the deposited portion can be reduced. Therefore, the height of the optical semiconductor device 60 can be reduced, and the optical semiconductor device 60 can be downsized.

  The other features and operational effects of the optical semiconductor device lead frame 50 and the optical semiconductor device 60 are the same as those described in the first and third embodiments, and are not described here.

  When the metal thin film layer 133 includes the copper thin film layer 133-1 and the silver thin film layer 133-2, for example, the metal thin film layer 133 in FIG. 27 is the copper thin film layer 133-1 and the silver thin film layer 133-2. Except for being a layer, it has the same configuration as described above.

(Ninth embodiment)
33 to 37 are cross-sectional views showing the steps of the manufacturing method of the optical semiconductor device lead frame and the manufacturing method of the optical semiconductor device in the present embodiment.

  33 to 36 are process diagrams relating to the method of manufacturing the lead frame for an optical semiconductor device according to the eighth embodiment, and FIGS. 33 to 37 are processes related to the manufacture of the optical semiconductor device according to the eighth embodiment. FIG.

  First, as described in the fifth embodiment, the insulating layer 13X is stacked on one surface of the metal layer 11X and the metal layer 11X to prepare the stacked body 10X, and the surface of the stacked body 10X, specifically, A mask 51 is formed on the surface of the insulating layer 13X, and the stacked body 10X, specifically, the insulating layer 13X is etched to surround the element mounting portion 11A formed on one surface of the metal layer 11X. The first wall portion 131, the second wall portion 132, and the third wall portion 16 that are disposed are formed (see FIGS. 13 to 15).

  Next, as shown in FIG. 33, an etching process is performed on the upper surface of the second wall 132, and the height of the second wall 132 is set so that the first wall 131 and the third wall 16 have a height. Try to be lower than the height.

  Next, as shown in FIG. 34, the element mounting portion 11A, the first wall portion 131, and the second wall portion 132 of the metal layer 11X are plated, and the element mounting portion 11A and the first wall are then plated. By forming the metal thin film layer 133 that covers the interface IS between the reflection surface 131A of the portion 131 and the reflection surface 132A of the second wall portion 132, the first wall portion 131, the second wall portion 132, and the metal thin film layer are formed. The reflector part 13 which has 133 is formed. At this time, since the plating process is also performed on the third wall portion 16, the second metal thin film layer 17 is also continuous with the metal thin film layer 133 on the third wall portion 16. It is formed.

  Next, as shown in FIG. 35, a mask 52 is provided on the metal layer 11X, and the etching process of the metal layer 11X is performed, so that the first terminal portion 11 and the first terminal portion are shown in FIG. The second terminal portion 12 that is located away from the first terminal portion 11 and is connected to the first terminal portion 11 by the second wall portion 132 is formed. At this time, the metal thin film layer 133 and the second metal thin film layer 17 are separated by forming the mask 53 on the metal thin film layer 133 and the second metal thin film layer 17 and performing the etching process.

  Through the above operation, the optical semiconductor device lead frame 50 according to the eighth embodiment can be obtained.

  Next, as shown in FIG. 37, in the optical semiconductor device lead frame 50 obtained in FIG. 36, the light emitting element 36 is mounted on the element mounting surface 11 </ b> A of the first terminal portion 11, and the light emitting element 36 The first element terminal portion 36A and the second element terminal portion 36B are electrically connected to the second metal thin film layer 17 on the element mounting surface 11A and the second wall portion 132 through wires 37 and 38, respectively. (Wire bonding), the element mounting portion 11A is filled with the sealing resin 39, and the light emitting element 36, the metal thin film layer 133, and the like are sealed, thereby obtaining the optical semiconductor device 60 as shown in FIG.

  Since other features and operational effects of this embodiment are the same as those of the manufacturing method according to the fifth embodiment, description thereof is omitted here.

(Tenth embodiment)
FIG. 38 is an upper plan view showing a schematic configuration of the lead frame for an optical semiconductor device in the present embodiment, FIG. 39 is a lower plan view showing a schematic configuration of the lead frame for an optical semiconductor device, and FIG. FIG. 3 is a cross-sectional view taken along line III-III showing a schematic configuration of the lead frame for an optical semiconductor device.

  In addition, the same code | symbol is used about the same or the same component as the component shown in FIGS.

  As shown in FIGS. 38 to 40, in the multi-chip optical semiconductor device lead frame 210 of the present embodiment, the plurality of optical semiconductor device lead frames 50 of the eighth embodiment are arranged in the y direction in the figure. Are arranged in parallel along. The plurality of optical semiconductor device lead frames 50 share the first terminal portion 11, the second terminal portion 12, the second wall portion 132 on the second terminal portion 12 side, and the metal thin film layer 133. The optical thin film layer 133 is disposed along the y direction in the drawing and is divided by a wall portion 134 made of an insulator extending in the x direction perpendicular to the y direction. A reflector portion 13 and an element placement portion 11A belonging to the device lead frame 50 are defined.

  Also in the multi-chip optical semiconductor device lead frame 210 of the present embodiment, the lead frame 110 includes the first terminal portion 11, the second terminal portion 12, and the second terminal portion 12 side second lead. Since the plurality of optical semiconductor device lead frames 50 sharing the wall 132 and the metal thin film layer 133 are included, the features and operational effects of the lead frame 50 are exhibited.

  Note that the features and operational effects of the optical semiconductor device lead frame 50 are the same as those described in the eighth embodiment, and a description thereof will be omitted here.

  38 to 40 is a multi-chip lead frame 210 for an optical semiconductor device, in the manufacturing method in the case of a single piece shown in FIGS. Can be obtained through the same manufacturing method as described above.

(Eleventh embodiment)
41 is an upper plan view showing a schematic configuration of the optical semiconductor device in the present embodiment, FIG. 42 is a lower plan view showing a schematic configuration of the lead frame for an optical semiconductor device, and FIG. It is sectional drawing along the IV-IV line which shows schematic structure of the lead frame for semiconductor devices.

  In addition, the same code | symbol is used about the same or the same component as the component shown in FIGS.

  As shown in FIGS. 41 to 43, in the multi-chip optical semiconductor device 230 of this embodiment, the multi-chip optical semiconductor device lead frame of the tenth embodiment shown in FIGS. 38 to 40 is used. In each optical semiconductor device lead frame 50 of 210, the light emitting element 36 is mounted on the element mounting surface 11A of the first terminal portion 11, and the first terminal portion 36A of the light emitting element 36 is on the element mounting surface 11A. The second terminal portion 36B is electrically connected by the wire 37 to the second metal thin film layer 17 of the second terminal portion 12 at the upper portion of the second wall portion 132 by the wire 38. Further, the light emitting element 36 and the reflector portion 13 are sealed with a sealing resin 39.

  Also in the multi-chip optical semiconductor device 230 of the present embodiment, the optical semiconductor device 230 is the multi-chip lead frame 210 for the optical semiconductor device according to the tenth embodiment, that is, the first terminal portion 11. And the second terminal portion 12, the second wall portion 132 on the second terminal portion 12 side, and a plurality of lead frames 50 for optical semiconductor devices that share the metal thin film layer 133. It comes to have an effect.

  The features, functions, and effects of the optical semiconductor device lead frame 50 are as described in the eighth embodiment. The other features, functions, and effects of the multi-chip optical semiconductor device lead frame 210 are described in the eighth embodiment. Since it is as described in the tenth embodiment, the description is omitted here.

(Twelfth embodiment)
44 is a cross-sectional view illustrating a schematic configuration of the optical semiconductor device according to the present embodiment, FIG. 45 is a top plan view illustrating a schematic configuration of the optical semiconductor device, and FIG. 46 is a schematic diagram of the optical semiconductor device. It is a bottom plan view which shows a structure.

  In addition, the same code | symbol is used about the same or the same component as the component shown in FIGS.

  The optical semiconductor device 70 of the present embodiment is the same as the optical semiconductor device 30 shown in FIGS. 7 to 9 according to the third embodiment, on the side of the first terminal portion 11 that is not the second terminal portion 12 side, that is, the first side. The first wall portion 131 has a third terminal portion 73 that is positioned apart from the first terminal portion 11, and the third terminal portion 73 side wall portion, that is, the first wall portion 131 is the first wall portion 131. Since the first terminal portion 11 and the third terminal portion 73 are provided so as to straddle the gap between the first terminal portion 11 and the third terminal portion 73, the first terminal portion 11 and the third terminal portion 73 are connected to each other. Are electrically connected to the third terminal portion 73 (the third metal thin film layer 77 disposed on the first wall portion 131) instead of being electrically connected to the metal thin film layer 133. Is different.

  Therefore, the optical semiconductor device 70 according to the present embodiment has an electrical connection between the light emitting element 36 and the terminal portion of the reflective surface 131A as compared with the optical semiconductor device 30 shown in FIGS. 7 to 9 according to the third embodiment. , 132A, it is not necessary to provide a region necessary for electrical connection on the reflecting surfaces 131A, 132A. For this reason, reflection efficiency can be improved. Moreover, since the element mounting portion 11A can be made compact, the distance between the light emitting element and the reflecting surface can be shortened, and the reflection efficiency can be further improved.

  As shown in FIGS. 44 and 45, in the present embodiment, the first wall 131 is positioned on the third terminal portion 73, and the first wall portion 131 is made of an insulator so as to face the first wall portion 131. In the space formed by the first wall portion 131 and the fourth wall portion 76, a part 73 </ b> A of the upper surface of the third terminal portion 73 is exposed. A third metal thin film layer 77 is disposed on the opposing surfaces of the first wall portion 131 and the fourth wall portion 76. The third metal thin film layer 77 extends to the upper surface of the first wall 131 without reaching the reflection surface 131A on the first wall 131 side.

  The reason for adopting such a configuration on the third terminal portion 73 side is to shorten the length of the wire 37 for connecting the light emitting element 36 and the third terminal portion 73.

  The lead frame for the optical semiconductor device 70 of the present embodiment has a configuration in which the light emitting element 36, the wires 37 and 38, and the sealing resin 39 are removed from the optical semiconductor device 70 shown in the present embodiment. Therefore, a part of the reflecting surfaces 131A and 132A can be made to function as a reflecting surface without being used for electrical connection. Therefore, when a light emitting element is mounted, the reflection efficiency of light from the light emitting element can be improved. . Further, the element mounting portion 11A becomes compact, and the distance from the reflecting surface can be shortened when the light emitting element is mounted. For this reason, the reflection efficiency of the light from a light emitting element can further be improved. Furthermore, the first wall portion 131 is provided so as to straddle the gap between the first terminal portion 11 and the third terminal portion 73, and the second wall portion 132 is connected to the first terminal portion 11 and the first terminal portion 11. Since the first terminal portion 11, the second terminal portion 12, and the third terminal portion 73 are connected by being provided so as to straddle the gap between the two terminal portions 12. It is possible to take an integrated package form.

  Since the optical semiconductor device 70 of the present embodiment includes all the components of the optical semiconductor device 30 according to the third embodiment, the optical semiconductor device 30 can also exhibit the features and operational effects of the optical semiconductor device 30, but will be described here. Is omitted.

(13th Embodiment)
47 is a cross-sectional view showing a schematic configuration of the optical semiconductor device in the present embodiment, FIG. 48 is an upper plan view showing a schematic configuration of the optical semiconductor device, and FIG. 49 is a schematic diagram of the optical semiconductor device. It is a bottom plan view which shows a structure.

  In addition, the same code | symbol is used about the same or the same component as the component shown in FIGS.

  The optical semiconductor device 80 of the present embodiment is the same as the optical semiconductor device 60 shown in FIGS. 30 to 32 according to the eighth embodiment, on the side of the first terminal portion 11 that is not the second terminal portion 12 side, that is, the first side. The first wall portion 131 has a third terminal portion 73 that is positioned apart from the first terminal portion 11, and the third terminal portion 73 side wall portion, that is, the first wall portion 131 is the first wall portion 131. Since the first terminal portion 11 and the third terminal portion 73 are provided so as to straddle the gap between the first terminal portion 11 and the third terminal portion 73, the first terminal portion 11 and the third terminal portion 73 are connected to each other. Are electrically connected to the third terminal portion 73 (the third metal thin film layer 77 disposed on the first wall portion 131) instead of being electrically connected to the metal thin film layer 133. Is different.

  Therefore, the optical semiconductor device 80 according to the present embodiment has an electrical connection between the light emitting element 36 and the terminal portion of the reflective surface 131A as compared with the optical semiconductor device 60 shown in FIGS. 30 to 32 according to the eighth embodiment. , 132A, it is not necessary to provide a region necessary for electrical connection on the reflecting surfaces 131A, 132A. For this reason, reflection efficiency can be improved. Moreover, since the element mounting portion 11A can be made compact, the distance between the light emitting element and the reflecting surface can be shortened, and the reflection efficiency can be further improved.

  In this embodiment, as shown in FIGS. 47 and 48, the first wall 131 is located on the third terminal portion 73, and the first wall portion 131 is made of an insulator so as to face the first wall portion 131. In the space formed by the first wall portion 131 and the fourth wall portion 76, a part 73 </ b> A of the upper surface of the third terminal portion 73 is exposed. A third metal thin film layer 77 is disposed on the opposing surfaces of the first wall portion 131 and the fourth wall portion 76. The third metal thin film layer 77 extends to the upper surface of the first wall 131 without reaching the reflection surface 131A on the first wall 131 side.

  The reason for adopting such a configuration on the third terminal portion 73 side is to shorten the length of the wire 37 for connecting the light emitting element 36 and the third terminal portion 73.

  The lead frame for the optical semiconductor device 80 of the present embodiment has a configuration in which the light emitting element 36, the wires 37 and 38, and the sealing resin 39 are removed from the optical semiconductor device 80 shown in the present embodiment. Therefore, a part of the reflecting surfaces 131A and 132A can be made to function as a reflecting surface without being used for electrical connection. Therefore, when a light emitting element is mounted, the reflection efficiency of light from the light emitting element can be improved. . Further, the element mounting portion 11A becomes compact, and the distance from the reflecting surface can be shortened when the light emitting element is mounted. For this reason, the reflection efficiency of the light from a light emitting element can further be improved. Furthermore, the first wall portion 131 is provided so as to straddle the gap between the first terminal portion 11 and the third terminal portion 73, and the second wall portion 132 is connected to the first terminal portion 11 and the first terminal portion 11. Since the first terminal portion 11, the second terminal portion 12, and the third terminal portion 73 are connected by being provided so as to straddle the gap between the two terminal portions 12. It is possible to take an integrated package form.

  Since the lead frame for the optical semiconductor device 80 according to the present embodiment includes all the components of the optical semiconductor device 60 according to the eighth embodiment, the features and operational effects of the optical semiconductor device 60 can be achieved. The description is omitted here.

(Fourteenth embodiment)
In the above-described embodiment, the case where the optical semiconductor device and the lead frame for the optical semiconductor device are obtained as a single piece has been described. However, in this embodiment, the lead frame for the optical semiconductor device has a multi-face manufacturing type configuration. Will be described.

  FIG. 50 is a cross-sectional view showing a schematic configuration of the multi-plane manufacturing type lead frame for an optical semiconductor device of the present embodiment. In addition, the same code | symbol is used about the component similar to or the same as the component shown in FIGS.

  As shown in FIG. 50, the optical semiconductor device lead frame 90 of the present embodiment is positioned apart from the first terminal portion 11 having the element mounting portion 11A on one surface side and the first terminal portion 11. The second terminal portion 12 is provided so as to surround the element mounting portion 11A of the first terminal portion 11, is made of an insulator, and is disposed apart from the second terminal portion 12. In the first wall 131 and the second wall 132 on the second terminal portion 12 side, and in the first wall 131 and the second wall 132, a reflecting surface 131A that is a surface on the element mounting portion 11A side. , 132 </ b> A, and the second wall portion 132 on the second terminal portion 12 side includes the first terminal portion 11 and the second terminal portion 12. Between the first wall and the second wall 132 so that the first end Part 11 and second terminal part 12 are connected, and metal thin film layer 133 is provided to cover interface IS between element mounting part 11A and reflecting surfaces 131A and 132A. A frame 90-1 and a second optical semiconductor device lead frame 90-2 having the same configuration as the first optical semiconductor device lead frame 90-1 are provided.

  The first optical semiconductor device lead frame 90-1 and the second optical semiconductor device lead frame 90-2 are adjacent to each other, and the first wall portion 131 is connected to the two optical semiconductor device lead frames 90-. 1 and 90-2, so as to constitute a so-called multi-face manufacturing type lead frame for an optical semiconductor device.

  Note that the first terminal portion 11 in the first lead frame for optical semiconductor device 90-1 and the second lead frame in the second lead frame for optical semiconductor device 90-2 are provided below the lead frame for optical semiconductor device 90. The terminal portion 12 is separated and defined, and a groove D for facilitating separation is formed.

  Also in the lead frame 90 for optical semiconductor devices of the multi-surface manufacturing type of this embodiment, the metal thin film layer 133 is formed in the first optical semiconductor device lead frame 90-1 and the second optical semiconductor device lead frame 90-2. It is provided so as to cover the interface IS between the element mounting portion 11 </ b> A in the first terminal portion 11 and the reflecting surfaces 131 </ b> A and 132 </ b> A in the reflector portion 13. Therefore, the metal thin film layer 133 can suppress the penetration of moisture and the like from the interface IS into the reflector portion 13, suppress the corrosion of the reflector portion 13, and increase the total luminous flux based on the high reflectance of the reflector portion 13. A value can be obtained.

  In addition, since the metal thin film layer 133 is disposed on the reflecting surfaces 131A and 132A of the reflector portion 13, the metal thin film layer 133 is coupled with the effect of suppressing the corrosion of the reflector portion 13 as described above. It becomes possible to obtain a high total luminous flux value based on the resulting high reflectance.

  Further, since the metal thin film layer 133 is formed on the reflecting surfaces 131A and 132A of the reflector unit 13, heat from the light emitting element to be formed later is transmitted not only from the surface of the first electrode unit 11, but also from the metal thin film layer 133. Can also be dissipated, that is, the reflector 13 can also dissipate heat. Accordingly, it is possible to prevent malfunction of the light emitting element due to the heat generation, dissolution of the sealing resin of the optical semiconductor device, and the like.

  Furthermore, in the optical semiconductor device lead frame 90 of the present embodiment, the first wall portion 132 is provided so as to straddle the gap between the first terminal portion 11 and the second terminal portion 12. Thus, since the first terminal portion 11 and the second terminal portion 12 are connected to each other, it is possible to obtain an operational effect that it is possible to take an integrated package form.

  Further, as shown in FIGS. 1 and 2, etc., the metal thin film layer 133 is provided on the entire reflecting surfaces 131A and 132A. Therefore, even if corrosive gas or moisture permeates through the interface IS from the first terminal portion 11 side, the corrosive gas or the like reaches the top of the first wall portion 131 and the second wall portion 132. Therefore, the corrosive gas or the like reaches the surface of the metal thin film layer 133 on the side facing the reflecting surfaces 131A and 132A and the surface (surface) on the side that reflects the light from the light emitting element mounted later. It becomes difficult to do. Therefore, corrosion of the reflector part 13 can be suppressed more effectively.

  51 shows the first optical semiconductor device lead frame 50 in the case where the multi-sided manufacturing type optical semiconductor device lead frame 90 shown in FIG. It is sectional drawing which shows schematic structure of -1 (50-2). As can be seen from FIG. 51, when the multi-plane manufacturing type optical semiconductor device lead frame 90 shown in FIG. 50 is singulated, due to the groove D, the outer side of the first terminal portion 11 and Concave portions 11 </ b> D and 12 </ b> D are formed outside the second terminal portion 12.

(Fifteenth embodiment)
The present embodiment corresponds to a modification of the third embodiment related to FIGS.
52 is a cross-sectional view showing a schematic configuration of the optical semiconductor device in the present embodiment, FIG. 53 is an upper plan view showing the schematic configuration of the optical semiconductor device, and FIG. 54 is a schematic diagram of the optical semiconductor device. It is a bottom plan view which shows a structure. In addition, the same code | symbol is used about the component similar to or the same as the component shown in FIGS.

  As shown in FIGS. 52 to 54, the optical semiconductor device 100 of the present embodiment has the second metal thin film layer 17 in the optical semiconductor device 30 of the third embodiment shown in FIGS. The upper portion of the wall portion 132 has an extending portion 17A extending to the element mounting portion 11A side. In the extending portion 17A, the second element terminal portion 36B of the light emitting element 36 is electrically connected by a wire 38 ( (Wire bonding).

  In the present embodiment, with the configuration as described above, the wire 38 can be connected in the region near the element mounting portion 11A in the upper part of the second wall portion 132. Can be shortened.

  The other features and operational effects of the optical semiconductor device 100 of the present embodiment are the same as in the case of the third embodiment, and are not described here.

  Further, the lead frame for the optical semiconductor device 100 of the present embodiment has a configuration in which the light emitting element 36, the wires 37 and 38, and the sealing resin 39 are removed from the optical semiconductor device 100 shown in the present embodiment. The lead frame has an effect that the length of the wire 38 can be shortened when the light emitting element is mounted and the second element terminal portion 36B is electrically connected by the wire 38.

  Other features and effects of the lead frame for the optical semiconductor device 100 of the present embodiment are the same as in the case of the first embodiment, and are not described here.

  Note that the structure described in this embodiment can be combined with any of the structures described in other embodiments. For example, in the optical semiconductor device 70 according to the twelfth embodiment shown in FIGS. 44 to 46, on both the first wall 131 and the second wall 132 located on both sides of the element mounting region 11A, Each of the third metal thin film layer 77 and the second metal thin film layer 17 may have an extending portion.

  The present invention has been described in detail based on the above specific examples. However, the present invention is not limited to the above specific examples, and various modifications and changes can be made without departing from the scope of the present invention.

  For example, in the fourteenth embodiment, a multi-plane manufacturing type optical semiconductor device lead frame is described. In the lead frame, a light emitting element 36 is mounted on the element mounting portion 11A, and a sealing resin 39 is provided. By encapsulating with resin, it is possible to obtain a multi-surface manufacturing type optical semiconductor device.

  Even when not specifically mentioned in the above embodiment, the metal thin film layer 133 can be composed of two layers of a copper thin film layer 133-1 and a silver thin film layer 133-2.

10, 20, 50 Lead frame for optical semiconductor device 11 First terminal portion 11A Element placement portion 12 Second terminal portion 13 Reflector portion 131 First wall portion 131A Reflecting surface 132 Second wall portion 132A Reflecting surface 133 Metal thin film layer 133-1 Copper thin film layer 133-2 Silver thin film layer 16 Third wall 17 Second metal thin film layer 30, 40, 60, 70, 80, 100 Optical semiconductor device 36 Light emitting element 37, 38 Wire 39 Sealing resin 110,210 Multi-chip lead frame for optical semiconductor device 130,230 Multi-chip lead semiconductor device 90 Multi-face manufacturing type lead frame for optical semiconductor device

Claims (15)

A first terminal portion having an element mounting portion on one surface side;
A second terminal portion positioned away from the first terminal portion;
Provided on the one surface of the first terminal portion so as to surround the element mounting portion, and provided on a wall portion which is an insulator and a reflection surface which is a surface of the wall portion on the element mounting portion side. A reflector portion having a metal thin film layer;
A light emitting device disposed on the device mounting portion and electrically connected to the metal thin film layer and the second terminal portion;
Sealing resin provided so as to cover the light emitting element and the metal thin film layer,
By providing the wall portion on the second terminal portion side so as to straddle the gap between the first terminal portion and the second terminal portion, the first terminal portion and the second terminal portion are provided. Is connected to the terminal
The optical semiconductor device, wherein the metal thin film layer is provided so as to cover an interface between the element mounting portion and the reflection surface. A second metal thin film layer is provided from the second terminal portion to the surface of the wall portion that is not the reflective surface,
2. The optical semiconductor device according to claim 1, wherein the light emitting element and the second terminal portion are electrically connected via the second metal thin film layer.   3. The optical semiconductor device according to claim 2, wherein the light emitting element is electrically connected to the second metal thin film layer on an upper surface of the wall portion.   The height of the said 2nd terminal part side is lower than the height of the side which is not the said 2nd terminal part side, The said wall part is characterized by the above-mentioned. Optical semiconductor device. The first terminal portion has a copper surface on the one surface side,
5. The optical semiconductor device according to claim 1, wherein the metal thin film layer includes a copper thin film layer and a silver thin film layer that are sequentially stacked from the reflective surface side.   The optical semiconductor device according to claim 1, wherein the metal thin film layer is provided on the entire surface of the reflection surface. On the side of the first terminal portion that is not the second terminal portion side, a third terminal portion that is positioned away from the first terminal portion,
By providing the wall portion on the third terminal portion side so as to straddle the gap between the first terminal portion and the third terminal portion, the first terminal portion and the third terminal portion are provided. The terminal part is connected,
The said light emitting element is electrically connected to the said 3rd terminal part instead of electrically connecting to the said metal thin film layer, It is any one of Claims 1-6 characterized by the above-mentioned. The optical semiconductor device described. A first terminal portion having an element mounting portion on one surface side;
A second terminal portion positioned away from the first terminal portion;
Provided on the one surface of the first terminal portion so as to surround the element mounting portion, and provided on a wall portion which is an insulator and a reflection surface which is a surface of the wall portion on the element mounting portion side. A reflector portion having a metal thin film layer,
By providing the wall portion on the second terminal portion side so as to straddle the gap between the first terminal portion and the second terminal portion, the first terminal portion and the second terminal portion are provided. Is connected to the terminal
The lead frame for an optical semiconductor device, wherein the metal thin film layer is provided so as to cover an interface between the element mounting portion and the reflection surface.   9. The lead frame for an optical semiconductor device according to claim 8, wherein a second metal thin film layer is provided from the second terminal portion to a surface of the wall portion that is not the reflective surface.   10. The optical semiconductor device according to claim 8, wherein a height of the wall portion on the second terminal portion side is lower than a height on a side not on the second terminal portion side. 11. Lead frame. The first terminal portion has a copper surface on the one surface side,
11. The optical semiconductor device according to claim 8, wherein the metal thin film layer includes a copper thin film layer and a silver thin film layer that are sequentially stacked from the reflective surface side.   The optical semiconductor device according to claim 8, wherein the metal thin film layer is provided on the entire surface of the reflective surface. On the side of the first terminal portion that is not the second terminal portion side, a third terminal portion that is positioned away from the first terminal portion,
By providing the wall portion on the third terminal portion side so as to straddle the gap between the first terminal portion and the third terminal portion, the first terminal portion and the third terminal portion are provided. The optical semiconductor device according to claim 8, wherein the optical semiconductor device is connected to a terminal portion of the optical semiconductor device. A first step of preparing a laminate having a metal layer and an insulating layer laminated on one surface of the metal layer;
A second step of forming a wall provided so as to surround the element mounting portion on the one surface by providing a mask on the insulating layer and etching the insulating layer;
A plating process is performed on the element mounting portion and the wall portion to form a metal thin film layer that covers an interface between the element mounting portion and a reflection surface that is a surface of the wall portion on the element mounting portion side. A third step of forming a reflector portion having the wall portion and the metal thin film layer;
By providing a mask on the metal layer and performing an etching process on the metal layer, the first terminal portion and the first terminal portion are located apart from the first terminal portion by the wall portion. A fourth step of forming a second terminal portion connected to
A fifth step of mounting a light emitting element on the element mounting portion;
A sixth step of filling the element mounting portion with a resin and sealing the light emitting element and the metal thin film layer;
A method of manufacturing an optical semiconductor device, comprising: A first step of preparing a laminate having a metal layer and an insulating layer laminated on one surface of the metal layer;
A second step of forming a wall provided so as to surround the element mounting portion on the one surface by providing a mask on the insulating layer and etching the insulating layer;
A plating process is performed on the element mounting portion and the wall portion to form a metal thin film layer that covers an interface between the element mounting portion and a reflection surface that is a surface of the wall portion on the element mounting portion side. A third step of forming a reflector portion having the wall portion and the metal thin film layer;
By providing a mask on the metal layer and performing an etching process on the metal layer, the first terminal portion and the first terminal portion are located apart from the first terminal portion by the wall portion. A fourth step of forming a second terminal portion connected to
A method of manufacturing a lead frame for an optical semiconductor device, comprising:

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