JP2006222271A - Substrate for mounting light-emitting element - Google Patents

Substrate for mounting light-emitting element Download PDF

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Publication number
JP2006222271A
JP2006222271A JP2005034365A JP2005034365A JP2006222271A JP 2006222271 A JP2006222271 A JP 2006222271A JP 2005034365 A JP2005034365 A JP 2005034365A JP 2005034365 A JP2005034365 A JP 2005034365A JP 2006222271 A JP2006222271 A JP 2006222271A
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Prior art keywords
pair
emitting element
light
light emitting
substrate
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JP2005034365A
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Masahito Morita
雅仁 森田
Makoto Nagai
誠 永井
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Priority to JP2005034365A priority Critical patent/JP2006222271A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting a light-emitting element capable of efficiently reflecting a light from the light-emitting element to be mounted, reducing the number of components, also facilitating a manufacture, and manufacturing the substrate at a low cost. <P>SOLUTION: The substrate 1 for mounting the light-emitting element contains a substrate body 2 having a surface 3 and a back face 4 and being composed of an insulating material and front ends 12 and 22 fixed on the base 7 of a recess 5 opened to the surface 3 of the substrate body 2. The substrate 1 further contains a specular surface 14 continuing to the front end 12 or the specular surface 24 which continues to the front end 22 and the whole of which displays an approximately semi-conical shape, and a pair of lead frames 10 and 20 with leads 16 and 26 continuing at the upper ends of such specular surfaces 14 and 24. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、発光ダイオードなどの発光素子を実装するための発光素子実装用基板に関する。   The present invention relates to a light emitting element mounting substrate for mounting a light emitting element such as a light emitting diode.

発光素子から発光される光を効率良く利用するため、エポキシ系樹脂からなる取付体のキャビティの底部に接するように異極である一対のリードフレームを離間して取り付け、一方のリードフレームの上に発光素子を取り付け且つ当該発光素子と他方のリードフレームとを電気的に接続すると共に、上記底部の周囲から対向して立設する一対の傾斜した壁部に光反射部を形成した発光装置が提案されている（例えば、特許文献１参照）   In order to efficiently use the light emitted from the light emitting element, a pair of lead frames having different polarities are attached so as to be in contact with the bottom of the cavity of the attachment body made of epoxy resin, and on one lead frame Proposed is a light-emitting device in which a light-emitting element is attached and the light-emitting element is electrically connected to the other lead frame, and a light reflecting portion is formed on a pair of inclined wall portions standing upright from the periphery of the bottom portion. (For example, see Patent Document 1)

特開２００３−１８８４２１号公報（第１〜１２頁、図１〜１２）JP 2003-188421 A (pages 1 to 12, FIGS. 1 to 12)

しかしながら、前記発光装置では、一対のリードフレームを対向させ且つ樹脂でこれらをモールドし、得られた取付体のほぼ直方体を呈するキャビティの対向する一対の傾斜した壁部にのみ光反射部を形成するため、上記キャビティの底部に取り付ける発光素子からの光の反射効率が低くなる。しかも、構成部品数が多く且つ製造工程も複雑になるため、コスト高にもなる、という問題点があった。   However, in the light emitting device, the pair of lead frames are made to face each other and molded with resin, and the light reflecting portion is formed only on the pair of inclined wall portions facing each other in the cavity that has a substantially rectangular parallelepiped shape of the obtained mounting body. Therefore, the reflection efficiency of light from the light emitting element attached to the bottom of the cavity is lowered. In addition, since the number of components is large and the manufacturing process is complicated, there is a problem that the cost is increased.

本発明は、前記背景技術における問題点を解決し、実装すべき発光素子の光を効率良く反射でき、構成部品数が少なく製造も容易で且つ安価な発光素子実装用基板を提供する、ことを課題とする。   The present invention solves the problems in the background art, and provides a light-emitting element mounting substrate that can efficiently reflect light of a light-emitting element to be mounted, has a small number of components, is easy to manufacture, and is inexpensive. Let it be an issue.

課題を解決するための手段および発明の効果Means for Solving the Problems and Effects of the Invention

本発明は、前記課題を解決するため、基板本体の表面に配置する一対のリードフレーム自体にほぼ円錐形またはほぼ円筒形などの反射面を形成する、ことに着想して成されたものである。
即ち、本発明の発光素子実装用基板（請求項１）は、表面および裏面を有し且つ絶縁材からなる基板本体と、かかる基板本体の表面に固着される先端部、かかる先端部に連なる反射面、およびかかる反射面に連なるリードをそれぞれ有する一対のリードフレームと、を含む、ことを特徴とする。 In order to solve the above-mentioned problems, the present invention has been conceived in that a pair of lead frames arranged on the surface of the substrate body itself is formed with a substantially conical or substantially cylindrical reflecting surface. .
That is, the substrate for mounting a light emitting element of the present invention (Claim 1) includes a substrate body having a front surface and a back surface and made of an insulating material, a tip portion fixed to the surface of the substrate body, and a reflection continuous to the tip portion. And a pair of lead frames each having a lead connected to the reflecting surface.

これによれば、一対のリードフレームにそれぞれ反射面が一体に形成されているため、構成部品数を少なくでき、製造も容易となり且つ安価に提供することが可能となる。しかも、対向する一対の反射面は、後述するように、基板本体の表面上方で、全体としてほぼ円錐形やほぼ長円錐形などの光の反射面を形成するため、追って実装する発光素子から発光される光を効率良く反射することができる。
尚、前記基板本体を形成する絶縁材には、例えばアルミナを主成分とするセラミック、例えばガラス−セラミックのような低温焼成セラミック、あるいは、例えばエポキシ系樹脂などが含まれる。かかる基板本体の前記表面には、当該表面に開口する凹部（キャビティ）の底面も含まれる。また、前記リードフレームには、Ｆｅ−４２ｗｔ％Ｎｉ（以下、４２アロイと称する）、Ｆｅ−２９ｗｔ％Ｎｉ−１７ｗｔ％Ｃｏ（以下、コバールと称する）、Ｃｕまたはその合金などが適用される。更に、一対のリードフレームにおける少なくとも一方の反射面には、前記先端部側が縮径されたほぼ半円錐形状、半楕円錐形状、半長円錐形状、半四角錐以上の多角錐形状のほか、半円柱形、半楕円柱形、半長円柱形、四角柱を含む多角円柱形状が含まれる。加えて、キャビティの底面に実装される発光素子には、発光ダイオード（ＬＥＤ）や半導体レーザ（ＬＤ）などが含まれる。 According to this, since the reflecting surfaces are integrally formed on the pair of lead frames, the number of components can be reduced, and the manufacturing becomes easy and can be provided at low cost. Moreover, the pair of opposing reflecting surfaces, as will be described later, form a light reflecting surface having a substantially conical shape or a substantially long conical shape as a whole above the surface of the substrate body, so that light is emitted from the light emitting element to be mounted later. The reflected light can be reflected efficiently.
The insulating material forming the substrate body includes, for example, a ceramic mainly composed of alumina, a low-temperature fired ceramic such as glass-ceramic, or an epoxy resin, for example. The surface of the substrate body also includes the bottom surface of a recess (cavity) that opens to the surface. Further, Fe-42 wt% Ni (hereinafter referred to as 42 alloy), Fe-29 wt% Ni-17 wt% Co (hereinafter referred to as Kovar), Cu or an alloy thereof is applied to the lead frame. Furthermore, at least one of the reflective surfaces of the pair of lead frames has a semi-conical shape, a semi-elliptical cone shape, a semi-conical cone shape, a polygonal pyramid shape that is a semi-quadrangular pyramid or more, Examples include a cylindrical shape, a semi-elliptical column shape, a semi-long cylindrical shape, and a polygonal cylindrical shape including a quadrangular column. In addition, the light emitting element mounted on the bottom surface of the cavity includes a light emitting diode (LED), a semiconductor laser (LD), and the like.

また、本発明には、前記一対の先端部の間、あるいは、当該一対の先端部の何れか一方の上に、または双方の上にまたがって発光素子の実装エリアが位置している、発光素子実装用基板（請求項２）も含まれる。これによれば、発光素子をロウ材や導電性の樹脂を介して、一方または双方のリードフレームの先端部上に実装することで、ボンディングワイヤによるボンディング（ロウ付け）を省略することが可能となる。   Further, the present invention provides a light emitting device in which a mounting area of the light emitting device is located between the pair of tip portions, on either one of the pair of tip portions, or over both. A mounting substrate (claim 2) is also included. According to this, it is possible to omit bonding (brazing) with a bonding wire by mounting the light emitting element on the leading end portion of one or both lead frames via a brazing material or conductive resin. Become.

更に、本発明には、前記一対のリードフレームにおける各反射面は、半円錐形、半長円錐形、半楕円錐形、半四角錐形を含む半多角錐形を呈し、それらの表面には、Ａｇ、Ｐｔ、Ｒｈ、またはＰｄのメッキ膜からなる光反射層が形成されている、発光素子実装用基板（請求項３）も含まれる。
これによれば、対向する一対の各反射面により、全体が円錐形、長円錐形、楕円錐形、四角錐形を呈する光反射層が形成されので、追って実装される発光素子からの光を効率良く反射でき、且つ所定の範囲に集光しつつ外部に放射することが可能となる。尚、前記光反射層は、反射面の上にＮｉや、Ａｕなどのメッキ膜を介して形成されるＡｇ、Ｐｔ、Ｒｈ、またはＰｄのメッキ膜である。 Further, according to the present invention, each reflecting surface of the pair of lead frames has a semi-conical shape including a semi-conical shape, a semi-long conical shape, a semi-elliptical pyramid shape, and a semi-quadrangular pyramid shape. , A light emitting element mounting substrate on which a light reflecting layer made of a plating film of Ag, Pt, Rh, or Pd is formed.
According to this, a light reflecting layer having a conical shape, a long conical shape, an elliptical cone shape, and a quadrangular pyramid shape is formed by a pair of opposing reflecting surfaces. It can be reflected efficiently and can be emitted to the outside while being condensed within a predetermined range. The light reflection layer is a plating film of Ag, Pt, Rh, or Pd formed on the reflection surface via a plating film such as Ni or Au.

付言すれば、本発明には、前記一対のリードフレームのうち、一方のリードフレームの反射面は、長方形であり、他方のリードフレームの反射面は、上記長方形の反射面とほぼ相似形に切り欠いたほぼ円錐形、ほぼ長円錐形、ほぼ楕円錐形、ほぼ四角錐形を含むほぼ多角錐形を呈し、それらの表面には、Ａｇメッキ膜などからなる光反射層が形成されている、発光素子実装用基板も含まれ得る。
これによる場合、一方のリードフレームは、例えば、細長く単純な長方形の金属板を曲げ加工するだけで形成でき、他方のリードフレームについてのみ、所要形状の金属板をプレス加工または絞り加工と曲げ加工することにより、一対のリードフレームを形成することが可能となる。 In other words, according to the present invention, the reflective surface of one lead frame of the pair of lead frames is rectangular, and the reflective surface of the other lead frame is cut into a shape substantially similar to the rectangular reflective surface. It exhibits a substantially conical shape, a substantially long cone shape, a substantially elliptical cone shape, a substantially polygonal pyramid shape including a substantially quadrangular pyramid shape, and a light reflecting layer made of an Ag plating film or the like is formed on the surface thereof. A light emitting element mounting substrate may also be included.
In this case, for example, one lead frame can be formed simply by bending a thin and simple rectangular metal plate, and only the other lead frame is bent by pressing or drawing a metal plate having a required shape. Thus, a pair of lead frames can be formed.

また、本発明には、前記一対のリードフレームにおける各反射面は、前記基板本体の表面に対し当該表面の上方に向かって互いに離間するように傾斜している、発光素子実装用基板も含まれ得る。
これによる場合、基板本体の表面などに実装される発光素子の光を効率良く反射し且つ所定の範囲に集光しつつ外部に放射することが可能となる。尚、本発明において、基板本体の表面には、当該表面に開口する凹部の底面も含まれる。 The present invention also includes a light emitting element mounting substrate in which the reflecting surfaces of the pair of lead frames are inclined with respect to the surface of the substrate body so as to be separated from each other toward the upper side of the surface. obtain.
In this case, it is possible to efficiently reflect the light of the light emitting element mounted on the surface of the substrate body or the like and radiate it outside while condensing it within a predetermined range. In the present invention, the surface of the substrate body also includes the bottom surface of the recess opening in the surface.

以下において、本発明を実施するための最良の形態について説明する。
図１は、本発明における一形態の発光素子実装用基板１を示す平面図、図２は、図１中のＸ−Ｘ線の矢視に沿った断面（端面）図である。
発光素子実装用基板１は、図１，図２に示すように、表面３および裏面４を有する基板本体２と、かかる基板本体２の表面３に開口する凹部５の底面７に先端部１２，２２が固着される対向する一対のリードフレーム１０，２０と、を含んでいる。基板本体２は、例えばアルミナを主成分とするセラミック、例えばガラス−セラミックのような低温焼成セラミック、あるいは、例えばエポキシ系樹脂などの絶縁材からなり、平面視でほぼ正方形を呈する。また、凹部５は、平面視でほぼ正方形の底面７とその周辺から立設する４つの側面６とからなる。
尚、凹部５の底面７は、本発明において基板本体の表面に含まれる。また、リードフレーム１０，２０は、互いに異なる回路の一部、または互いに異極である。 In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a plan view showing a light emitting element mounting substrate 1 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional (end face) view taken along the line XX in FIG.
As shown in FIGS. 1 and 2, the light-emitting element mounting substrate 1 includes a substrate body 2 having a front surface 3 and a back surface 4, and a front end portion 12 on a bottom surface 7 of a recess 5 that opens in the front surface 3 of the substrate body 2. And a pair of opposing lead frames 10 and 20 to which 22 is fixed. The substrate body 2 is made of a ceramic mainly composed of alumina, for example, a low-temperature fired ceramic such as glass-ceramic, or an insulating material such as an epoxy resin, and has a substantially square shape in plan view. The concave portion 5 includes a substantially square bottom surface 7 and four side surfaces 6 erected from the periphery thereof in plan view.
The bottom surface 7 of the recess 5 is included in the surface of the substrate body in the present invention. The lead frames 10 and 20 are part of different circuits or have different polarities.

図１乃至図３に示すように、一方のリードフレーム１０は、平面視が細長い長方形を呈し、凹部５の底面７にロウ材１８または接着性の樹脂を介して水平に固着される先端部１２と、かかる先端部１２から斜め上向きに連なる反射面１４と、かかる反射面１４の上端から水平に連なるリード１６と、を備えている。
また、図１乃至図３に示すように、他方のリードフレーム２０は、平面視がほぼＣ字形で且つ凹部５の底面７にロウ材１８または前記樹脂を介して水平に固着される先端部２２と、その周囲から斜め上向きに広がりつつ連なるほぼ円錐形の反射面２４と、かかる反射面２４の上端中央から水平に連なるリード２６とを備えている。先端部２２の内側には、ほぼ円形の開口縁２３が位置し、当該先端部２２および反射面２４のうち、リード２６の反対側には、一方のリードフレーム１０における先端部１２と反射面１４とを、一対の間隙を介して受け入れるほぼ相似形の開口部２５が形成されている。
尚、上記リードフレーム１０，２０のリード１６，２６は、図示しない異なる回路に導通されるか、互いに異極の回路に導通される。 As shown in FIGS. 1 to 3, one lead frame 10 has an elongated rectangular shape in plan view, and is fixed to the bottom surface 7 of the recess 5 horizontally via a brazing material 18 or an adhesive resin. And a reflection surface 14 that extends obliquely upward from the tip 12 and a lead 16 that extends horizontally from the upper end of the reflection surface 14.
As shown in FIGS. 1 to 3, the other lead frame 20 is substantially C-shaped in plan view and is fixed to the bottom surface 7 of the recess 5 horizontally through the brazing material 18 or the resin. And a substantially conical reflection surface 24 that extends obliquely upward from the periphery thereof, and a lead 26 that extends horizontally from the center of the upper end of the reflection surface 24. A substantially circular opening edge 23 is located inside the distal end portion 22, and the distal end portion 12 and the reflective surface 14 of one lead frame 10 are on the opposite side of the lead 26 among the distal end portion 22 and the reflective surface 24. Are formed through a pair of gaps.
The leads 16 and 26 of the lead frames 10 and 20 are conducted to different circuits (not shown) or to circuits having different polarities.

前記リードフレーム１０，２０は、例えば、４２アロイ、コバール、あるいは、Ｃｕまたはその合金などからなり、一方のリードフレーム１０は、細長い長方形の金属板を曲げ加工することで、他方のリードフレーム２０は、所要形状の金属板をプレス加工または絞り加工および曲げ加工することで形成される。
図１，図２に示すように、一方のリードフレーム１０の先端部１２および反射面１４は、前記開口部２５に一対の間隙を介して挿入され、他方のリードフレーム２０の先端部２２および反射面２４をそれぞれ補完する。このため、上記反射面１４は、緩いカーブの曲面である。
従って、一対のリードフレーム１０，２０の先端部１２，２２は、平面視で全体として円形を形成し、反射面１４，２４は、全体としてほぼ円錐形を形成する。かかる反射面１４，２４の全面には、図２に示すように、図示しないＮｉやＡｕメッキ膜を介して、Ａｇなどのメッキ膜からなる光反射層１７，２７が形成されている。 The lead frames 10 and 20 are made of, for example, 42 alloy, Kovar, or Cu or an alloy thereof, and one lead frame 10 is formed by bending an elongated rectangular metal plate. The metal plate having a required shape is formed by pressing or drawing and bending.
As shown in FIGS. 1 and 2, the leading end portion 12 and the reflecting surface 14 of one lead frame 10 are inserted into the opening 25 through a pair of gaps, and the leading end portion 22 and the reflecting portion of the other lead frame 20 are reflected. Each surface 24 is complemented. For this reason, the reflective surface 14 is a curved surface with a gentle curve.
Therefore, the tip portions 12 and 22 of the pair of lead frames 10 and 20 form a circular shape as a whole in plan view, and the reflecting surfaces 14 and 24 form a substantially conical shape as a whole. As shown in FIG. 2, light reflection layers 17 and 27 made of a plating film such as Ag are formed on the entire reflection surfaces 14 and 24 through a Ni or Au plating film (not shown).

図１，図２に示すように、リードフレーム１０，２０の先端部１２，２２の間に位置し、且つ開口縁２３などに囲まれた凹部５の底面７上には、Ｓｎ−Ａｇ系などの低融点合金からなるロウ材９またはエポキシ系樹脂を介して、発光ダイオード（発光素子）８が追って実装される。かかる発光ダイオード８は、一対のボンディングワイヤｗを介して、リードフレーム１０，２０の先端部１２，２２に個別にボンディング（ロウ付け）されて導通可能とされる。尚、上記発光ダイオード８に替えて、半導体レーザを実装しても良い。
図４に示すように、底面７上に発光ダイオード８を実装した凹部５内には、固化前の封止用樹脂ｊが上向きで且つ凸曲面状に盛り上げつつ充填され且つ固化される。かかる封止用樹脂ｊは、エポキシ系樹脂からなり、発光ダイオード８およびボンディングワイヤｗを封止すると共に、当該発光ダイオード８から発光され且つ円錐形状の反射面１４，２４で反射した光を透過させると共に、かかる光をその表面付近で集光ししつ外部に放射する。 As shown in FIGS. 1 and 2, an Sn—Ag system or the like is disposed on the bottom surface 7 of the concave portion 5 that is located between the leading end portions 12 and 22 of the lead frames 10 and 20 and surrounded by the opening edge 23 and the like. A light-emitting diode (light-emitting element) 8 is mounted later via a brazing material 9 made of a low melting point alloy or an epoxy resin. The light-emitting diode 8 is individually bonded (brazed) to the tip portions 12 and 22 of the lead frames 10 and 20 through a pair of bonding wires w so as to be conductive. A semiconductor laser may be mounted instead of the light emitting diode 8.
As shown in FIG. 4, in the recess 5 in which the light emitting diode 8 is mounted on the bottom surface 7, the sealing resin j before being solidified is filled and solidified while being raised upward and convexly curved. The sealing resin j is made of epoxy resin, seals the light emitting diode 8 and the bonding wire w, and transmits light emitted from the light emitting diode 8 and reflected by the conical reflecting surfaces 14 and 24. At the same time, the light is condensed near the surface and emitted outside.

以上のような発光素子実装用基板１によれば、一対のリードフレーム１０，２０にそれぞれ反射面１４，２４が一体に形成されているため、構成部品数を少なくでき、製造も容易となり且つ安価に提供可能となる。しかも、対向する一対の反射面１４，２４は、全体としてほぼ円錐形を形成するため、リードフレーム１０，２０の先端部１２，２２間に発光ダイオード８を追って実装した際に、当該発光ダイオード８の光を効率良く反射でき且つ所定の範囲に集光させつつ外部に放射させることが可能となる。   According to the light emitting element mounting substrate 1 as described above, since the reflecting surfaces 14 and 24 are integrally formed on the pair of lead frames 10 and 20, respectively, the number of components can be reduced, and the manufacturing becomes easy and inexpensive. Can be provided. Moreover, since the pair of opposed reflecting surfaces 14 and 24 form a substantially conical shape as a whole, when the light emitting diode 8 is mounted between the front end portions 12 and 22 of the lead frames 10 and 20, the light emitting diode 8 is concerned. Can be efficiently reflected and emitted to the outside while being condensed within a predetermined range.

図５は、異なる形態の発光素子実装用基板３０を示す平面図、図６は、図５中のＹ−Ｙ線の矢視に沿った断面（端面）図である。
発光素子実装用基板３０は、図５，図６に示すように、前記同様の基板本体２と、かかる基板本体２の表面３に開口する凹部５の底面７にそれぞれの先端部３２が固着される対向する一対の左右対称なリードフレーム３１と、を含んでいる。
一対のリードフレーム３１は、前記４２アロイなどからなり、平面視が半円弧形で且つ内側に半円形の開口縁３３を有する先端部３２と、かかる先端部３２の周囲から斜め上向きに広がりつつ連なるほぼ半円錐形の反射面３４と、かかる反射面３４の上端中央から水平に連なるリード３６と、をそれぞれ備えている。
尚、各リードフレーム３１のリード３６は、図示しない異なる回路に導通されるか、互いに異極の回路に導通される。 FIG. 5 is a plan view showing a light emitting element mounting substrate 30 in a different form, and FIG. 6 is a cross-sectional (end face) view taken along the line YY in FIG.
As shown in FIGS. 5 and 6, the light emitting element mounting substrate 30 is fixed at its leading end 32 to the substrate body 2 similar to the above and the bottom surface 7 of the recess 5 opening on the surface 3 of the substrate body 2. And a pair of symmetrical lead frames 31 facing each other.
The pair of lead frames 31 is composed of the 42 alloy or the like, and has a semicircular arc shape in plan view and a semicircular opening edge 33 on the inside, and a tip portion 32 that extends obliquely upward from the periphery of the front end portion 32. A continuous semi-conical reflecting surface 34 and a lead 36 extending horizontally from the center of the upper end of the reflecting surface 34 are provided.
The lead 36 of each lead frame 31 is conducted to a different circuit (not shown), or is conducted to circuits having different polarities.

図５，図６に示すように、一対のリードフレーム３１は、基板本体２の表面３上および凹部５の底面７上において、隙間ｓを介して左右対称に配置され、各先端部３２を前記同様のロウ材３８などを介して、底面７上に離間して固着される。このため、一対の反射面３４は、隙間ｓを介して左右対称に配置され、全体としてほぼ円錐形を形成する。各反射面３４の全面には、図６に示すように、図示しないＮｉやＡｕメッキ膜を介して、Ａｇなどのメッキ膜からなる光反射層３７が被覆されている。かかる一対のリードフレーム３１も、互いに異なる回路の一部、または互いに異極とされている。
図５，図６に示すように、一対の先端部３２の各開口縁３３の間に露出する底面７上には、前記同様にロウ材９を介して発光ダイオード８が追って実装されると共に、前記同様のボンディングワイヤｗを介して、発光ダイオード８と各リードフレーム３１とが導通される。更に、前記封止用樹脂ｊが、前記同様に凹部５内およびその上方に反射面３４全体を覆うように盛り上げて充填・固化される。 As shown in FIGS. 5 and 6, the pair of lead frames 31 are symmetrically disposed on the surface 3 of the substrate body 2 and the bottom surface 7 of the recess 5 with a gap s therebetween, and the tip portions 32 are arranged on the front side 32. It is fixed on the bottom surface 7 through a similar brazing material 38 and the like. For this reason, the pair of reflecting surfaces 34 are disposed symmetrically with respect to the gap s, and form a substantially conical shape as a whole. As shown in FIG. 6, a light reflecting layer 37 made of a plating film such as Ag is coated on the entire surface of each reflecting surface 34 via a Ni or Au plating film (not shown). The pair of lead frames 31 are also part of different circuits or have different polarities.
As shown in FIGS. 5 and 6, the light emitting diode 8 is mounted on the bottom surface 7 exposed between the opening edges 33 of the pair of tip portions 32 by way of the brazing material 9 in the same manner as described above. The light emitting diode 8 and each lead frame 31 are electrically connected via the same bonding wire w. Further, the sealing resin j is raised and filled and solidified so as to cover the entire reflecting surface 34 in and above the recess 5 as described above.

以上のような発光素子実装用基板３０によれば、同じ形状からなる一対のリードフレーム３１を対称に配置し、且つ両者の先端部３２を基板本体２の凹部５における底面７上に離間して固着することで製造できるため、構成部品を一層低減できると共に、安価に提供可能となる。しかも、対向する一対の反射面３４は、全体としてほぼ円錐形を形成するため、各リードフレーム３１の先端部３２間に発光ダイオード８を追って実装した際に、当該発光ダイオード８の光を効率良く反射でき且つ所定の範囲に集光させつつ外部に放射させることが可能となる。   According to the light emitting element mounting substrate 30 as described above, a pair of lead frames 31 having the same shape are arranged symmetrically, and both tip portions 32 are spaced apart from the bottom surface 7 in the recess 5 of the substrate body 2. Since it can manufacture by adhering, it can reduce a component further and can provide at low cost. Moreover, since the pair of opposing reflecting surfaces 34 form a substantially conical shape as a whole, when the light emitting diodes 8 are mounted between the front end portions 32 of the lead frames 31, the light from the light emitting diodes 8 is efficiently transmitted. It is possible to reflect and radiate outside while condensing in a predetermined range.

図７は、前記発光素子実装用基板３０の変形形態である発光素子実装用基板３０ａを示す平面図、図８は、図７中のＹ−Ｙ線の矢視に沿った断面（端面）図である。かかる発光素子実装用基板３０ａは、図７，図８に示すように、前記同様の基板本体２と、かかる基板本体２の表面３に開口する凹部５の底面７にそれぞれの先端部３２，３２ａが固着される対向する一対のほぼ対称なリードフレーム３１，３１ａと、を含んでいる。かかるリードフレーム３１，３１ａは、前記４２アロイなどからなる。
一方のリードフレーム３１は、前記同様の開口縁３３を有する先端部３２と、ほぼ半円錐形の反射面３４と、かかる反射面３４の上端中央から水平に連なるリード３６と、を備えている。他方のリードフレーム３１ａは、上記と同じ反射面３４とリード３６とを有するが、反射面３４の内側にはその底辺に囲まれ且つ平面視でほぼ半円形の先端部３２ａを有し、かかる先端部３２ａには、当該先端部３２ａと共に実装エリアを形成する凸部３２ｂが一体に突設されている。 7 is a plan view showing a light emitting element mounting substrate 30a which is a modification of the light emitting element mounting substrate 30, and FIG. 8 is a cross-sectional (end face) view taken along the line YY in FIG. It is. As shown in FIGS. 7 and 8, the light emitting element mounting substrate 30 a includes the same substrate main body 2 and tip portions 32, 32 a on the bottom surface 7 of the concave portion 5 opened in the surface 3 of the substrate main body 2. And a pair of generally symmetric lead frames 31, 31a to which are fixed. The lead frames 31, 31a are made of the 42 alloy or the like.
One lead frame 31 includes a tip 32 having an opening edge 33 similar to that described above, a substantially semi-conical reflecting surface 34, and a lead 36 extending horizontally from the center of the upper end of the reflecting surface 34. The other lead frame 31a has the same reflective surface 34 and lead 36 as described above, but has an almost semicircular tip portion 32a surrounded by the bottom of the reflective surface 34 and in plan view. A convex portion 32b that forms a mounting area together with the tip end portion 32a is integrally projected on the portion 32a.

図７，図８に示すように、一対のリードフレーム３１，３１ａは、基板本体２の表面３上および凹部５の底面７上において、隙間ｓを介して左右対称に配置され、各先端面３２，３２ａを前記同様のロウ材３８などを介して、底面７上に離間して固着される。また、一対の反射面３４は、隙間ｓを介して左右対称に配置され、全体としてほぼ円錐形を形成する。各反射面３４の全面には、図８に示すように、前記同様にＡｇなどのメッキ膜からなる光反射層３７が被覆されている。かかる一対のリードフレーム３１，３１ａも、互いに異なる回路の一部、または互いに異極とされている。
図７，図８に示すように、他方のリードフレーム３１ａの先端部３２ａと凸部３２ｂとにまたがる実装エリアには、前記同様にロウ材９を介して発光ダイオード８が追って実装されると共に、前記同様のボンディングワイヤｗを介して、当該発光ダイオード８と一方のリードフレーム３１とが導通される。
尚、上記ロウ材９または導電性の樹脂を介する場合、発光ダイオード８の底面に位置する図示しない電極とリードフレーム３１ａの先端部３２ａとの間で導通が取れるため、上記ボンディングワイヤｗを省略できる。 As shown in FIGS. 7 and 8, the pair of lead frames 31, 31 a are disposed symmetrically on the front surface 3 of the substrate body 2 and the bottom surface 7 of the recess 5 via the gap s, and each front end surface 32. , 32a are fixed to the bottom surface 7 via the brazing material 38 similar to the above. In addition, the pair of reflecting surfaces 34 are arranged symmetrically with respect to the gap s, and form a substantially conical shape as a whole. As shown in FIG. 8, a light reflecting layer 37 made of a plating film such as Ag is coated on the entire surface of each reflecting surface 34 as shown in FIG. The pair of lead frames 31 and 31a are also part of different circuits or have different polarities.
As shown in FIGS. 7 and 8, the light emitting diode 8 is mounted on the mounting area extending over the leading end portion 32a and the convex portion 32b of the other lead frame 31a via the brazing material 9 in the same manner as described above. The light emitting diode 8 and one lead frame 31 are electrically connected through the same bonding wire w.
When the brazing material 9 or conductive resin is used, the bonding wire w can be omitted because electrical connection is obtained between an electrode (not shown) located on the bottom surface of the light emitting diode 8 and the tip 32a of the lead frame 31a. .

更に、前記封止用樹脂ｊが、前記同様に凹部５内およびその上方に反射面３４全体を覆うように盛り上げて充填され且つ固化される。
以上のような発光素子実装用基板３０ａによれば、一対のリードフレーム３１，３１ａにそれぞれ反射面３４が一体に形成されているため、構成部品数が少なく製造も容易となり且つ安価に提供可能となる。また、対向する一対の反射面３４全体がほぼ円錐形を形成するため、追って他方のリードフレーム３１ａの先端部３２ａなどの上に発光ダイオード８を実装した際、当該発光ダイオード８の光を効率良く反射でき且つ外部に放射させることが可能となる。 Further, the sealing resin j is filled and solidified so as to cover the entire reflecting surface 34 in and above the recess 5 as described above.
According to the light emitting element mounting substrate 30a as described above, since the reflective surface 34 is integrally formed on each of the pair of lead frames 31, 31a, the number of components is small, the manufacturing is easy, and it can be provided at a low cost. Become. Further, since the entire pair of opposing reflecting surfaces 34 form a substantially conical shape, when the light emitting diode 8 is mounted on the tip portion 32a or the like of the other lead frame 31a, the light from the light emitting diode 8 is efficiently transmitted. It can be reflected and emitted to the outside.

図９は、前記発光素子実装用基板３０の異なる変形形態である発光素子実装用基板３０ｂを示す平面図、図１０は、図９中のＹ−Ｙ線の矢視に沿った断面（端面）図である。かかる発光素子実装用基板３０ｂは、図９，図１０に示すように、前記同様の基板本体２と、かかる基板本体２の表面３に開口する凹部５の底面７にそれぞれの先端部３２ｃ，３２ｃが固着される対向する一対の左右対称なリードフレーム３１ｂと、を含んでいる。
一対のリードフレーム３１ｂは、前記４２アロイなどからなり、平面視が半円形の先端部３２ｃと、かかる先端部３２ｃの周囲から斜め上向きに広がりつつ連なるほぼ半円錐形の反射面３４と、かかる反射面３４の上端中央から水平に連なるリード３６と、をそれぞれ備えている。 9 is a plan view showing a light emitting element mounting substrate 30b which is a different modification of the light emitting element mounting substrate 30, and FIG. 10 is a cross section (end face) taken along the line YY in FIG. FIG. As shown in FIGS. 9 and 10, the light emitting element mounting substrate 30b includes the same substrate main body 2 and tip portions 32c and 32c on the bottom surface 7 of the concave portion 5 opened on the surface 3 of the substrate main body 2, respectively. And a pair of opposing symmetric lead frames 31b to which are fixed.
The pair of lead frames 31b is composed of the 42 alloy or the like, and has a semicircular tip 32c in plan view, a substantially semiconical reflecting surface 34 that extends obliquely upward from the periphery of the tip 32c, and the reflection. And a lead 36 extending horizontally from the center of the upper end of the surface 34.

図９，図１０に示すように、一対のリードフレーム３１ｂも、基板本体２の表面３上および凹部５の底面７上において、隙間ｓを介して左右対称に配置され、各先端部３２を前記同様のロウ材３８などを介して、底面７上に離間して固着される。このため、一対の反射面３４も、隙間ｓを介して左右対称に配置され、全体としてほぼ円錐形を形成する。各反射面３４の全面にも、前記同様にしてＡｇなどのメッキ膜からなる光反射層３７が被覆されている。かかる一対のリードフレーム３１ｂも、互いに異なる回路の一部、または互いに異極とされている。
図９，図１０に示すように、一対の先端部３２ｃ，３２ｃ上にまたがる実装エリアには、前記同様にロウ材９を介して発光ダイオード８のほぼ左右半分ずつが追って実装される。上記ロウ材９または導電性の樹脂を用いる場合には、発光ダイオード８の底面に位置する図示しない電極と各リードフレーム３１ｂの先端部３２ｃとの間で導通が取れるため、前記ボンディングワイヤｗを省略できる。 As shown in FIGS. 9 and 10, the pair of lead frames 31b are also arranged symmetrically on the front surface 3 of the substrate body 2 and the bottom surface 7 of the recess 5 with a gap s therebetween, and the tip portions 32 are connected to the front ends 32. It is fixed on the bottom surface 7 through a similar brazing material 38 and the like. For this reason, the pair of reflecting surfaces 34 are also arranged symmetrically via the gap s and form a substantially conical shape as a whole. A light reflecting layer 37 made of a plating film of Ag or the like is also coated on the entire reflecting surface 34 in the same manner as described above. The pair of lead frames 31b are also part of different circuits or have different polarities.
As shown in FIGS. 9 and 10, the left and right halves of the light emitting diode 8 are mounted on the mounting area extending over the pair of tip portions 32 c and 32 c in the same manner as described above via the brazing material 9. When the brazing material 9 or the conductive resin is used, the bonding wire w is omitted because conduction is established between an electrode (not shown) located on the bottom surface of the light emitting diode 8 and the tip 32c of each lead frame 31b. it can.

更に、前記封止用樹脂ｊが、前記同様に凹部５内およびその上方に反射面３４全体を覆うように盛り上がって充填され且つ固化される。
以上のような発光素子実装用基板３０ｂによれば、同じ形状からなる一対のリードフレーム３１ｂを対称に配置し、且つ両者の先端部３２ｃを基板本体２の凹部５における底面７上に離間して固着することで製造できるため、構成部品を一層低減できるため、安価に提供可能となる。しかも、一対の反射面３４全体がほぼ円錐形を形成するため、追って各リードフレーム３１ｂの各先端部３２ｃ上にまたがって発光ダイオード８を実装した際、当該発光ダイオード８の光を効率良く反射でき且つ外部に放射でき、且つボンディングワイヤｗの省略も可能となる。 Further, the sealing resin j is raised and filled and solidified so as to cover the entire reflecting surface 34 in and above the recess 5 as described above.
According to the light emitting element mounting substrate 30b as described above, the pair of lead frames 31b having the same shape are arranged symmetrically, and the tip portions 32c of both are separated on the bottom surface 7 of the recess 5 of the substrate body 2. Since it can manufacture by adhering, since it can further reduce a component, it can provide at low cost. In addition, since the entire pair of reflecting surfaces 34 form a substantially conical shape, when the light emitting diode 8 is mounted over the tip portions 32c of the lead frames 31b, the light from the light emitting diode 8 can be efficiently reflected. In addition, radiation can be radiated to the outside, and the bonding wire w can be omitted.

図１１は、更に異なる形態の発光素子実装用基板４０を示す平面図、図１２は、図１１中のＺ−Ｚ線の矢視に沿った断面（端面）図である。
発光素子実装用基板４０は、図１１，図１２に示すように、表面４３および裏面４４を有する基板本体４２と、かかる基板本体４２の表面４３に開口する凹部４５の底面４７に、各先端部５２が離間して固着される対向する一対のリードフレーム５０と、を含んでいる。基板本体４２も、アルミナなどを主成分とするセラミック、ガラス−セラミックのような低温焼成セラミック、あるいは、エポキシ系樹脂などの絶縁材からなり、平面視で長方形を呈する。また、凹部４５は、平面視で長方形の底面４７とその周辺から立設する４つの側面４６とからなる。
尚、凹部４５の底面４７も、本発明において基板本体の表面に含まれる。また、各リードフレーム５０は、互いに異なる回路の一部、または互いに異極である。 FIG. 11 is a plan view showing a light emitting element mounting substrate 40 in a further different form, and FIG. 12 is a cross-sectional (end face) view taken along the line ZZ in FIG.
As shown in FIGS. 11 and 12, the light emitting element mounting substrate 40 is provided with a front end portion on each of a substrate main body 42 having a front surface 43 and a back surface 44, and a bottom surface 47 of a recess 45 opening in the front surface 43 of the substrate main body 42. And a pair of opposing lead frames 50 to which 52 is fixed while being separated. The substrate body 42 is also made of a ceramic mainly composed of alumina or the like, a low-temperature fired ceramic such as glass-ceramic, or an insulating material such as an epoxy resin, and has a rectangular shape in plan view. The concave portion 45 includes a rectangular bottom surface 47 and four side surfaces 46 erected from the periphery thereof in plan view.
The bottom surface 47 of the recess 45 is also included in the surface of the substrate body in the present invention. In addition, each lead frame 50 has a part of a different circuit or a different polarity from each other.

図１１，図１２に示すように、一対のリードフレーム５０は、前記４２アロイなどからなり、平面視が半長円円形で且つ内側に半長円形の開口縁５３を有する先端部５２と、かかる先端部５２の周囲から斜め上向きに広がりつつ連なるほぼ半長円錐形の反射面５４と、かかる反射面５４の上端中央から水平に連なるリード５６と、をそれぞれ備え且つ平面視でほぼＹ字形を呈している。
尚、各リードフレーム５０のリード５６は、図示しない異なる回路に導通されるか、互いに異極の回路に導通される。 As shown in FIGS. 11 and 12, the pair of lead frames 50 is made of the 42 alloy and the like, and has a front end portion 52 having a semi-oval shape in plan view and having a semi-oval open edge 53 on the inside. A substantially semi-long conical reflecting surface 54 extending obliquely upward from the periphery of the tip portion 52 and a lead 56 extending horizontally from the center of the upper end of the reflecting surface 54 and each having a substantially Y shape in plan view. ing.
The lead 56 of each lead frame 50 is conducted to a different circuit (not shown), or is conducted to circuits having different polarities.

図１１，図１２に示すように、一対のリードフレーム５０は、基板本体４２の表面４３上および凹部４５の底面４７上において、隙間ｓを介して左右対称に配置され、各先端部５２を前記同様のロウ材５８などを介して、底面４７上に離間して固着される。このため、一対の反射面５４は、隙間ｓを介して左右対称に配置され、全体としてほぼ長円錐形を形成する。各反射面５４の全面にも、図１２に示すように、前記同様にしてＡｇなどのメッキ膜からなる光反射層５７が被覆されている。かかる一対のリードフレーム５０も、互いに異なる回路の一部、または互いに異極とされている。
図１１，図１２に示すように、一対の先端部５２の各開口縁５３間に露出する底面４７上には、前記同様にロウ材９を介して発光ダイオード８が追って実装されると共に、前記同様のボンディングワイヤｗを介して、発光ダイオード８と各リードフレーム５０とが導通される。
更に、図１２中の一点鎖線で示すように、前記封止用樹脂ｊが、前記同様に凹部４５内およびその上方に各反射面５４全体を覆うように盛り上げて充填・固化される。 As shown in FIGS. 11 and 12, the pair of lead frames 50 are arranged symmetrically on the surface 43 of the substrate body 42 and the bottom surface 47 of the recess 45 via the gap s, and each tip 52 is connected to the front end 52. It is fixed on the bottom surface 47 via a similar brazing material 58 and the like. For this reason, the pair of reflecting surfaces 54 are arranged symmetrically with respect to the gap s, and form a substantially long cone as a whole. As shown in FIG. 12, a light reflecting layer 57 made of a plating film of Ag or the like is coated on the entire surface of each reflecting surface 54 as shown in FIG. The pair of lead frames 50 are also part of different circuits or have different polarities.
As shown in FIGS. 11 and 12, the light emitting diode 8 is mounted on the bottom surface 47 exposed between the opening edges 53 of the pair of tip portions 52 via the brazing material 9 in the same manner as described above. The light emitting diode 8 and each lead frame 50 are electrically connected through the same bonding wire w.
Further, as indicated by the alternate long and short dash line in FIG. 12, the sealing resin j is raised and filled and solidified so as to cover the entire reflecting surface 54 in and above the recess 45 as described above.

以上のような発光素子実装用基板４０によれば、同じ形状からなる一対のリードフレーム５０を対称に配置し、且つ両者の先端部５２を基板本体４２の凹部４５における底面４７上に離間して固着することで製造でき、構成部品を一層低減でき且つ安価に提供可能となる。また、対向する一対の反射面５４は、全体としてほぼ長円錐形を形成するため、追って各リードフレーム５０の先端部５２間に発光ダイオード８を実装した際に、当該発光ダイオード８の光を効率良く反射でき且つ所定の範囲に集光させつつ外部に放射させることが可能となる。
尚、一対のリードフレーム５０のうちの一方は、反射面５４の底辺に囲まれた平面視が半長円形の先端部を一体に形成し、かかる先端部に前記同様の凸部を突設して、実装エリアを凸部上および先端部上に有するリードフレームとしても良い。また、一対のリードフレーム５０は、各反射面５４の底辺に囲まれた平面視が半長円形の先端部をそれぞれ一体に形成し、かかる一対の先端部上にまたがって実装エリアを形成する形態としても良い。 According to the light emitting element mounting substrate 40 as described above, the pair of lead frames 50 having the same shape are arranged symmetrically, and the tip portions 52 of both are spaced apart from the bottom surface 47 of the recess 45 of the substrate body 42. It can be manufactured by fixing, and the components can be further reduced and provided at low cost. In addition, since the pair of opposing reflecting surfaces 54 form a substantially long cone as a whole, when the light emitting diode 8 is mounted between the front end portions 52 of the lead frames 50 later, the light from the light emitting diode 8 is efficiently used. It can be reflected well and can be emitted outside while being condensed within a predetermined range.
Note that one of the pair of lead frames 50 is integrally formed with a tip portion that is semicircular in plan view surrounded by the bottom of the reflecting surface 54, and a convex portion similar to the above is provided at the tip portion. Thus, a lead frame having mounting areas on the convex portion and the tip portion may be used. Further, the pair of lead frames 50 is formed by integrally forming tip portions that are semi-elliptical in plan view surrounded by the bottom sides of the reflecting surfaces 54, and forming a mounting area over the pair of tip portions. It is also good.

更に、前記一対のリードフレーム５０の先端部５２の外形および反射面５４を、平面視でほぼ半楕円形状を呈する形態としても良い。かかる形態からなる一対のリードフレームは、一対の反射面を対向させて前記基板本体４２に固着した際に、平面視が楕円形で且つ全体がほぼ楕円錐形を呈する反射面が形成される。
また、前記一対のリードフレーム５０は、平面視がほぼコ字形の先端部と、その周囲を囲う半四角錐形の反射面とを有する形態としても良い。かかる形態からなる一対のリードフレームは、半四角錐形を呈する一対の反射面を対向させて、前記基板本体４２に固着した際に、平面視が長方形で且つ全体がほぼ四角錐を呈する反射面が形成される。かかる四角錐の反射面において、隣接する反射面同士の凹んだコーナ部に、表面が曲面になるようにロウ材を充填した後、かかるロウ材の表面および４つの反射面に前記Ａｇメッキ膜などの光反射層を形成することにより、前記同様の平面視が長円形の反射面を形成することが可能となる。 Further, the outer shape of the distal end portion 52 of the pair of lead frames 50 and the reflection surface 54 may be formed in a substantially semi-elliptical shape in plan view. When the pair of lead frames having such a configuration are fixed to the substrate body 42 with the pair of reflecting surfaces facing each other, a reflecting surface having an elliptical shape in plan view and an overall elliptical cone shape is formed.
Further, the pair of lead frames 50 may have a front end portion that is substantially U-shaped in plan view and a semi-quadrangular pyramid-shaped reflecting surface that surrounds the tip portion. The pair of lead frames having such a configuration has a pair of reflecting surfaces having a semi-quadrangular pyramid shape facing each other and fixed to the substrate body 42. The reflecting surface has a rectangular shape in plan view and a substantially quadrangular pyramid as a whole. Is formed. In such a quadrangular pyramid reflecting surface, after filling a concave corner portion between adjacent reflecting surfaces with a brazing material so that the surface becomes a curved surface, the Ag plating film or the like is applied to the surface of the brazing material and four reflecting surfaces. By forming the light reflecting layer, it is possible to form an oval reflecting surface in the same plan view as described above.

本発明は、以上において説明した各形態に限定されるものではない。
一対のリードフレームは、先端部から垂直に立設して連なる反射面を有し、かかる反射面の上端からリードが連なる形態としても良い。かかる形態の一対のリードフレームを用いることで、隙間ｓを挟んで全体が円筒形、長円筒形、または楕円筒形を呈する反射面を形成することが可能となる。
また、基板本体は、平坦な表面を有する形態としても良い。かかる平坦な表面に一対のリードフレームの各先端部をロウ付けした発光素子実装用基板では、一対のリードフレームの各反射面における前記隙間ｓを、例えば絶縁性で且つ耐熱性のテープで塞ぐことにより、対向する一対の反射面の内側空間に前記封止用樹脂ｊを充填・固化することが可能となる。 The present invention is not limited to the embodiments described above.
The pair of lead frames may have a reflective surface that stands vertically from the tip portion and is continuous, and the lead is continuous from the upper end of the reflective surface. By using such a pair of lead frames, it is possible to form a reflecting surface that has a cylindrical shape, a long cylindrical shape, or an elliptical cylindrical shape with the gap s interposed therebetween.
The substrate body may have a flat surface. In the light emitting element mounting substrate in which the leading ends of the pair of lead frames are brazed to the flat surface, the gap s on each reflecting surface of the pair of lead frames is closed with, for example, an insulating and heat resistant tape. Thus, the sealing resin j can be filled and solidified in the inner space of the pair of opposing reflecting surfaces.

更に、基板本体２，４２の表面３，４３に開口する前記凹部５，４５の底面７，４７上に、二対以上の前記リードフレーム１０，２０などを併せて固着した発光素子実装用基板としても良い。あるいは、同じ表面３，４３に複数の前記凹部５，４５を形成し、これらの各底面７，４７上に、一対の前記リードフレーム１０，２０などを個別に固着した発光素子実装用基板としても良い。
加えて、基板本体を平坦な表面の形態とし、かかる表面上に二対以上の前記リードフレーム１０，２０などを併せて固着した発光素子実装用基板としても良い。 Further, a light emitting element mounting substrate in which two or more pairs of the lead frames 10 and 20 are fixed together on the bottom surfaces 7 and 47 of the recesses 5 and 45 opened on the surfaces 3 and 43 of the substrate bodies 2 and 42. Also good. Alternatively, a light emitting element mounting substrate in which a plurality of the concave portions 5 and 45 are formed on the same surface 3 and 43, and a pair of the lead frames 10 and 20 are individually fixed on the bottom surfaces 7 and 47, respectively. good.
In addition, the substrate body may have a flat surface form, and a light emitting element mounting substrate in which two or more pairs of the lead frames 10 and 20 are fixed together on the surface may be used.

本発明における一形態の発光素子実装用基板を示す平面図。The top view which shows the light emitting element mounting substrate of 1 form in this invention. 図１中のＸ−Ｘ線の矢視に沿った断面（端面）図。Sectional (end surface) figure along the arrow of the XX in FIG. 上記発光素子実装用基板に用いる一対のリードフレームを示す分解斜視図。The disassembled perspective view which shows a pair of lead frame used for the said light emitting element mounting substrate. 上記発光素子実装用基板の使用状態を示す図２と同様な断面図。Sectional drawing similar to FIG. 2 which shows the use condition of the said light emitting element mounting substrate. 異なる形態の発光素子実装用基板を示す平面図。The top view which shows the board | substrate for light emitting element mounting of a different form. 図５中のＹ−Ｙ線の矢視に沿った断面（端面）図。Sectional (end surface) figure along the arrow of the YY line in FIG. 上記発光素子実装用基板の変形形態を示す平面図。The top view which shows the deformation | transformation form of the said light emitting element mounting substrate. 図７中のＹ−Ｙ線の矢視に沿った断面（端面）図。Sectional (end surface) figure along the arrow of the YY line in FIG. 上記発光素子実装用基板の更に異なる変形形態を示す平面図。The top view which shows the further different deformation | transformation form of the said light emitting element mounting substrate. 図９中のＹ−Ｙ線の矢視に沿った断面（端面）図。FIG. 10 is a cross-sectional (end face) view taken along the line YY in FIG. 9; 更に異なる形態の発光素子実装用基板を示す平面図。Furthermore, the top view which shows the board | substrate for light emitting element mounting of a different form. 図１１中のＺ−Ｚ線の矢視に沿った断面（端面）図。FIG. 12 is a cross-sectional (end face) view taken along the line ZZ in FIG. 11.

符号の説明Explanation of symbols

１,３０,３０ａ,３０ｂ,４０……………発光素子実装用基板
２，４２……………………………………基板本体
３，４３……………………………………表面
４，４４……………………………………裏面
７，４７……………………………………凹部の底面（表面）
８……………………………………………発光ダイオード（発光素子）
１０,２０,３１,３１ａ,３１ｂ，５０…リードフレーム
１２,２２,３２,３２ａ,３２ｃ，５２…先端部
１４，２４，３４，５４…………………反射面
１６，２６，３６，５６…………………リード
１７，３７，５７…………………………光反射層
1,30,30a, 30b, 40 ............... Light Emitting Element Mounting Board 2,42 …………………………………… Board Body 3,43 ……………………… …………… Surface 4,44 …………………………………… Back 7,47 ………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………
8 ……………………………………………… Light Emitting Diode (Light Emitting Element)
10, 20, 31, 31a, 31b, 50 ... lead frame 12, 22, 32, 32a, 32c, 52 ... tip portion 14, 24, 34, 54 ........... reflective surface 16, 26, 36, 56 …………………… Lead 17, 37, 57 ………………………… Light Reflecting Layer

Claims (3)

表面および裏面を有し且つ絶縁材からなる基板本体と、
上記基板本体の表面に固着される先端部、かかる先端部に連なる反射面、およびかかる反射面に連なるリードをそれぞれ有する一対のリードフレームと、
を含む、ことを特徴とする発光素子実装用基板。 A substrate body having a front surface and a back surface and made of an insulating material;
A pair of lead frames each having a front end portion fixed to the surface of the substrate body, a reflection surface connected to the front end portion, and a lead connected to the reflection surface;
A substrate for mounting a light-emitting element, comprising: 前記一対の先端部の間、あるいは、当該一対の先端部の何れか一方の上に、または双方の上にまたがって発光素子の実装エリアが位置している、
ことを特徴とする請求項１に記載の発光素子実装用基板。 A mounting area of the light emitting element is located between the pair of tip portions or on either one of the pair of tip portions or over both.
The light-emitting element mounting substrate according to claim 1. 前記一対のリードフレームにおける各反射面は、半円錐形、半長円錐形、半楕円錐形、半四角錐形を含む半多角錐形を呈し、それらの表面には、Ａｇ、Ｐｔ、Ｒｈ、またはＰｄのメッキ膜からなる光反射層が形成されている、
ことを特徴とする請求項１または２に記載の発光素子実装用基板。
Each reflecting surface in the pair of lead frames has a semi-conical shape including a semi-conical shape, a semi-conical shape, a semi-elliptical pyramid shape, and a semi-rectangular pyramid shape, and Ag, Pt, Rh, Alternatively, a light reflection layer made of a Pd plating film is formed.
The light-emitting element mounting substrate according to claim 1 or 2.
JP2005034365A 2005-02-10 2005-02-10 Substrate for mounting light-emitting element Withdrawn JP2006222271A (en)

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