JP2009070870A - Package for light emitting diode, light emitting device, and method of fabricating light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a light emitting diode comprising at least a substrate molded integrally inside a reflection frame, an opening portion molded in the substrate, a reed-shaped mounting substrate fitted in the opening portion, and a reed-shaped connection metal substrate. <P>SOLUTION: The package for the light emitting diode comprises: a ceramic main body having the reflection frame and substrate molded in one body; and the reed-shaped metal substrate. The ceramic main body comprises: the reflection frame; and the substrate molded inside the reflection frame in one body. The substrate is provided with at least two opening portions in the reflection frame. The two opening portions are disposed opposite to each other, and a recessed groove is formed which communicates from a reverse surface of the frame body to a lower-side end. The reed-shaped metal substrate is fitted in the respective opening portions and recessed groove, and to the lower-side end. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention comprises at least a substrate integrally formed inside a reflection frame, an opening formed in the substrate, a lead-like mounting substrate and a lead-like connecting metal substrate fitted in the opening. The present invention relates to a light emitting diode package. The present invention can flow a large current by soldering one electrode and the other electrode of the upper and lower electrode type light emitting diodes to the lead mounting substrate and the lead connecting substrate through a metal member, and to dissipate heat. The present invention relates to a light-emitting device with excellent reliability and high reliability, and a method for manufacturing the light-emitting device.

  In a conventional light emitting device, a buffer layer, an n-type GaN layer, an active layer, a p-type semiconductor layer, and a p-type electrode are sequentially formed on a substrate, and an n-type electrode is provided on a part of the n-type GaN layer. Yes. The light emitting element is described in, for example, Japanese Patent No. 3785820. A light emitting element similar to the above is described in, for example, Japanese Patent No. 3369089 or Japanese Patent No. 3490906.

Japanese Patent No. 3785820 Japanese Patent No. 3369089 Japanese Patent No. 3490906

  In the light-emitting elements described in the above publications, the package electrode and the light-emitting element are joined by wire bonding using a gold wire. In the conventional light emitting device, the light emitting element is provided inside the reflective frame, and the deep part of the reflective frame is sealed with a transparent insulating member, so that the heat dissipation is not always good. In addition, the electrode and the package electrode in the conventional light emitting device are bonded with a gold wire by ultrasonic waves. That is, since the bonding uses a wire bonder, vibrations are transmitted to the light emitting layer of the light emitting device, which may damage the light emitting layer. In addition, since the connection between the electrode of the light emitting device and the gold wire may be broken due to vibration during transportation or use, reliability is maintained by filling the sealing material.

  In order to solve the above problems, an object of the present invention is to provide a light emitting diode package that is easy to assemble and has excellent heat dissipation. In addition, the present invention provides a light emitting device and a light emitting device that are excellent in assembling and mass production, heat dissipation, can pass a large current without being filled with a sealing material, can withstand thermal stress, and are held at high strength. It is an object to provide a method for manufacturing a device.

(First invention)
According to a first aspect of the present invention, there is provided a light emitting diode package comprising: a reflection frame; a substrate integrally formed in the reflection frame; at least two openings provided in the substrate; And a ceramic body composed of a concave groove communicating with the lower side end, and a lead-shaped metal substrate fitted in the opening and / or the concave groove, respectively.

(Second invention)
In the light emitting diode package of the second invention, the outer end of the ceramic main body of the first invention is formed with a recess or projection that engages with the claw provided on the outside of the lead-shaped metal substrate. It is characterized by.

(Third invention)
In the light emitting diode package of the third invention, the lead metal substrate of the first invention is elastically held between the opening and the outer end of the ceramic body.

(Fourth invention)
The light emitting device of the fourth invention is a reflection frame, a substrate integrally formed inside the reflection frame, at least two openings provided in the substrate, and connected to the opening, A ceramic body composed of a concave groove communicating with the outer end, a lead-shaped mounting metal substrate fitted in the one opening and / or the concave groove, the other opening and / or A lead-shaped connecting metal substrate fitted in a concave groove, an upper / lower electrode type light emitting diode having a lower electrode joined to the lead-shaped mounting metal substrate, an upper partial electrode of the upper / lower electrode type light emitting diode, and the lead A metal member for connecting the electrode-like connecting metal substrate, a bond between the lead-mounted metal substrate and the lower electrode of the upper and lower electrode type light emitting diode, a bond between the upper partial electrode of the upper and lower electrode type light emitting diode and the metal member, and in front Characterized in that it is at least composed of a solder used in the joining of said lead-shaped connecting metal substrate and the metal member.

(Fifth invention)
In the light emitting device of the fifth invention, the lead-shaped mounting metal substrate and the lead-shaped connecting metal substrate of the fourth invention reach the lower part in the vicinity of the end of the ceramic body.

(Sixth invention)
In the light emitting device of the sixth invention, the ceramic body of the fourth invention or the fifth invention comprises an opening having a large area inside, an opening having a small area connected to the opening having the large area, It is characterized by comprising a concave groove formed continuously at a narrow opening and formed at the lower part of the reflection frame, and a wide concave groove extending to the outer end portion connected to the concave groove.

(Seventh invention)
A light-emitting device according to a seventh aspect of the present invention is a connection for connecting the metal member and a mounting region for mounting the upper and lower electrode type light-emitting diodes on the lead-shaped mounting metal substrate and the lead-shaped connection metal substrate of the fourth to sixth inventions. The region is fitted into the opening having a large area formed inside the ceramic body, and the ends of the lead mounting metal substrate and the lead connecting metal substrate are fitted to the outer ends of the ceramic body by respective elasticity. It is characterized by being combined.

(Eighth invention)
In the light emitting device of the eighth invention, the ceramic main body of the fourth to seventh inventions is bonded to the lead-shaped mounting metal substrate and the lead-shaped connecting metal substrate with an adhesive.

(9th invention)
In the light emitting device of the ninth invention, the metal member of the fourth invention to the eighth invention is characterized by comprising a gold wire formed in a ribbon shape.

(10th invention)
In the light emitting device of the tenth invention, the metal member of the fourth to eighth inventions is characterized in that nickel-plated, gold and / or silver is plated on copper formed into a ribbon shape.

(11th invention)
In the light emitting device according to the eleventh aspect, the metal member according to the fourth to tenth aspects has a thickness of 15 μm to 35 μm, preferably 20 μm to 30 μm, a width of 100 μm or more, and an electrode width of the upper or lower electrode type light emitting diode. It is characterized by becoming.

(Twelfth invention)
In the light emitting device of the twelfth invention, the ceramic body of the fourth invention to the eleventh invention is made of porous ceramic.

(13th invention)
According to a thirteenth aspect of the present invention, there is provided a light emitting device manufacturing method comprising: a reflecting frame; a substrate molded inside the reflecting frame; at least two openings provided in the substrate; and the opening. A concave groove communicating with the outer end is formed integrally with the ceramic body, and the lead-shaped mounting metal substrate and the lead-shaped connecting metal substrate having elasticity are fitted into the respective openings, the concave groove, and the outer end. A package manufacturing process to be combined;
After placing solder between the lower electrode of the upper and lower electrode type light emitting diode and the lead-like mounting metal substrate, and between the upper partial electrode of the upper and lower electrode type light emitting diode and the lead-like connecting metal substrate and the metal member , A ceramic body, a lead mounting metal substrate, a lead connecting metal substrate, a top and bottom electrode type light emitting diode, and a light emitting component manufacturing step for heating a metal member;
It is characterized by comprising at least.

(14th invention)
A method for manufacturing a light emitting device according to a fourteenth aspect is characterized in that a phosphor-containing film body is provided on the reflection frame after the package manufacturing step and the light emitting component manufacturing step according to the thirteenth aspect are completed.

  According to the present invention, since the reflecting frame and the opening formed inside the reflecting frame are integrally formed of the molded ceramic body and the lead-shaped metal substrate fitted into the opening, assembly is easy. Inexpensive and inexpensive packages for light emitting diodes can be obtained.

  According to the present invention, since the ribbon-like metal member is used for the connection between the upper partial electrode of the upper and lower electrode type light emitting diode and the lead-like connection substrate fitted in the opening of the ceramic substrate, it is easy to assemble and has a large current. And can reflect light efficiently.

  According to the present invention, the connection area between the upper part electrode of the upper and lower electrode type light emitting diode and the lead-like connection substrate is increased by the ribbon-like metal member, so that the joining by solder is possible and the heat dissipation is good. A large current can flow.

  According to the present invention, since bonding by wire bonding is not used for connection between the upper partial electrode of the upper and lower electrode type light emitting diode and the lead-like connection substrate, vibration is not applied to the bonding portion and / or the light emitting layer. A light emitting device with few good products can be obtained.

  According to the present invention, since bonding by wire bonding is not used for connection between the upper partial electrode of the upper and lower electrode type light emitting diode and the lead-like connection substrate, vibration is not applied to the bonding portion and / or the light emitting layer, and sealing is performed. The stop material eliminates the need to seal the vicinity of the upper and lower electrode type light emitting diodes.

  According to the present invention, by using a gold ribbon as the ribbon-like metal member, not only can the shape be easily changed, but also the bonding strength can be improved, and the package needs to be filled with a sealing material. As a result, the assembly is easy and the light irradiation efficiency can be improved.

  According to the present invention, since the ceramic body serving as the package is formed of porous ceramic, reflection and irregular reflection on the surface can be effectively used without forming a special reflection surface, and high reflectance can be achieved. .

  According to the present invention, there are few components such as joining a lead-shaped mounting metal substrate, a lead-shaped connecting metal substrate, and a metal member to a ceramic body having a reflection frame and at least two openings, and assembling is easy and man-hours are small. Become.

(First invention)
The light emitting diode package according to the first aspect of the invention comprises a ceramic body integrally formed with a reflection frame and a substrate, and a lead-shaped metal substrate. The ceramic main plate includes a reflection frame and a substrate integrally formed inside the reflection frame. The substrate is provided with at least two openings inside the reflection frame. The two openings are arranged at positions facing each other, and a concave groove communicating from the lower surface of the reflection frame to the lower side end is formed.

  The lead-shaped metal substrate is fitted in the respective opening, concave groove, and lower end. Since the light emitting diode package includes only a ceramic main body formed by integral molding and a lead-shaped metal substrate fitted to the ceramic main body, the number of manufacturing steps is small, and inexpensive mass production is possible by using a mold. The ceramic body may be made of a synthetic resin. The number of the openings can be three or more. The shape of the opening is arbitrary, but it is necessary to consider the shape when fitting with the lead metal substrate.

(Second invention)
In the light emitting diode package of the second invention, an engaging portion is formed on the outer end of the ceramic body of the first invention. The engaging portion is formed of a concave portion or a convex portion, and a claw portion provided at an outer end portion of the lead-shaped metal substrate is engaged. The direction of the nail can be inside or outside. Moreover, the said lead-like metal board | substrate has elasticity, and can be fitted by own elasticity and an engaging part.

(Third invention)
In the light emitting diode package according to the third aspect of the invention, a lead-like metal substrate having elasticity is fitted to the outer end and the opening of the ceramic body. Since the claw portion is not formed at the end portion of the lead-shaped metal substrate, it is desirable to use an adhesive when fitting the ceramic body.

(Fourth invention)
In the light emitting device according to the fourth aspect of the invention, the ceramic body includes a reflective frame and a substrate formed integrally with the reflective frame. In the substrate, at least two openings are arranged at positions facing each other inside the reflection frame, and a concave groove communicating from the lower surface of the reflection frame to the outer end is formed. The lead-shaped metal substrate is fitted into the opening, the groove, and the outer end, respectively. For example, the opening is configured such that one is large and the other is small, and the opening is communicated by a concave groove so as to reach the outer end of the ceramic body. The ceramic body and the lead-shaped metal substrate are not only assembled by fitting, but can be prevented from coming off when attaching the light emitting component by using an adhesive or the like.

  The lead metal substrate is composed of a lead placement metal substrate and a lead connection metal substrate. The lead-shaped mounting metal substrate includes a mounting portion on which the upper and lower electrode type light emitting diodes are mounted, and a narrow lead portion that fits into a concave groove extending from the mounting portion to the outer end of the ceramic body. At least composed. The lead-shaped connecting metal substrate has a width that fits into a connecting portion having a large area to be connected to the upper partial electrode of the upper and lower electrode type light emitting diode via a metal member, and a concave groove reaching the outer end portion of the ceramic body. It is composed of at least a narrow lead portion.

  In the upper and lower electrode type light emitting diode, the lower electrode is joined to the lead mounting metal substrate by soldering. The upper partial electrodes of the upper and lower electrode type light emitting diodes are connected to the lead-shaped connecting metal substrate by solder with a metal member. The metal member is preferably a plate member having good conductivity. In the soldering, for example, bonding is performed simultaneously by eutectic solder.

  Note that the number of openings can be three or more. For example, the lead-like mounting metal substrate is fitted into the two openings, and the lead-like connecting metal substrate is fitted into one opening arranged at a position facing the opening. The two upper and lower electrode type light emitting diodes are placed on the respective lead-like placement metal substrates, and can be connected in parallel by using the same lead-like connection metal substrate. The two upper and lower electrode type light emitting diodes can be connected in series.

(Fifth invention)
The light emitting device of the fifth invention is such that the lead-like mounting metal substrate and the lead-like connecting metal substrate of the fourth invention reach the lower part from the end of the ceramic body. Since the light emitting device is placed on the wiring on the printed wiring board and is electrically connected to the end portion, not only a special wiring is unnecessary, but also the wiring can be easily performed.

(Sixth invention)
In the light emitting device of the sixth invention, the opening formed in the substrate inside the ceramic body in the fourth invention or the fifth invention has a wide area inside and a small area continuously provided in the wide area. An area and a groove formed continuously to the area having a small area, formed at the lower part of the reflection frame, and reaching the outer end. In the lead-shaped mounting metal substrate and the lead-shaped connecting metal substrate, a wide area is fitted into the opening, the narrow area is fitted into the concave groove, and an end is fitted into the outer end of the ceramic body. The reflective frame and the lead-shaped metal substrate are easy to assemble, inexpensive, and difficult to separate.

(Seventh invention)
In the light emitting device according to the seventh aspect of the present invention, the placement portion of the lead-like placement metal substrate and the connection portion of the lead-like connection metal substrate are fitted in a wide area formed inside the ceramic body. Further, the other end portions of the lead-like mounting metal substrate and the lead-like connecting metal substrate are respectively fitted to outer end portions of the ceramic body. Lead portions of the lead-like mounting metal substrate and the lead-like connecting metal substrate are fitted in concave grooves formed in the lower portion of the ceramic body.

  Moreover, the outer edge part in the said lead-shaped mounting metal substrate and a lead-shaped connection metal substrate can engage with the recessed part or convex part provided in the outer wall part of the said ceramic main body. The outer end portions of the lead-like mounting metal substrate and the lead-like connecting metal substrate and the shape of the concave portion or the convex portion of the outer wall portion may be such that the fitting is not removed.

(Eighth invention)
In the light emitting device according to the eighth aspect of the present invention, the lead-shaped mounting metal substrate and the lead-shaped connecting metal substrate can be easily detached by only fitting with the opening and the concave groove, and therefore, the adhesive is interposed between the two. To prevent it.

(9th invention)
The light-emitting device of the ninth invention is composed of a gold wire in which a metal member is formed in a ribbon shape. Since the ribbon-like gold wire is formed in a strip-like and thin plate shape, not only can a large current flow, but also when the upper electrode of the upper and lower electrode type light emitting diode is connected to the lead-like connecting metal substrate. In addition, the length can be changed (absorbed), the bonding area can be increased, attachment is easy, and bonding with high heat dissipation and high reliability is possible. Moreover, since a metal member is strip shape, it has high heat dissipation compared with a linear thing. Furthermore, since the ribbon-shaped gold wire has a large area, it can be easily soldered, and since there is no vibration generated during wire bonding, the strength of the junction is improved without damaging the light-emitting diode. I was able to.

(10th invention)
The metal member in the light emitting device according to the tenth aspect of the present invention is obtained by nickel-plating copper formed in a ribbon shape, or gold and / or silver being plated on copper. The metal member can be sufficiently used as a substitute for the gold wire ribbon in terms of bondability and / or flexibility.

(11th invention)
The metal member in the light emitting device of the eleventh invention is obtained by plating gold and / or silver on copper and a copper alloy, and can simultaneously achieve improvement in light reflection efficiency, heat dissipation, solder, particularly wettability with eutectic solder. It is like that. The metal member has a thickness of 15 μm to 35 μm, preferably 20 μm to 30 μm, and a width of 100 μm or more to an electrode width of the upper or lower electrode type light emitting diode, so that a large current can flow. In addition to improving heat dissipation, the strength of the assembly is also improved.

(Twelfth invention)
In the light emitting device according to the twelfth aspect, the reflection frame is made of porous ceramic, and the reflection frame itself is a reflection portion. The porous ceramic is an alumina-based ceramic. For example, a porous ceramic having a pore diameter of 0.10 to 1.25 μm or a porosity of 10% or more is used.

(13th invention)
The method for manufacturing a light emitting device according to the thirteenth aspect comprises a package manufacturing process and a light emitting component manufacturing process. The package manufacturing process includes a green sheet, a reflection frame, a substrate integrally formed inside the reflection frame, at least two openings provided in the substrate, and a continuous arrangement in the opening. Then, the concave groove communicating with the lower end is integrally formed. The green sheet after molding is fired to form a ceramic body. A lead-shaped mounting metal substrate and a lead-shaped connecting metal substrate are fitted into the opening, the groove, and the outer end of the ceramic body.

  After the solder is placed on the placement portion of the lead-like placement metal substrate, the lower electrode of the upper and lower electrode type light emitting diode is placed. A solder is placed on the upper partial electrode of the upper and lower electrode type light emitting diode and the lead-like connecting metal substrate, and then a metal member is placed. The ceramic main body, lead-shaped mounting metal substrate, lead-shaped connecting metal substrate, upper and lower electrode type light emitting diode, and metal member are heated, for example, by passing through a reflow furnace, and the members are joined. If necessary, a phosphor-containing film body is attached to the reflection frame. The metal member is a member having a spring property of titanium copper or phosphor bronze, and has a thickness of 100 μm to 1000 μm, preferably 200 μm to 600 μm.

(14th invention)
In the light emitting device of the fourteenth aspect, a phosphor-containing film body is provided on the reflection frame, and light emitted from the upper and lower electrode type light emitting diodes is output as light of a desired color by the phosphor-containing film body. . The phosphor-containing film body contains at least one phosphor that converts light emitted from the upper and lower electrode type light emitting diodes into substantially visible light. The upper and lower electrode type light emitting diodes are, for example, light emitting diodes that emit light having a wavelength of blue or ultraviolet light, and absorb the wavelength of blue or ultraviolet light and convert it into other visible light.

  1 (a) to 1 (d) show a first embodiment of the present invention, wherein (a) is a plan view of a ceramic body in which a reflection frame is integrally formed, (b) is a sectional view of the ceramic body, and (c). These are the front view explaining the package for light emitting diodes, (d) The bottom view of the package for light emitting diodes. FIG. 2 is an assembled perspective view for explaining the light emitting diode package in the first embodiment of the present invention. 1 (a) to 1 (d) and FIG. 2, a ceramic body 11 is provided with a first opening 111 and an elongated first lead opening that is connected to the first opening 111 and has a narrower width. 112, a concave groove 112 'formed in a lower part of the reflection frame 13 and connected to the first lead opening 112, and one outer end of the ceramic body 11 connected to the concave groove 112'. The first opening recess 113 wider than the recess groove 112 ′ is formed in the portion so as to be connected to each other.

  On the other hand, the ceramic main body 11 is narrower than the second opening 121 and the second opening 121 through the connection portion 114 at a position facing the first opening 111, and the second narrow elongate second A second opening recess 123 wider than the second lead opening 122 is formed to be continuous with the lead opening and the groove 122 and the other outer end of the ceramic body 11. The ceramic body 11 has a high strength because the reflection frame 13 is integrally formed in advance. The ceramic body 11 is in the form of a green sheet, provided with a reflective frame and the openings, and then fired to make a ceramic.

  The reflection frame 13 is formed integrally with the ceramic body 11. The first opening 111 is disposed so as to come to the center of the ceramic body 11. The ceramic main body 11 is provided with an engagement recess 113 that engages the engagement portions 144 and 154 of the lead mounting substrate 14 and the lead connection substrate 15 on the side surface of the outer end portion. The other ends of the lead-like mounting substrate 14 and the lead-like connecting substrate 15 are provided with power connection electrodes 143 and 153 as shown in the drawing, in addition to the engaging portions 144 and 154 bent in a claw shape.

  The ceramic main body 11 including the reflection frame 13 can be made of an alumina-based ceramic other than the one molded with an insulating resin. As the alumina ceramic, for example, a ceramic body 11 having a pore diameter of 0.10 μm to 1.25 μm or a porosity of 10% or more is used. The reflection frame 13 made of the porous ceramic does not need to form a reflection film, but can improve reflectivity by irregular reflection on the inner surface.

  1 (c), (d) and FIG. 2, the lead-like mounting substrate 14 is fitted into the first openings 111, 112 and the concave grooves 112 ', 113. The lead mounting substrate 14 has a shape that fits into the first openings 111, 112, 122 ′, 113. In the lead-shaped mounting substrate 14, the upper and lower electrode type light emitting diode mounting portions 141 are provided in two portions: a narrow lead portion 142, a power connection electrode 143 wider than the lead portion 142, and the power connection electrode 143. The engaging portion 144 is provided in a row by providing a slit and raising the central portion and bending it into a claw shape. The bending method, length, and shape of the engaging portion 144 can be engaged with the outer end portion of the ceramic body 11.

  The lead connection board 15 is fitted into the second opening 121 and the grooves 122 and 123. The lead-like connection substrate 15 is shaped to fit into the second opening 121 and the concave grooves 122 and 123. In the lead-like connection substrate 15, a metal member connection portion 151 to be described later has a narrow lead portion 152, a power connection electrode 153 wider than the lead portion 152, and two kerfs in the power connection electrode 153. The center part is raised, and the engaging part 154 bent into a claw shape is continuously provided. The shape or the like of the engaging portion 154 is almost the same as that of the engaging portion 144.

  As shown in FIGS. 1C and 2, the lead mounting substrate 14 and the lead connecting substrate 15 are fitted to the first opening 111, the groove 112, and the like, and the ceramic body 11. It is attached by engaging the engaging portions 144 and 154 with the engaging recess 131 from the back surface. The lower electrode of the upper and lower electrode type light emitting diode is placed on the upper and lower electrode type light emitting diode mounting portion 141 of the lead mounting substrate 14 via solder (not shown). An upper partial electrode (not shown) of the upper and lower electrode type light emitting diodes and a metal member connecting portion 151 of the lead-like connection substrate 15 are connected to each other by a metal member (not shown) on which solder is placed. The Thereafter, the ceramic substrate 11 is passed through a reflow furnace, whereby the solder is heated and the respective components are bonded to each other.

  The metal member (not shown) is, for example, a strip-shaped gold ribbon or a ribbon with gold and / or silver plating. The metal member has a small electric resistance, can flow a large current, has excellent heat dissipation, and can easily change its shape, so that the electrodes can be easily joined. Further, since the metal member can increase the bonding area, it is possible to bond by soldering instead of wire bonding.

  Further, the strip-shaped metal member has a thickness of 15 μm to 35 μm, preferably 20 μm to 30 μm, a width of 100 μm or more and a width of the electrode of the upper / lower electrode type light emitting diode or less so that a large current flows. In addition to improving heat dissipation, the strength of the assembly is also improved. When the thickness of the metal member is less than 15 μm, the applicant of the present invention has less current flow and less heat dissipation effect, and when considering the current capacity and heat dissipation effect, the thickness of the metal member is greater than 35 μm. However, it has been found that there is a risk of poor bonding because the material is wasted and it is difficult to bend. Further, the strip-shaped metal member can not only flow a large current but also exhibit a heat dissipation effect by increasing the width.

  The metal member is made of nickel, aluminum, copper, or an alloy thereof, and is plated with gold and / or silver as necessary. In addition to bonding, the plating can not only efficiently irradiate light but also is suitable for eutectic soldering and can provide a highly reliable light emitting device. The gold and / or silver plating at the joint can not only improve the wettability of the eutectic solder, but can simultaneously achieve three things: improved electric conductivity and light reflectivity. The metal member may be a laminated substrate of nickel, aluminum or copper, an alloy thereof, and gold and / or silver.

  The reflection frame 13 is provided with a phosphor-containing film body (not shown) on the top thereof as necessary. The phosphor-containing film body can convert the ultraviolet rays emitted from the upper and lower electrode type light emitting diodes into white light. However, in order to obtain light of a desired color, the phosphor is arbitrarily selected. Can do.

  The lead mounting substrate 14, the lead connecting substrate 15, the electrodes of the upper and lower electrode type light emitting diodes, and the metal member are joined by solder, for example, eutectic solder. The joining of the respective parts is usually performed simultaneously by placing eutectic solder in a predetermined joining part and passing through a reflow furnace. Since the bonding of each part by the solder has high strength, it is not necessary to fill a sealing material for sealing them.

  The size of the upper and lower electrode type light emitting diode is, for example, 1.0 mm × 1.0 mm, 0.7 mm × 0.7 mm, 0.5 mm × 0.5 mm, or 0.3 mm × 0.3 mm, and the thickness is 0. .15 mm.

  The upper and lower electrode type light emitting diodes are blue light emitting diodes or ultraviolet light emitting diodes, and in the case of blue light emitting diodes, by using a fluorescent film containing a phosphor that absorbs blue and colors green and red, Combined with blue, almost white light comes out. When the light emitting element 12 is an ultraviolet light emitting diode, the light emitting element 12 emits almost white using a fluorescent film containing a phosphor that develops blue, green and red colors by absorbing ultraviolet light, or absorbs ultraviolet light and emits blue light. Even when using a phosphor that develops a color and a phosphor that absorbs ultraviolet rays and blue and develops green and red, substantially white light can be emitted.

  FIGS. 3A and 3B show a second embodiment of the present invention, and illustrate another example in which a lead-like mounting metal substrate and a lead-like connecting metal substrate are fitted in the opening of the ceramic body. (A) is a cross-sectional view, and (b) is a plan view of the ceramic body. 3A and 3B, the ceramic body 31 has openings 311 and 312 and openings 313 and 314 formed therein, and a reflection frame 33 is formed integrally therewith. The openings 311, 312 and 313, 314 are composed of a wide part and a narrow part. In addition, the narrow opening portions 312 and 314 are not open portions, but are concave grooves in the lower portion of the reflection frame 33.

  The ceramic body 31 is disposed at a position where the openings 311 and 313 are opposed to each other. In the openings 311, 312, 313, and 314, a lead mounting metal substrate 34 and a lead connecting metal substrate 35 are fitted. The lead-shaped mounting substrate 34 includes a mounting portion 341 on which the upper and lower electrode light emitting diodes 36 are mounted, a lead portion 342 connected to the mounting portion 341 and fitted into the lead opening 312, The lead portion 342 is connected to the engaging portion 343 having a width wider than that of the lead portion 342.

  The lead-like connecting metal substrate 35 is connected to the connecting portion 351 to which the metal member 37 is connected, the lead portion 352 that is connected to the connecting portion 351, and is fitted to the lead opening 314, and is connected to the lead portion 352. The engaging portion 353 is wider than the lead portion 352. The lead-shaped mounting metal substrate 34 and the lead-shaped connecting metal substrate 35 are fitted in the opening and are joined to a concave groove provided in a lower portion of the ceramic body 31 by an adhesive 32. The lead mounting metal substrate 34 and the lead connecting metal substrate 35 can be easily fitted by bending in the opening. Since the fitting is weak in attachment strength, the adhesive 32 is used as an auxiliary.

  FIGS. 4A and 4B show a third embodiment of the present invention, in which another example in which the lead-like mounting metal substrate and the lead-like connecting metal substrate are fitted in the opening of the ceramic body will be described. FIG. 4 (a) and 4 (b), the difference from the second embodiment is that a thin portion 442 'is provided at substantially the center of the lead portion 442 in the lead-like mounting metal substrate 44 and the lead-like connecting metal substrate 45. It is a point. The thin portion 442 ′ strengthens the spring property of the lead-like mounting metal substrate 44 and the lead-like connecting metal substrate 45.

  The upper and lower electrode type light emitting diodes 36 are gallium nitride based upper and lower electrode type light emitting diodes, and have, for example, an active layer between a p-type gallium nitride semiconductor layer and an n-type gallium nitride semiconductor layer. The gallium nitride-based upper / lower electrode type light emitting diode can obtain high luminance by flowing a large current.

Comparative example

  The tensile strength of the gold wire of a prior art example and the gold wire ribbon of this invention is compared. The test pulled the center of the gold wire or gold wire ribbon and gradually increased the force. The conventional tensile test of one gold wire having a diameter of 30 μm was cut near the joint portion of the gold wire at a force of 11 grams. Since the conventional joining method is not soldered, it has been found that there is a weak point near the joint. Similarly, the tensile test with a diameter of 25 μm was broken near the joint of the gold wire when the force was 7 grams. The gold wire ribbon of the present invention was cut at a portion that was pulled when a force of 100 to 150 grams was applied when using a ribbon having a width of 200 μm and a thickness of 25 μm.

  As mentioned above, although the Example of this invention was explained in full detail, this invention is not limited to the said Example. The present invention can be modified in various ways without departing from the scope of the claims. As the light-emitting element of the present invention, known or well-known elements other than the shapes described as examples can be used. As the material of the phosphor-containing film, the reflection frame, the metal substrate, or the ceramic substrate of the present invention, known or well-known materials can be used. Although this embodiment has been described with respect to a light emitting diode, it goes without saying that it is used for a light emitting element such as a laser diode.

(A) to (d) are the first embodiment of the present invention, (a) is a plan view of a ceramic body integrally formed with a reflection frame, (b) is a cross-sectional view of the ceramic body, and (c) is light emission. It is the front view explaining the package for diodes, (d) It is a bottom view of the package for light emitting diodes. Example 1 It is an assembly perspective view for demonstrating the package for light emitting diodes in 1st Example of this invention. (A) and (B) is a second embodiment of the present invention, and is an outline for explaining another example in which the lead-like mounting metal substrate and the lead-like connecting metal substrate are fitted in the opening of the ceramic body. It is a figure, (a) is sectional drawing, (b) is a top view of a ceramic main body. (Example 2) (A) and (B) are the third embodiment of the present invention, and are outlines for explaining another example in which the lead-like mounting metal substrate and the lead-like connecting metal substrate are fitted in the opening of the ceramic body. FIG. (Example 3)

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Ceramic body 111 ... 1st opening part 112 ... 1st lead opening part 112 '... Groove 113 ... 1st open | release recessed part 114 ... Connection part 121 ... First opening 122 ... second lead opening 123 ... second open recess 13 ... reflective frame 131, 132 ... engaging recess 14 ... lead mounting metal substrate 141... Upper and lower electrode type light emitting diode mounting portion 142... Lead portion 143... Power connection electrode 144... Engagement portion 15. ... Lead part 153 ... Power connection electrode 154 ... Engagement part 31 ... Ceramic substrate 32 ... Adhesive 33 ... Reflective frame 34 ... Lead-like mounting board or lead-like connection Substrate 35 ... conductive film 36 ... top Electrode type light emitting diode 37 ... metal member

Claims (14)

A reflecting frame, a substrate integrally formed in the reflecting frame, at least two openings provided in the substrate, and a recess that is continuous with the opening and communicates with the lower end. A ceramic body composed of grooves,
A lead-like metal substrate fitted in the opening and / or groove, respectively.
A package for a light emitting diode, comprising:   2. The light emitting diode according to claim 1, wherein a concave portion or a convex portion that engages with a claw portion provided outside the lead-shaped metal substrate is formed at an outer end portion of the ceramic body. For package.   2. The light emitting diode package according to claim 1, wherein the lead metal substrate is elastically held between the opening and the outer end of the ceramic body. A reflecting frame, a substrate integrally formed inside the reflecting frame, at least two openings provided in the substrate, and a groove that is continuous with the opening and communicates with the outer end. A ceramic body composed of
A lead-shaped mounting metal substrate fitted in the one opening and / or the groove,
A lead-like connecting metal substrate fitted in the other opening and / or the recessed groove;
An upper and lower electrode type light emitting diode in which a lower electrode is joined to the lead-shaped mounting metal substrate;
A metal member that connects the upper partial electrode of the upper and lower electrode type light emitting diode and the lead-shaped connecting metal substrate;
Bonding between the lead-shaped mounting metal substrate and the lower electrode of the upper / lower electrode type light emitting diode, bonding between the upper partial electrode of the upper / lower electrode type light emitting diode and the metal member, and between the metal member and the lead-shaped connecting metal substrate Solder used for bonding,
A light emitting device comprising:   5. The light emitting device according to claim 4, wherein the lead-shaped mounting metal substrate and the lead-shaped connecting metal substrate reach a lower portion in the vicinity of the end portion of the ceramic body.   The ceramic body has an opening having a large area inside, an opening having a small area connected to the opening having a large area, and an opening having a small area, and is formed at a lower portion of the reflection frame. 6. The light-emitting device according to claim 4, wherein the light-emitting device includes a concave groove and a concave groove having a large area reaching the outer end portion provided continuously with the concave groove.   The mounting region for mounting the upper and lower electrode type light emitting diodes and the connection region for connecting the metal member on the lead mounting metal substrate and the lead connecting metal substrate have a large area formed inside the ceramic body. The end portions of the lead-shaped mounting metal substrate and the lead-shaped connecting metal substrate are fitted into the opening at the outer end portions of the ceramic body by respective elasticity. 6. The light emitting device described in any one of 6 above.   The light emitting device according to any one of claims 4 to 7, wherein the ceramic body is bonded to the lead-shaped mounting metal substrate and the lead-shaped connecting metal substrate with an adhesive. .   The light emitting device according to any one of claims 4 to 8, wherein the metal member is made of a gold wire formed into a ribbon shape.   The light emitting device according to any one of claims 4 to 8, wherein the metal member is formed by plating nickel, gold, and / or silver on copper formed in a ribbon shape. .   11. The metal member according to claim 4, wherein the metal member has a thickness of 15 μm to 35 μm, preferably 20 μm to 30 μm, and a width of 100 μm or more to an electrode width of the upper / lower electrode type light emitting diode. A light-emitting device according to claim 1.   The light emitting device according to claim 4, wherein the ceramic body is made of porous ceramic. A ceramic includes a reflection frame, a substrate molded inside the reflection frame, at least two openings provided in the substrate, and a concave groove connected to the opening and communicating with an outer end. Molded integrally with the body,
A package manufacturing step of fitting the lead-like mounting metal substrate and the lead-like connecting metal substrate having elasticity into the respective openings, concave grooves, and outer end portions;
After placing solder between the lower electrode of the upper and lower electrode type light emitting diode and the lead-like mounting metal substrate, and between the upper partial electrode of the upper and lower electrode type light emitting diode and the lead-like connecting metal substrate and the metal member , A ceramic body, a lead mounting metal substrate, a lead connecting metal substrate, a top and bottom electrode type light emitting diode, and a light emitting component manufacturing step for heating a metal member;
A method for manufacturing a light emitting device, comprising:   14. The method for manufacturing a light-emitting device according to claim 13, wherein after the package manufacturing step and the light-emitting component manufacturing step are finished, a phosphor-containing film body is provided on the reflection frame.

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