JP4613489B2 - Element arrangement method and display device - Google Patents

Description

  The present invention relates to an element arrangement method for configuring a device by arranging a plurality of minute elements such as light emitting elements and thin film elements on an apparatus substrate.

  Conventionally, when elements are arranged in a matrix and assembled in an image display device, the elements are formed on a substrate like a liquid crystal display device (LCD) or a plasma display panel (PDP). Alternatively, a single LED package is arranged like a light emitting diode display (LED display). In conventional image display devices such as LCDs and PDPs, element separation is not possible with respect to the element and pixel pitch, so that each element is formed with an interval of the pixel pitch of the image display apparatus from the beginning of the manufacturing process. Is usually done.

  On the other hand, in the case of LED displays, LED chips are taken out after dicing, and individually connected to external electrodes by wire bonding or bump connection by flip chip, and packaged. In this case, the pixel pitch as an image display device is arranged before or after packaging, but this image pitch is independent of the element pitch at the time of element formation. Therefore, a technique has been proposed in which each element is formed with a high degree of integration, and each element is moved to a wide area while being separated by transfer or the like to constitute a relatively large display device such as an image display device. Further, a method has been proposed in which only elements located at a predetermined interval among elements formed with a high degree of integration are selectively transferred to realize an arrangement in which the intervals between the elements are increased (for example, Patent Document 1). reference).

  Furthermore, as a recent technique, a mounting method based on a so-called fluid self-assembly method has been known. For example, there is such a mounting method in the technology of Alien Technology (see, for example, Non-Patent Document 1). . In this fluid self-mounting method, after manufacturing a large number of elements, the elements are transported by flowing in the fluid, and the elements are held in the holes formed on the surface of the film, and the film is aligned with the device to be mounted together with the elements. Transfer technology. The holes formed in the film surface are adapted to the shape of the element to be mounted, and a large number of elements are taken out from the fluid while being held on such a special film and transferred onto the apparatus.

JP 2002-231877 A [Search on November 6, 2003], Internet <URL: http: // www. alientechnology. com>

  However, in the technique described in Patent Document 1 described above, when high accuracy is required for alignment, or when the device is transferred multiple times, the transfer destination substrate is larger than the substrate on which the device is formed. Because of the need for precise control, it was necessary to reduce the transfer speed. Further, since transfer is performed at an element interval corresponding to the element interval at the time of forming the element, the transferred element interval is only an integral multiple of the element interval at the time of element formation, and the element arrangement pitch after transfer is It is difficult to set arbitrarily. In addition, since the element is peeled off from the growth substrate and selectively transferred, it is difficult to transfer at the same time as peeling due to conditions necessary for peeling, and the peeling process and the transferring process are separated from each other. There was a need to do.

  Further, in the technique described in Non-Patent Document 1 described above, in order to arrange a plurality of types of elements, it is necessary to execute the fluid self-mounting method a plurality of times by matching the hole shape on the film surface with the element shape. There is a problem that the working time becomes long and the throughput deteriorates. In addition, in order to shorten the element arrangement time and improve the mounting yield, it is necessary to prepare a larger number of elements than the number of elements to be arranged and to flow in the fluid, which increases the number of necessary components. It was. Furthermore, since it is necessary to satisfy the conditions such as the hole shape on the film surface, the material and surface treatment of the film, and the dispersing material mixed in the liquid, there is a problem that the degree of freedom of the process is lowered. In addition, after arranging the elements on the film in the liquid, there is a possibility that the elements may be detached when the film is pulled out of the liquid, and there is a problem that the manufacturing yield deteriorates.

  Accordingly, an object of the present invention is to provide an element arrangement method capable of reliably arranging elements even when arranging a plurality of types of elements and efficiently arranging elements in a short time.

In order to solve the above problems, an element arrangement method of the present invention is an element arrangement method in which an element arranged on a first substrate is transferred onto a second substrate and arranged on the second substrate. , to the second substrate surface, has a device arrangement hole as a recess for fitting the element to the bottom, the cell shape formed to be a possible structure holds the liquid comprise said element arranged bore inside a step of, introducing a liquid into said cell, and transferring the first in the elements formed on a substrate peeling to the cell, removing the liquid in the cell Le before, characterized in that it and a step in which to place in self-alignment with the element in the element placement hole.

  By transferring the element into the cell area dividing the second substrate, the element can be arranged by self-alignment in a relatively small cell area, so that the time required for element arrangement can be shortened. it can. In addition, when transferring an element, it is only necessary to roughly control the position of the element in the cell area, and since precise position control can be performed by self-alignment in the cell area, the transfer speed of the element is improved. Thus, the throughput of the element arrangement can be improved.

  The self-alignment arrangement introduces liquid into the cell region and applies ultrasonic vibration to the second substrate to move the element in the liquid, or introduces liquid into the cell region and places the element in the liquid. A liquid that evaporates while floating can be used. By performing self-alignment using element movement and element movement due to the surface tension of the liquid, even when a large number of cells are formed on a second substrate and a large number of elements are arranged, the element can be easily and inexpensively arranged. Arrangement can be performed.

  In addition, the cell may be a region surrounded by a cell dividing portion which is a convex portion formed on the second substrate or a water-repellent pattern. Since the unevenness of the cell division part can be easily formed on the second substrate by molding a resin layer or by photolithography, a fine and precise cell is formed on the second substrate. It becomes possible to arrange the elements.

  In addition, in order to perform self-alignment of the elements in the cell region, an element arrangement hole that is a recess in which the element is fitted may be formed in the cell region. After the element is fitted into the element arrangement hole, it is difficult for the element to move in the cell region, so that it is easy to arrange the element by self-alignment. At this time, the shape of the element arrangement hole is made substantially the same as the shape of the element, the element arrangement hole or the element is magnetized to control the orientation when the element is fitted into the element arrangement hole, the element arrangement hole or The orientation required by the function of the element can be performed on the second substrate by subjecting the surface of the element to a process for changing the wettability with respect to the liquid introduced into the cell region.

  Further, when the element is peeled from the first substrate and transferred to the cell, the element on the first substrate can be selectively transferred to transfer the arbitrary element to the arbitrary cell. For this reason, it becomes easy to arrange a plurality of types of elements at arbitrary positions and to repeatedly transfer the elements a plurality of times. For selective transfer of the element, laser ablation can be used by irradiating a laser beam to an arbitrary position of the first substrate. In selective transfer of elements by laser ablation, high throughput, high positional accuracy, and high energy utilization can be obtained. For laser ablation, excimer laser irradiation is performed through a mask in which an opening is formed, or laser light irradiation is applied to an arbitrary position on the first substrate through reflection of a YAG laser by a rotating mirror. be able to.

  When liquid is used for self-alignment of elements in the cell area, even if the liquid is introduced into the cell area after transferring the element into the cell area, the liquid is introduced into the cell area and then into the cell area. The element may be transferred. In addition, the liquid is dropped onto the second substrate and the second substrate is inclined to introduce the liquid into the cell, or the liquid is diffused onto the second substrate using a dispensing device to introduce the liquid into the cell. A necessary amount of liquid can be supplied to the cell formed on the second substrate by a method or a method of dropping the liquid using a nozzle that ejects the liquid and introducing the liquid into the cell. Is possible.

  In addition, by transferring the element after removing the element or the second substrate electrostatically, the element is prevented from adhering to an unexpected position due to electrostatic force, and the element is reliably transferred to the cell. be able to. On the contrary, by transferring the element after charging the element or the second substrate, the element is surely transferred to the cell so that the element adheres in the cell region by electrostatic force. Can do.

After the second substrate is formed in a multilayer structure and the elements are arranged in a predetermined position in the cell region by self-alignment, the back layer on which the elements of the second substrate are not arranged is peeled off to expose the elements from the back surface. It may be allowed. That is, the cell is a region surrounded by the cell dividing portion which is a convex portion made of resin formed on the base portion of the second substrate, and the cell dividing portion is a resin having an element arrangement hole at the bottom in the cell. It is formed integrally with the layer, the surface of the base portion is exposed at the bottom of the element arrangement hole, the element is self-aligned in the element arrangement hole in the cell region, the liquid is removed, and the inside of the cell is cured. It is possible to expose the element from both sides of the second substrate by filling and curing with a functional material, and then peeling off the base part constituting the second substrate and exposing the element from the back surface of the cell dividing part. Therefore, the wiring for ensuring electrical connection with the element can be formed from both sides of the second substrate. If wiring connection can be made from both surfaces of the second substrate, the degree of freedom in wiring rules can be improved, so that the degree of freedom in designing electronic devices that are manufactured by arranging elements can be improved. In addition, since wiring connection can be performed from both surfaces of the second substrate, it is possible to improve the arrangement density of the elements and to manufacture a highly integrated electronic device.

  The element arranged on the second substrate may be a light emitting element or a composite element on which a plurality of types of elements are mounted, and the elements can be arranged without depending on the type of element. is there.

In order to solve the above problems, the element arrangement method of the present invention includes a first element arranged on a first substrate and a second element arranged on a second substrate on a third substrate. Is an element arrangement method in which the first element or the second element is fitted into the bottom on the surface of the third substrate. has a hole, a step that form a cell that is capable of holding structure of the liquid containing the element arrangement hole inside, a step of introducing a liquid into said cell, to said first substrate and transferring into the cell a formed the first element peeling to the step of transferring into the cell by peeling the second of said second element formed on a substrate, wherein before removing the liquid in cell Le, said first element and second element in a self-aligned to the device arrangement hole Characterized by comprising the steps you location, a.

  By transferring the element into the cell area dividing the third substrate, the element can be arranged by self-alignment in a relatively small cell area, so that the time required for element arrangement can be shortened. it can. In addition, when transferring an element, it is only necessary to roughly control the position of the element in the cell area, and since precise position control can be performed by self-alignment in the cell area, the transfer speed of the element is improved. Thus, the throughput of the element arrangement can be improved. Further, since the first element and the second element are transferred to the cell, the elements arranged on the plurality of substrates can be precisely positioned and arranged on the third substrate.

  Since elements arranged on a plurality of substrates can be transferred, the first element and the second element may be different types of elements, and elements for realizing various functions are provided on the third substrate. It becomes possible to arrange it efficiently and precisely. In addition, the cell to which the first element is transferred and the cell to which the second element is transferred are formed in different regions on the third substrate, so that any cell on the third substrate can be used. Arbitrary kinds of elements can be arranged at the positions.

  In the element arrangement method of the present invention, the elements are arranged on the arrangement substrate by selectively transferring the elements into the cell area formed on the arrangement substrate and performing precise positioning of the elements by self-alignment in the cell area. To do. Since the cell region is a partial region of the array substrate, self-alignment within the cell region can be completed in a short time. In addition, since the cell region is formed in an area larger than the position where the element is to be arranged, when performing selective transfer of the element, it is sufficient to perform the transfer with positional accuracy enough to drop the element into the cell region. Precise positioning is performed by self-alignment. For this reason, it is possible to widen the alignment allowable range at the time of selective transfer of elements, improve the throughput of element transfer, and improve the speed of element arrangement.

  Further, in the element arrangement method of the present invention, since the element is dropped into the cell by selective transfer, the element can be directly transferred to the cell by peeling the element from a substrate on which an element such as a sapphire substrate is formed. Even when the elements are formed densely on the element formation substrate, it is possible to transfer any element to any cell because selective transfer is used for transferring the element. In addition, since the elements can be precisely arranged if the elements can be selectively transferred into the cell region, the elements can be applied to cells formed at intervals irrelevant to the pitch of the elements formed on the element formation substrate. It is possible to perform precise placement by self-alignment by transferring the number of cells, and it is possible to improve the degree of freedom with respect to the cell arrangement on the arrangement substrate.

  Hereinafter, an element arrangement method to which the present invention is applied will be described in detail with reference to the drawings. In addition, this invention is not limited to the following description, In the range which does not deviate from the summary of this invention, it can change suitably.

In the element separation method of the present invention, an array substrate for arraying elements is divided into cells, and after the elements are selectively transferred for each cell, the elements are placed in a predetermined position by self-alignment within the cell region. Is to be placed. By selectively transferring the elements for each cell, the elements can be arranged by self-alignment within a relatively small cell region, so that the time required for arranging the elements can be shortened. In addition, when transferring an element, it is only necessary to roughly control the position of the element in the cell area, and since precise position control can be performed by self-alignment in the cell area, the transfer speed of the element is improved. Thus, the throughput of the element arrangement can be improved.
[First embodiment]

  First, as shown in FIG. 1A, for example, a light emitting diode element 11 is formed on an element formation substrate 10 constituted by a sapphire substrate or the like by MOCVD (Metal Organic Chemical Vapor Deposition) method or the like. A plurality are formed. The light emitting diode element 11 is formed with an n-type doped layer, an active layer, a p-type doped layer, an electrode, and the like. As shown in the partially enlarged view of FIG. 12 are separated. Here, the light emitting diode element 11 will be described as an example of an element for performing the arrangement by the element arranging method of the present invention. However, the element is not limited to the light emitting diode, and is an integrated circuit for realizing various functions, for example, a semiconductor such as an active chip. Elements, various phosphors, and the like can also be used. The light emitting diode element 11 may be provided with a contact electrode or may be further packaged with a resin to form a lead electrode.

Next, as shown in FIG. 2A, an array substrate 20 for arraying the light emitting diode elements 11 is formed separately from the element formation substrate 10. As shown in the partial enlarged view of FIG. 2B, the array substrate 20 is formed with the cell division part 22 and the resin layer 22b on the base part 21, and the area partitioned by the cell division part 22 is the individual cell 23. Forming. Base portion 21 is a plate-like or film-like member such as a plastic or glass substrate, the cell dividing unit 22 is a protrusion on the wall that is formed in the resin layer 22 b integrally a base formed of a resin . In the region of the cell 23, an element arrangement hole 24 for arranging the light emitting diode element 11 is opened between the resin layers 22b, and the base portion 21 is exposed at the bottom of the element arrangement hole 24. Yes. Further, for example, an electrode 25 is formed on the upper surface of the resin layer 22b by photolithography or the like. The electrode 25 is an electric wiring formed in a direction perpendicular to the paper surface in the figure, and functions as a row electrode by longitudinally cutting through the cells 23 formed side by side in the direction perpendicular to the paper surface.

  In addition, a liquid 26 such as alcohol or pure water is injected into the internal region of each cell 23 partitioned by the cell dividing unit 22. After the liquid 26 is injected, since the liquid 26 is stored in the internal region of the cell 23, the element arrangement hole 24, the electrode 25, and the resin layer 22b are covered with the liquid 26 and buried in the liquid 26. . In addition, since the liquid 26 is partitioned and held by the cell dividing unit 22, when the surface of the cell dividing unit 22 has low affinity with the liquid 26, as shown in FIG. The central portion is raised due to the surface tension.

  For example, as shown in FIG. 3A, a method of filling each cell 23 with the liquid 26 is performed by forming the cell dividing portion 22 and the electrode 25 on the base portion 21 and then arranging the array substrate as shown in FIG. The liquid 26 is dropped on one end of the liquid 20 and the liquid 26 is supplied to the cell dividing unit 22. Thereafter, as shown in FIG. 3C, the side of the array substrate 20 to which the liquid 26 has been supplied is lifted, the array substrate 20 is tilted, and the liquid 26 is allowed to flow to the adjacent cells 23, whereby FIG. As shown in d), a method of supplying the liquid 26 to all the cells 23 is used. In this method, no special member is required to supply the liquid 26 to each cell 23, and the liquid 26 can be supplied easily. As long as it is possible to supply the liquid 26 to all the cells 23, other liquid supply methods described later may be used.

  FIG. 4 is a perspective view showing the array substrate 20 on which the cell dividing section 22 is formed. By forming the cell dividing portion 22 over the entire surface of the base portion 21, the cells 23 are formed on the array substrate 20 at equal intervals in the vertical and horizontal directions. Since one element arrangement hole 24 is formed in each cell 23, when the light emitting diode elements 11 are arranged in the element arrangement holes 24, the light emitting diode elements 11 are arranged on the array substrate 20 at equal intervals. become. As a method for forming the cell dividing portion 22, for example, a method for forming irregularities by embossing by molding a resin laminated flat on the base portion 21 with a mold, wet etching such as ozone water or sulfuric acid, or dry etching. Alternatively, a method of forming a concavo-convex by photolithography by applying a photosensitive resin on the base portion 21 may be used. At this time, the element arrangement hole 24 does not need to be formed at the center position of the cell 23 and may be formed anywhere in the cell 23 region. Alternatively, a plurality of element arrangement holes 24 may be formed in the cell 23, and the number of light emitting diode elements 11 arranged in the cell 23 may be a plurality of element arrangement holes 24.

  Next, as shown in FIG. 5A, the element formation substrate 10 and the array substrate 20 are opposed to each other, and the light emitting diode element 11 formed at a predetermined position of the element formation substrate 10 is selectively peeled off. Transfer is performed by dropping the light emitting diode element 11 so that one light emitting diode element 11 is distributed to each cell 23. The light emitting diode element 11 dropped into the cell 23 floats in the liquid 26 filled in the cell 23 as shown in the partial enlarged view of FIG. 5B, and the element arrangement hole 24 is formed. It is not necessarily located directly above the position. At this time, the element formation substrate 10 and the array substrate 20 may be detached in a spatially separated state, and the element formation substrate 10 and the array substrate 20 are brought close to the extent that the light emitting diode element 11 contacts the liquid 26. It may be allowed to. When the light emitting diode element 11 is detached while the element formation substrate 10 and the array substrate 20 are spatially separated, it is necessary to adjust the distance between the substrates so that the element is surely dropped into the cell 23. However, it is possible to improve the throughput by shortening the time required to transfer the element.

  As a method of peeling the light emitting diode element 11 from the element forming substrate 10, for example, laser light is arbitrarily emitted from the back surface of the element forming substrate 10 on which the element is not formed so as to pass through the element forming substrate 10. Laser ablation that irradiates can be used. Laser ablation means that a fixing material that absorbs irradiated light is excited photochemically or thermally, and the bonds of atoms or molecules inside the surface or inside are cut and released. Part of it appears as a phenomenon that causes phase changes such as melting, evaporation, and vaporization. For example, when a sapphire substrate is used as the element formation substrate 10 and the gallium nitride (GaN) light emitting diode element 11 is peeled off by laser ablation, gallium nitride is a metal gallium (Ga) and nitrogen gas at the interface between the element and the substrate. The light emitting diode element 11 can be easily peeled off.

  FIG. 6 is an example showing a method for irradiating an arbitrary cell 23 of the element forming substrate 10 with laser light, and is a schematic diagram for explaining a method using an excimer laser and an optical system for mask projection. A laser beam 30 a having a large irradiation area is irradiated from the excimer laser generator 30, and only the laser beam 30 a passing through the opening 32 formed in the mask 31 is incident on the reflecting mirror 33. The laser beam 30a that has passed through the opening 32 is reflected by the reflecting mirror 33 and enters the lens 34. The laser beam 30a is refracted and collected by the lens 34, whereby the laser beam 30a is applied to a predetermined region of the element forming substrate 10. Is irradiated. By transferring the light emitting diode element 11 formed at an arbitrary position on the element forming substrate 10 to a predetermined cell 23, the transfer is performed in such a manner that one light emitting diode element 11 is associated with one cell 23 reliably. Transfer with high throughput, high position accuracy, and high energy utilization rate can be performed.

  Further, in order to accurately transfer the light emitting diode element 11 to the desired cell 23, as shown in FIG. 5A, the light emitting diode element 11 is repeatedly transferred to emit red light. It is possible to arrange a plurality of types of elements such as transferring the light emitting diode element 11B that emits blue light after transferring the light emitting diode element 11G that emits 11R and green light to the predetermined cell 23. Therefore, even when a plurality of types of elements are arranged in arbitrary cells formed on the same substrate, the elements can be accurately arranged using the element arrangement method of the present invention. Further, by forming the light emitting diode elements 11 on the element formation substrate 10 at a dense pitch and arranging the light emitting diode elements 11 on the array substrate 20 at a sparser pitch, the raw material cost and the process cost can be reduced.

  FIG. 7 is a process diagram illustrating step transfer for transferring the light emitting diode element 11 to the array substrate 20 in a stepwise manner. When the area of the element formation substrate 10 is smaller than the area of the array substrate 20, first, the light emitting diode elements 11 are transferred and arranged in a predetermined region as shown in FIG. 7A, and then FIG. And as shown in FIG.7 (c), the area | region which transfers the light emitting diode element 11 is changed in steps. By arranging the light emitting diode elements 11 repeatedly in a stepwise manner, the elements can be arranged for the cells 23 formed in all the regions of the arrangement substrate 20.

  At this time, even when the light emitting diode elements 11 are repeatedly arranged as shown in FIGS. 7A to 7C, the light emitting diode elements 11 are selectively associated with the cells 23 partitioned by the cell dividing section 22. Suppose you make an arrangement. By selectively performing the transfer of the light-emitting diode element 11 at each stage, it is possible to prevent the light-emitting diode element 11 from being overlapped with the cell 23 in which the light-emitting diode element 11 is already disposed, and the light-emitting diode element. The light-emitting diode elements 11 can be disposed in all the cells 23 without the element missing cells 23 where the elements 11 are not disposed. The light emitting diode elements 11 sparsely left on the element formation substrate 10 after the elements are selectively transferred can be mounted on the array substrate 20 without waste by performing selective transfer a plurality of times.

  After the light emitting diode elements 11 are dropped and transferred to the cells 23 formed on the array substrate 20, the light emitting diode elements 11 are arranged in the element arrangement holes 24 inside the cells 23. FIG. 8 is a process diagram showing an example in which the light emitting diode elements 11 are arranged by self-alignment by vibrating the array substrate 20 with ultrasonic waves or the like. As shown in FIG. 8A, the light emitting diode element 11 is dropped on the liquid 26 in the cell 23. At this time, it does not matter where the light emitting diode element 11 in the cell 23 is located on the liquid 26, and may be in a state where it floats on the liquid 26. Next, as shown in FIG. 8B, the base portion 21 of the array substrate 20 is vibrated in the vertical direction and the horizontal direction to move the liquid 26 and the light emitting diode element 11, and the light emitting diode element 11 is placed in the liquid 26. Sink.

  By continuing the vibration of the array substrate 20, the light emitting diode elements 11 continue to move slightly in the cell 23, and finally the light emitting diode elements 11 are placed in the element arrangement holes 24 as shown in FIG. Mating. At this time, if the time during which vibration is applied to the array substrate 20 is too short, the light emitting diode element 11 cannot be fitted into the element arrangement hole 24, and therefore the self-alignment of the light emitting diode element 11 takes a sufficiently long time. Need to run. However, since the cell 23 is a region divided by the cell dividing unit 22, the area of the cell 23 can be made sufficiently smaller than the area of the array substrate 20, and a plurality of elements are formed in a plurality of holes on the array substrate 20. Compared with the prior art for fitting the light emitting diode element 11, the probability that the light emitting diode element 11 is fitted into the element arrangement hole 24 can be increased in a short time.

  When the light emitting diode element 11 and the element arrangement hole 24 are formed, the light emitting diode element 11 is tapered, and the element arrangement hole 24 has a shape corresponding to the shape of the light emitting diode element 11. The vertical direction of the element when the light emitting diode element 11 is fitted into the element arrangement hole 24 formed above may be adjusted. Further, since the movement tendency of the light emitting diode element 11 varies depending on the wettability between the liquid 26 and the surface of the array substrate 20 and the wettability between the light emitting diode element 11 and the liquid 26, the light emitting diode element 11 in the liquid 26 has a different movement tendency. In order to perform self-alignment, it is necessary to transfer the element in consideration of the surface tension of the liquid and the wettability of the surface of the light emitting diode element 11 with respect to the liquid 26.

  When the light emitting diode element 11 is fitted into the element arrangement hole 24 by self-alignment, it is necessary to control the orientation direction of the element depending on how the light emitting diode element 11 is used. For this reason, the shape of the light-emitting diode element 11 is asymmetrical, and the concave shape of the element arrangement hole 24 is formed in accordance with the outer shape of the light-emitting diode element 11, so that The left and right direction may be controlled. Alternatively, the orientation of the light-emitting diode element 11 may be controlled by applying a surface treatment that makes the wettability of the surface of the light-emitting diode element 11 with respect to the liquid 26 asymmetric so as to correspond to the wettability of the surface of the element arrangement hole 24. Further, the bump metal of the light emitting diode element 11 is formed of nickel or the like on the element forming substrate 10 and magnetized in a predetermined direction, and the element arrangement hole 24 is magnetized in accordance with the arrangement, thereby arranging the light emitting diode element 11. The orientation control may be performed. Instead of magnetizing the element arrangement hole 24, a magnetic field may be applied to the array substrate 20 from the outside to control the orientation of the magnetized light emitting diode element 11.

  After the light emitting diode element 11 is fitted into the element arrangement hole 24, as shown in FIG. 8D, the liquid 26 filled in the cell 23 is evaporated by heating or drying. By evaporating the liquid 26, the electrode 25 and the light emitting diode element 11 are exposed in the cell 23. As described with reference to FIGS. 8A to 8D, the light emitting diode element 11 is self-aligned with the element arrangement hole 24 by vibrating the array substrate 20 and moving the light emitting diode element 11 in the cell 23. Will be placed by. In order to determine the position of the element in the cell 23 by self-alignment, the light emitting diode element 11 only needs to be located in the region of the cell 23 in the element arranging method of the present invention. When peeling and dropping into the cell 23, it is possible to give a margin of the area of the cell 23 to the alignment accuracy between the element forming substrate 10 and the array substrate 20.

  Next, as shown in FIG. 9A, the light emitting diode element 11 exposed in the cell 23 and the electrode 25 are electrically connected with a transparent conductive ink 40 (for example, ITO ink) or the like. Next, as shown in FIG. 9B, after the transparent resin 42 or the like is printed and cured in the cells 23, the base portion 21 of the array substrate 20 is peeled from the cell dividing portion 22. Since the light emitting diode element 11 is fixed to the element arrangement hole 24 by the transparent resin 42, the light emitting diode element 11 is not detached even if the array substrate 20 is peeled off from the cell dividing portion 22. . Further, by peeling off the base portion 21, one surface of the light emitting diode element 11 is exposed from the side where the base portion 21 of the cell dividing portion 22 is formed. Finally, as shown in FIG. 9C, an electrode 41 is formed on the surface of the cell dividing portion 22 where the base portion 21 is formed, and the light emitting diode element 11 is electrically connected. The electrode 41 is an electric wiring formed in the horizontal direction on the paper surface in the figure, and functions as a column electrode by longitudinally cutting through the cells 23 formed side by side in the horizontal direction on the paper surface.

  As described above, by using the element arrangement method of the present invention, the electrode 25 which is a part of the global wiring is formed on the arrangement substrate 20 in advance, and after the light emitting diode element 11 is transferred, the light emitting diode element 11 and the electrode are formed. The electrical wiring is completed only by connecting 25. As shown in FIG. 4, since the cells 23 are arranged in a grid pattern on the array substrate 20, the light emitting diode elements 11 are also arranged in a grid pattern. Since the formed electrodes 25 and 41 function as a row electrode and a column electrode, respectively, a matrix drive display device can be configured. Further, the array substrate 20 has a two-layer structure of the base portion 21 and the cell dividing portion 22, and after selective transfer of the light emitting diode element 11, the base portion 21 is peeled off to make electrical connection to the light emitting diode element 11 on both sides. Thus, even if the light emitting diode element 11 is small, the wiring connection can be facilitated and the degree of freedom of the wiring rule can be increased.

  When the elements are arranged so that the light emitting surface of the light emitting diode element 11 is on the lower side in FIG. 9C and the electrode 41 is formed, the electrode 41 and the element are made of ITO (indium-tin). By connecting with a transparent electrode such as an oxide) or ITO ink, the electrode 41 can be electrically connected without covering the light emitting surface of the light emitting diode element 11, and good light extraction without disturbing light extraction. Efficiency can be realized. When the elements are arranged so that the light emitting surface of the light emitting diode element 11 is on the side where the electrode 25 is formed on the upper side in FIG. 9C, the light emitting diode element 11 is composed of the cell dividing portion 22 and a low wall. The light extraction efficiency can be improved by forming a multilayer structure of a highly reflective metal and a transparent insulating film on the inner side of the concave shape or on the surface of the element arrangement hole 24.

  In the element arrangement method of the present invention, the elements are arranged on the arrangement substrate by selectively transferring the elements into the cell area formed on the arrangement substrate and performing precise positioning of the elements by self-alignment in the cell area. To do. Since the cell region is a partial region of the array substrate, self-alignment within the cell region can be completed in a short time. In addition, since the cell region is formed in an area larger than the position where the element is to be arranged, when performing selective transfer of the element, it is sufficient to perform the transfer with positional accuracy enough to drop the element into the cell region. Precise positioning is performed by self-alignment. For this reason, it is possible to widen the alignment allowable range at the time of selective transfer of elements, improve the throughput of element transfer, and improve the speed of element arrangement.

Further, in the element arrangement method of the present invention, since the element is dropped into the cell by selective transfer, the element can be directly transferred to the cell by peeling the element from a substrate on which an element such as a sapphire substrate is formed. Even when the elements are formed densely on the element formation substrate, it is possible to transfer any element to any cell because selective transfer is used for transferring the element. In addition, since the elements can be precisely arranged if the elements can be selectively transferred into the cell region, the elements can be applied to cells formed at intervals irrelevant to the pitch of the elements formed on the element formation substrate. It is possible to perform precise placement by self-alignment by transferring the number of cells, and it is possible to improve the degree of freedom with respect to the cell arrangement on the arrangement substrate.
[Second Embodiment]

  As another embodiment of the element arranging method of the present invention, another example of self-alignment in which light emitting diode elements are arranged in a cell region will be described. This embodiment is different from the first embodiment described above in the method of arranging the light emitting diode element transferred in the cell region in the element arrangement hole 24, but the other procedures and configurations are the same as those in the first embodiment. Since the configuration is the same as that of the embodiment, the description of the same portion is omitted to avoid duplication of description.

  FIG. 10 is a process diagram showing another example of the arrangement by self-alignment of the light emitting diode elements in the cell region. Also in the present embodiment, as in the first embodiment described above, as shown in FIG. 10A, an array substrate 20 having a cell division portion 22 formed on a base portion 21 is prepared, and cell division is performed. After filling the liquid 26 in the cell 23 region delimited by the portion 22, the light emitting diode element 11 formed on the element forming substrate 10 is selectively transferred and dropped onto the liquid 26. At this time, there is no particular problem in which position in the region of the cell 23 the light-emitting diode element 11 is arranged, and the light-emitting diode element 11 is floating on the liquid 26 and can be moved in the cell 23 region. It only has to be.

  Next, as shown in FIG. 10B, the liquid 26 in the cell 23 is evaporated by heating or drying while the light emitting diode element 11 is floating on the liquid 26. At this time, the amount of the liquid 26 is gradually reduced, and the position of the light emitting diode element 11 on the liquid 26 is changed at the same time. Since the element arrangement hole 24 has a concave shape in the cell 23, the liquid 26 tends to stay in the element arrangement hole 24 during the evaporation process of the liquid 26, and the element arrangement hole 24 immediately before the liquid 26 completely evaporates. Only the liquid 26 remains. That is, as the evaporation of the liquid 26 proceeds, the liquid 26 decreases as if it is concentrated in the element arrangement hole 24.

At this time, since the light emitting diode element 11 floats in accordance with the flow of the liquid 26, the light emitting diode element 11 also follows the movement in which the liquid 26 is concentrated in the element arrangement hole 24 by evaporation and the surface tension of the liquid 26 also. The light emitting diode element 11 is fitted into the element arrangement hole 24 as shown in FIG. In the arrangement by self-alignment of the light emitting diode element 11 accompanying the evaporation of the liquid 26, the surface inside the element arrangement hole 24 is surface-treated so that the wettability to the liquid 26 is good, and the cell 23 region other than the element arrangement hole 24 By subjecting the surface to a state where the wettability with respect to the liquid 26 is poor, evaporation such that the liquid 26 is concentrated in the element arrangement hole 24 can be promoted. By self-alignment using element movement due to liquid evaporation and surface tension, element arrangement can be performed easily and inexpensively even when many cells are arranged on an array substrate. Is possible.
[Third embodiment]

  As another embodiment of the element arranging method of the present invention, another example of a method of filling a liquid in each cell region will be described. Although this embodiment is different from the first embodiment described above in the method of introducing the liquid into the cell region, the other procedures and configurations are the same as those in the first embodiment, and thus the description thereof is duplicated. In order to avoid this, the description of the same part is omitted. In the first embodiment, as shown in FIG. 3, the liquid 26 is supplied to one of the array substrates 20, and the array substrate 20 is lifted on the side where the liquid 26 is supplied to tilt the array substrate 20. It is assumed that the liquid 26 flows on the array substrate 20 and the cells 26 are filled with the liquid 26. However, in the element arraying method of the present invention, the surface of the array substrate 20 is divided by the cells 23, and the light emitting diode elements 11 are selectively transferred for each cell 23. The method of filling the liquid in the cell 23 may be realized by various other means.

  FIG. 11A is a schematic diagram illustrating an ink jet method in which a minute amount of liquid is ejected from the nozzle 50 to the cells 23 partitioned by the cell dividing unit 22 and the liquid 26 is dropped into each cell 23 and introduced. FIG. In this method, after a predetermined amount of the liquid 26 is dropped onto the cells 23 by the nozzles 50, the nozzles 50 are moved onto the adjacent cells 23, whereby the liquid 26 is applied to all the cells 23 on the array substrate 20. Can be introduced. As the nozzle 50, for example, the nozzle 50 used in an ink jet printer or the like can be used. Since the existing ink jet technology is used, it is possible to easily control the dropping amount and the dropping position of the liquid 26.

  In the ink jet method shown in FIG. 11A, the liquid 26 can be dripped onto the cell 23 while the array substrate 20 is held in a horizontal state, so the light emitting diode element 11 is selected in the cell 23. After the transfer, the liquid 26 can be dropped on the cell 23 in which the light emitting diode element 11 is dropped. After dropping the liquid 26 and the light emitting diode element 11 into each cell 23, the light emitting diode element 11 is arranged by self-alignment, such as applying ultrasonic vibration to the array substrate 20.

  In the case where the light emitting diode element 11 is selectively transferred to the cell 23 before the liquid 26 is dropped into the cell 23, the light emitting diode element 11 is outside the desired region due to electrostatic force because the light emitting diode element 11 is minute and light. There is a possibility of sticking to. Therefore, before transferring the light emitting diode element 11 from the element forming substrate 10 to the cell 23, both the element forming substrate 10 and the array substrate 20 are electrostatically removed, and the light emitting diode element 11 adheres to an unexpected region. It is desirable to prevent. Alternatively, the element formation substrate 10 or the array substrate 20 may be intentionally charged, and the light emitting diode elements 11 may be reliably attached to the array substrate 20 by electrostatic force.

FIG. 11B is a schematic diagram showing an example in which the liquid 26 supplied onto the array substrate 20 is moved by the wiper 51 and all the cells 23 are filled with the liquid 26. The liquid 26 dripped in a large amount on the array substrate 20 is stretched by the wiper 51 which is a rod-like dispense device, and the liquid 26 is filled in each cell 23 in such a manner as to be coated on the cell dividing portion 22 of the array substrate 20. FIG. 11C is a schematic diagram showing a method of filling the liquid 26 in the cells 23 partitioned by the cell dividing section 22 by passing the array substrate 20 through the container 52 filled with the liquid 26. In the element arrangement method of the present invention, the liquid 26 may be supplied into each cell 23 by any method.
[Fourth embodiment]

  As another embodiment of the element arraying method of the present invention, a roll-shaped member is used as an array substrate, and an element is formed by cell formation, liquid dripping, element selective transfer, and self-alignment in a cell region by a flow operation. An example of performing the arrangement will be described. This embodiment is different from the above-described first embodiment in that the array substrate is a roll-shaped member and the liquid is dropped by an ink jet method. However, the other procedures and configurations are the same as the first embodiment. Since it is the same as that of embodiment, in order to avoid duplication of description, description is abbreviate | omitted about the same part.

  In the element arraying method of the present invention, the array substrate 20 on which the light emitting diode elements 11 are arrayed does not have to be a flat plate member, and an array substrate formed into a roll shape using a film-like plastic or resin may be used. . FIG. 12 is a process diagram showing a method of performing the element arrangement method of the first embodiment described above in a flow operation. A roll-to-roll process in which a plurality of steps are processed by a flow operation while moving the roll-shaped array substrate 20 by separating the element formation substrate 10 and the array substrate 20 and dropping the light-emitting diode element 11 into the cell 23. Thus, the light emitting diode elements 11 can be arranged efficiently.

  The roll-shaped array substrate 20 formed of plastic or resin is rotated, and the cells 23 are formed on the array substrate by stamping the cell dividing portion 22 with a mold by a flow operation using a belt conveyor system. Next, the liquid 26 is dropped into the cell 23 by the nozzle 50 using the ink jet method on the downstream side of the mold forming in the flow direction of the array substrate 20. Thereafter, the light emitting diode element 11 is selectively transferred from the element forming substrate 10 by laser ablation or the like, and the light emitting diode element 11 is dropped into the cell 23. Finally, ultrasonic vibration is applied to the array substrate 20 to place the light emitting diode elements 11 in the element arrangement holes 24 by self-alignment, the liquid 26 is evaporated, and wiring formation and fixing of the light emitting diode elements 11 are performed.

In the element arraying method of the present invention, the surface of the array substrate 20 is divided by the cells 23, and the light emitting diode elements 11 are selectively transferred to the cells 23, and the light emitting diode elements 11 are self-aligned in the cells 23. What is necessary is just to arrange | position to the hole 24. FIG. Therefore, even when a roll-shaped member formed of resin, plastic, or the like is used as the array substrate 20, the light emitting diode elements 11 can be accurately arranged in the element arrangement holes 24 by self-alignment. As a result, the light emitting diode elements 11 can be efficiently arranged on the array substrate 20 having a large area by the roll-to-roll process. Thus, the elements can be arranged, and the time required for manufacturing can be shortened.
[Fifth embodiment]

  As another embodiment of the element arranging method of the present invention, another example of selectively transferring a light emitting diode element formed on an element forming substrate will be described. Although this embodiment is different from the above-described first embodiment in the selective transfer method of the light-emitting diode elements, the other procedures and configurations are the same as those in the first embodiment, and thus the description is not duplicated. Therefore, the description of the same part is omitted. In the element arraying method of the present invention, the surface of the array substrate 20 is divided by the cells 23, and the light emitting diode elements 11 are selectively transferred for each cell 23, and the light emitting diode elements 11 are arranged in the cells 23 by self-alignment. In order to arrange in the hole 24, it is important to selectively transfer the desired light emitting diode element 11 to the cell 23 reliably. However, the method of selectively peeling the light emitting diode element 11 from the element forming substrate 10 may be other than the method using the excimer laser shown in FIG.

  FIG. 13 is a schematic diagram showing a method of irradiating a predetermined position of the element formation substrate 10 with a laser beam using a YAG laser as the selective transfer method of the present embodiment. A laser beam 62 having a small irradiation area is irradiated onto the rotating mirror 61 from the YAG laser generator 60, and the laser beam 62 is reflected by the rotating mirror 61. The rotating mirror 61 is a device that has a flat reflecting surface that can be driven and performs a rotating operation to change the normal direction of the reflecting surface. Although FIG. 13 shows an example in which a single plane mirror is used as the rotating mirror 61, a configuration in which two or more mirrors are combined to change the light reflection direction may be used. The traveling direction of the laser light 62 reflected by the rotating mirror 61 is changed according to the normal direction of the rotating mirror 61, and only the laser light 62 that passes through the opening 64 formed in the mask 63 is incident on the lens 65. . The laser beam 62 is refracted and condensed by the lens 65, so that the laser beam 62 is irradiated onto a predetermined region of the element forming substrate 10.

  The laser beam 62 reflected by the rotating mirror 61 travels in the direction of the mask 63 disposed between the rotating mirror 61 and the element forming substrate 10, but the laser beam that has reached a region other than the opening 64 of the mask 63. The light 62 is blocked by the mask 63 and does not reach the element formation substrate 10. Of the laser light 62 reflected by the rotating mirror 61, only the light that has reached the opening 64 of the mask 63 is transmitted through the mask 63 and reaches the lens 65 and the element formation substrate 10. By designing the arrangement of the opening 64 and the lens 65 so that only the laser beam 62 is irradiated, selective laser beam 62 irradiation can be performed.

  In the region where the laser beam 62 of the element forming substrate 10 is irradiated, the light emitting diode element 11 is peeled off from the element forming substrate 10 by the laser ablation described above, and the light emitting diode element 11 can be selectively transferred. By transferring the light emitting diode element 11 formed at an arbitrary position on the element forming substrate 10 to a predetermined cell 23, it is possible to reliably transfer one light emitting diode element 11 corresponding to one cell 23. Can do. The selective transfer using the YAG laser described with reference to FIG. 13 is a laser system that combines a galvano scan using the rotating mirror 61 and a mask projection optical system using the mask 63, and has high throughput, high positional accuracy, and high Energy utilization can be obtained.

Besides the selective transfer of the light-emitting diode element 11 using laser light, an adhesive is applied on the substrate and the light-emitting diode elements 11 are arranged closely on the adhesive so that light irradiation or heat is applied. For example, a method may be used in which the light-emitting diode element 11 is selectively detached by reducing the adhesive strength of the adhesive material by irradiation.
[Sixth embodiment]

  As another embodiment of the element arranging method of the present invention, an example in which cells are formed by applying a water-repellent pattern will be described as another example of the method of dividing the surface of the array substrate into cell regions. This embodiment is different from the first embodiment described above in the method for forming a cell, but the other procedures and configurations are the same as those in the first embodiment, and therefore, duplicate description is avoided. Therefore, the description of the same part is omitted.

  FIG. 14 is a schematic diagram showing an example in which cells are formed by applying a water-repellent pattern on the array substrate 70 used in the element array method of the present invention and performing surface treatment. The element arrangement hole 24 is formed by forming the resin layer 71 on the base portion 21 and forming a region where the resin layer 71 is not formed as a recess that is one step lower than the resin layer 71. On the resin layer 71, a water repellent pattern 72 having low wettability with respect to the liquid 26 is applied, and the cell 23 is configured in a region surrounded by the water repellent pattern 72.

  Since the liquid 26 is unlikely to stay in the region where the water repellent pattern 72 is applied, even if the liquid 26 is dropped around the element arrangement hole 24 by the above-described inkjet method or the like, the liquid 26 is not collected on the water repellent pattern 72. In other words, the liquid 26 is stored only in the cell 23 where the element arrangement hole 24 and the resin layer 71 are exposed. That is, although there is no structure for forming a height difference on the resin layer 71, the cells 23 are divided by the water repellent pattern 72, and the liquid 26 is stored individually for each cell 23. Therefore, as in the first embodiment described above, the light emitting diode element 11 is selectively transferred to each cell 23, and the light emitting diode element 11 is fitted into the element arrangement hole 24 by self-alignment by ultrasonic vibration or the like. Can be combined.

As in the case where the cell 23 is configured by the water repellent pattern 72, a hydrophilic pattern having high wettability with respect to the liquid 26 is applied only to the peripheral region of the element arrangement hole 24, and the region to which the hydrophilic pattern is applied is defined as the cell 23. Thus, the liquid 26 may be stored for each cell 23. Also in this case, there is no structure that forms a height difference on the resin layer 71, but the cells 23 are determined by the hydrophilic pattern, and the liquid 26 is stored individually for each cell 23. Therefore, as in the first embodiment described above, the light emitting diode element 11 is selectively transferred to each cell 23, and the light emitting diode element 11 is fitted into the element arrangement hole 24 by self-alignment by ultrasonic vibration or the like. Can be combined.
[Seventh embodiment]

  As another embodiment of the element arrangement method of the present invention, an example of a method for fixing a light emitting diode element after arranging the light emitting diode element in the element arrangement hole by self-alignment will be described. This embodiment is different from the above-described first embodiment in the method of fixing the light-emitting diode element after it is arranged by self-alignment, but the other procedures and configurations are the same as those in the first embodiment. Therefore, the description of the same part is omitted to avoid duplication of description.

  FIG. 15 is a schematic view showing an example in which a light emitting diode element is fixed using a thermoplastic and thermosetting resin in the element arranging method of the present invention. Also in the present embodiment, an array substrate 80 for arraying the light emitting diode elements 11 is formed separately from the element formation substrate 10. In the array substrate 80, the cell dividing portion 22 and the resin layer 22 b are formed on the base portion 21, and the regions partitioned by the cell dividing portion 22 form individual cells 23. The base portion 21 is a flat plate member such as a plastic or glass substrate, and the cell dividing portion 22 is a two-stage wall member having a high wall and a low wall made of resin or the like. In the region of the cell 23, an element arrangement hole 24 for arranging the light emitting diode element 11 is opened between the resin layers 22b. On the resin layer 22b and the element arrangement hole 24, a fixing resin layer 81 is formed of a thermoplastic and thermosetting resin.

  An electrode 25 is formed on the upper surface of the resin layer 22b by photolithography or the like. The electrode 25 is an electric wiring formed in a direction perpendicular to the paper surface in the figure, and functions as a row electrode by longitudinally cutting through the cells 23 formed side by side in the direction perpendicular to the paper surface. In addition, a liquid 26 such as alcohol or pure water is injected into the internal region of each cell 23 partitioned by the cell dividing unit 22. Since the liquid 26 is stored in the internal region of the cell 23, the element arrangement hole 24, the electrode 25, and the resin layer 22 b are covered with the liquid 26 and buried in the liquid 26.

  As shown in FIG. 15A, the prepared array substrate 80 and the element forming substrate 10 are opposed to each other, and the light emitting diode elements 11 formed at predetermined positions on the element forming substrate 10 are selectively peeled off. Then, the light emitting diode element 11 is dropped and transferred so as to be distributed to each cell 23. As shown in the partially enlarged view of FIG. 15B, the light emitting diode element 11 dropped into the cell 23 floats in the liquid 26 filled in the cell 23, and the element arrangement hole 24 is formed. It is not necessarily located directly above the position.

  Next, as shown in FIG. 15B, by applying ultrasonic vibration to the array substrate 80 in a state where the light emitting diode element 11 is suspended in the liquid 26, the self alignment is performed. The light emitting diode element 11 is fitted into the element arrangement hole 24. After the light emitting diode element 11 is arranged by self-alignment, the array substrate 80 is heated to soften the fixing resin layer 81, and the gap between the light emitting diode element 11 and the element arrangement hole 24 is eliminated. Thereafter, the array substrate 80 is cooled or heated to a temperature at which the fixing resin layer 81 is cured, and the fixing resin layer 81 is cured to change to the fixed layer 82 to fix the light emitting diode element 11.

Since the fixing resin layer 81 is formed inside the element arrangement hole 24, the light emitting diode element 11 can be easily fixed after the light emitting diode element 11 is arranged in the element arrangement hole 24 by self-alignment. .
[Eighth embodiment]

  FIG. 16 is a schematic view showing an example in which a light emitting diode element is fixed using a material that absorbs liquid and expands and deforms by the element arranging method of the present invention. As shown in FIG. 16A, as the array substrate 90, the resin layer 91 is formed on the base portion 21, and the region where the resin layer 91 is not formed is formed as a recess one step lower than the resin layer 91. Hole 24 is formed. On the resin layer 91, an expansion pattern 92 is formed of a material that absorbs the liquid 26 and expands and deforms, and the cell 23 is configured in a region surrounded by the expansion pattern 92. In addition, a liquid 26 such as alcohol or pure water is injected into the internal region of each cell 23 partitioned by the expansion pattern 92.

  Next, the element formation substrate 10 on which the light emitting diode elements 11 are formed is opposed to the array substrate 90, and selective transfer using an excimer laser is performed in the same manner as in the first embodiment, so that each cell 23 is transferred to each cell 23. The light emitting diode element 11 is dropped. By moving the light emitting diode element 11 by ultrasonic vibration in each cell 23, the light emitting diode element 11 is fitted into the element arrangement hole 24 by self-alignment as shown in FIG.

Since the expansion pattern 92 is formed of a material that expands and deforms in response to the liquid 26, the expansion pattern 92 expands on the resin layer 91 with the passage of time, as shown in FIG. As such, the light reaches the periphery of the light emitting diode element 11. Thereby, the light emitting diode element 11 is fixed by the expansion pattern 92, and the light emitting diode element 11 can be easily fixed after the light emitting diode element 11 is arranged by self-alignment.
[Ninth embodiment]

  As another embodiment of the element arraying method of the present invention, another configuration example of a cell formed on an array substrate will be described. This embodiment is different from the above-described first embodiment in the shape of cells formed on the array substrate and the type of elements to be arrayed, but with respect to other procedures and configurations, the first embodiment In order to avoid duplication of explanation, explanation of the same part is omitted.

  FIGS. 17A to 17F are plan views showing the shape and arrangement of cells formed on the arrangement substrate by the element arrangement method of the present invention. In the element arraying method of the present invention, the surface of the array substrate 20 is divided by the cells 23, and the light emitting diode elements 11 are selectively transferred for each cell 23, and the light emitting diode elements 11 are arranged in the cells 23 by self-alignment. Since it arrange | positions in the hole 24, a freedom degree can be given to the shape and arrangement | positioning method of the cell 23. FIG.

  As an example of the shape and arrangement of the cells 23, rectangular cells 23 are formed at equal intervals on the arrangement substrate 20 as shown in FIG. Further, the red light emitting diode element 11R, the green light emitting diode 11G, and the blue light emitting diode 11B are transferred to each cell 23 by selective transfer, and are arranged at predetermined positions in the cell 23 by self-alignment. . The light emitting diode elements 11R, 11G, and 11B constitute the pixel 100 as a set. Pixels 100 that emit red, green, and blue, which are the three primary colors of light, are formed vertically and horizontally on the array substrate 20 to form a display device.

  Similarly, as shown in FIG. 17B, the pixels 101 may be configured by forming substantially square cells 23 on the array substrate 20. In order to selectively transfer the light emitting diode element 11 into the cell 23 region, it is preferable that the area of the cell 23 is large. However, in order to quickly determine the position of the light emitting diode element 11 by self-alignment in the cell 23 region. It is preferable that the area of the cell 23 is small. Therefore, the area of the cell 23 may be set to a size that allows the light emitting diode element 11 to be reliably transferred into the region, and a limited region on the array substrate 20 may be used as the cell 23.

  Further, as shown in FIG. 17C, the pixel 102 may be configured by changing the shape of the cell 23 in accordance with the type of the light emitting diode element 11 to be arranged. In FIG. 17C, the shape of the cell for arranging the red light emitting diode element 11R is a horizontally long rectangle, and the shape of the cell for arranging the blue light emitting diode element 11B and the green light emitting diode element 11G is substantially square. It is said. Even in such an irregular shape and arrangement of the cells 23, it is possible to arrange the elements precisely by self-alignment after dropping the elements into the cells 23 by selective transfer. Such a cell shape and arrangement are suitable when the element size is different depending on the type of element to be arranged, or when the cell area required for realizing the function of the element is different. For example, when the red light emitting diode element 11R is larger than the other elements, the area of the cell 23 in which the light emitting diode element 11R is arranged is increased, and the luminance of the green light emitting diode element 11G is lower than the other elements. For example, the area of the cell 23 in which the light emitting diode element 11G is arranged is increased.

  Further, as an irregular arrangement of the cells 23, as shown in FIG. 17D, an example in which the arrangement of the cells 23 is changed for each pixel 103 formed vertically and horizontally on the array substrate 20 is also possible. . Also in this case, it is possible to arrange the elements precisely by self-alignment after dropping the elements into the cell 23 by selective transfer.

In addition, the elements arranged on the arrangement substrate 20 are not limited to the light emitting diode elements 11, and as shown in FIG. 17E, the active chips 11A can be arranged in addition to the light emitting diode elements 11R, 11G, and 11B. It is. As the transfer method of the element, the peeling other than elements by laser ablation, as described above, the elements arranged by densely in the adhesive layer can be used a method of peeling by light irradiation or heat irradiation. Therefore, it is possible to form an active matrix display device by forming a cell 23 for disposing an active chip 11A for driving the light emitting diode elements 11R, 11G, and 11B for each pixel 104.

  As elements arranged on the array substrate 20, in addition to the active chip, self-luminous elements such as organic EL, various phosphors, or a plurality of types of elements 112, 113, A composite element 110 (for example, an RGB micro LED on a Si-Tr submount) on which 114 is mounted can be used. In the element arrangement method of the present invention, the surface of the arrangement substrate 20 is divided by the cells 23, the elements are selectively transferred for each cell 23, and the elements are arranged in the element arrangement holes 24 by self-alignment in the cells 23. It is possible to perform precise positioning regardless of the shape and type of the element. Therefore, since a plurality of types of elements can be easily arranged with respect to an irregular cell arrangement, it is possible to easily and quickly manufacture a complicated apparatus that requires precise positioning.

The shape of the cells 23 formed on array substrate 20 is not necessarily a rectangular shape such as a substantially square or rectangular, select light emitting diode element 11 in a circular shape of the cell 23 as shown in FIG. 17 (f) The pixel 105 may be configured by being transferred. By performing selective transfer such that the light emitting diode element 11 is dropped into the cell 23 area without depending on the shape and arrangement method of the cell 23, the light emitting diode element 11 is self-aligned and precise in the cell 23 area. Since positioning can be performed, it is possible to design an electronic device with a high degree of freedom.

It is sectional drawing which shows the state which formed the light emitting diode element arranged by the element arrangement | sequence method of this invention on the element formation board | substrate. It is a schematic cross section which shows the structure of the arrangement | sequence board | substrate for arranging a light emitting diode element with the element arrangement | sequence method of this invention, and has shown a mode that the liquid was filled into each cell. It is process sectional drawing which shows an example of the method of filling a liquid in each cell formed on the arrangement | sequence board | substrate with the element arrangement | sequence method of this invention. It is an external appearance perspective view which shows the cell division part formed on the arrangement | sequence board | substrate used with the element arrangement | sequence method of this invention. It is process sectional drawing which shows a mode that the light emitting diode element formed in the element formation board | substrate by the element arrangement | sequence method of this invention is transcribe | transferred in a cell area | region by selective transfer. It is process drawing which shows an example of the method of selectively peeling a light emitting diode element from an element formation board | substrate with the element arrangement | sequence method of this invention, and has shown the method by the laser ablation using an excimer laser and a mask. It is process sectional drawing explaining the step transfer which repeats element transfer of multiple times with respect to the arrangement | sequence board | substrate of an area larger than an element formation board | substrate with the element arrangement | sequence method of this invention. It is process sectional drawing which shows an example of the method of arrange | positioning the light emitting diode element transcribe | transferred to each cell in an element arrangement | positioning hole by self-alignment within a cell area | region by the element arrangement | sequence method of this invention, The case where movement is used is shown. It is process sectional drawing explaining the procedure which connects an electrical wiring to a light emitting diode element, after arrange | positioning a light emitting diode element in the element arrangement | positioning hole in a cell area | region using the element arrangement | sequence method of this invention. FIG. 5 is a process diagram for arranging a light emitting diode element by self-alignment by liquid flow and surface tension by evaporating the liquid in a state where the light emitting diode element is suspended on the liquid as a second embodiment of the present invention. . FIGS. 11A and 11B are schematic diagrams for explaining a method of introducing a liquid into each cell by the element arrangement method of the present invention. FIG. 11A shows an ink jet system in which liquid is ejected from a nozzle, and FIG. FIG. 11C shows a method of coating the liquid, and FIG. 11C shows a method of passing the array substrate in the liquid stored in the container. It is a schematic diagram showing a method for performing selective transfer of elements and arrangement by self-alignment by a flow operation using a roll-shaped member as an arrangement substrate in the element arrangement method of the present invention. It is process drawing which shows an example of the method of selectively peeling a light emitting diode element from an element formation board | substrate with the element arrangement | sequence method of this invention, and has shown the method by the laser ablation using a YAG laser and a galvano scan. It is a schematic diagram which shows the example which forms a cell by apply | coating a water repellent pattern and performing surface treatment on the arrangement | sequence board | substrate used with the element arrangement | sequence method of this invention. It is a schematic diagram which shows the example which fixes a light emitting diode element using thermoplastic and thermosetting resin in the element arrangement | sequence method of this invention. It is a schematic diagram which shows the example which fixes a light emitting diode element using the material which absorbs a liquid and expand | swells with the element arrangement | sequence method of this invention. It is a top view which shows the shape and arrangement | sequence of a cell formed on an arrangement | sequence board | substrate with the element arrangement | sequence method of this invention. It is a schematic diagram which shows the composite element in which several elements are mounted as an example of the element transcribe | transferred to a cell with the element arrangement | sequence method of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Element formation board | substrate 11 Light emitting diode element 12 Element separation groove | channel 20, 70, 80, 90 Array substrate 21 Base | substrate part 22 Cell division part 23 Cell 24 Element arrangement | positioning hole 25, 41 Electrode 26 Liquid 30 Excimer laser generator 30a, 62 Laser light 31 Mask 32, 64 Opening 33 Reflecting mirror 34, 65 Lens 40 Transparent conductive ink 42 Transparent resin 50 Nozzle 51 Wiper 52 Container 60 Laser generator 61 Rotating mirror 63 Mask 71, 91 Resin layer 72 Water repellent pattern 81 Fixing resin Layer 82 Fixed layer 92 Expansion pattern 100 to 105 Pixel 110 Composite element 111 Minute substrate 112, 113, 114 element

Claims (24)

An element arrangement method for transferring an element arranged on a first substrate onto a second substrate and arranging the element on the second substrate,
A step of forming a cell on the second substrate surface having an element arrangement hole which is a recess for fitting the element at the bottom, and having a structure capable of holding a liquid inside the element arrangement hole. When,
Introducing a liquid into the cell;
Peeling the element formed on the first substrate and transferring it into the cell;
Arranging the elements in the element arrangement hole in a self-aligned manner before removing the liquid in the cell.   The element arrangement according to claim 1, wherein in the step of arranging in the self-alignment, the element is fitted into the element arrangement hole by applying ultrasonic vibration to the second substrate to move the element in the liquid. Method.   2. The element arranging method according to claim 1, wherein in the step of arranging in the self-alignment, the element is fitted into the element arrangement hole by evaporating the liquid while floating the element in the liquid.   The element arranging method according to any one of claims 1 to 3, wherein the cell is a region surrounded by a cell dividing portion which is a convex portion made of a resin formed on a base portion of the second substrate.   The element array method according to claim 1, wherein the cell is a region surrounded by a water-repellent pattern formed on the second substrate.   The element arrangement method according to claim 1, wherein a shape of the element arrangement hole is substantially the same as a shape of a part of the element.   The element arrangement | positioning method in any one of Claims 1-6 which magnetize the said element arrangement | positioning hole or the said element, and control the orientation at the time of the said element fitting to the said element arrangement | positioning hole.   The element arrangement | positioning method in any one of Claims 1-6 which perform the process which changes the wettability with respect to the liquid introduce | transduced in the said cell to the said element arrangement | positioning hole or the surface of the said element.   The element arrangement method according to claim 1, wherein when the elements are peeled from the first substrate and transferred to the cells, the elements on the first substrate are selectively transferred.   The element arraying method according to claim 9, wherein the element is selectively transferred by laser ablation by irradiating an arbitrary position of the first substrate with laser light.   The element arraying method according to claim 10, wherein the first substrate is irradiated with an excimer laser through a mask in which an opening is formed.   The element arraying method according to claim 10, wherein a YAG laser is reflected by a rotating mirror and the laser light is irradiated to the first substrate through a mask. When transferring the element into the cell before introducing the liquid into the cell,
The element arrangement method according to claim 1, wherein the element is transferred after electrostatically removing the element or the second substrate. When transferring the element into the cell before introducing the liquid into the cell,
The element arrangement method according to claim 1, wherein the element is transferred after the element or the second substrate is charged. Forming the cell division part integrally with the resin layer having the element arrangement hole at the bottom in the cell, exposing the surface of the base part to the bottom of the element arrangement hole;
After the element is arranged in the element arrangement hole in the cell by self-alignment and the liquid is removed, the cell is filled with a curable material and cured,
The element arranging method according to claim 4, wherein the base portion constituting the second substrate is then peeled off to expose the element from the back surface of the cell dividing portion.   The element arrangement method according to claim 1, wherein the element is a light emitting element.   The element arrangement method according to claim 1, wherein the element is a composite element on which a plurality of types of elements are mounted. Forming an electrode on a portion of the bottom in the cell;
The element arrangement | positioning method in any one of Claims 1-17 including the process of connecting the said electrode and the said element arrange | positioned in the said element arrangement | positioning hole with an electroconductive material.   The element arranging method according to claim 18, wherein the electrodes are formed as a part of electric wiring extending in a predetermined direction. A fixing resin layer made of a thermoplastic resin or a thermosetting resin is formed including the inside of the element arrangement hole in the cell,
The element is fixed by cooling or heating to a temperature at which the fixing resin layer is cured after the element is arranged in the element arrangement hole by self-alignment to cure the fixing resin layer. The element arrangement | sequence method in any one. An element arrangement method in which a first element arranged on a first substrate and a second element arranged on a second substrate are transferred onto a third substrate and arranged on the third substrate. There,
The surface of the third substrate has an element arrangement hole which is a recess for fitting the first element or the second element at the bottom, and the liquid can be held inside the element arrangement hole. Forming a cell having a structure;
Introducing a liquid into the cell;
Peeling the first element formed on the first substrate and transferring it into the cell;
Peeling the second element formed on the second substrate and transferring it into the cell;
Arranging the first element and the second element in the element arrangement hole in a self-alignment manner before removing the liquid in the cell.   The element arrangement method according to claim 21, wherein the first element and the second element are different types of elements.   23. The element arranging method according to claim 21, wherein the cell to which the first element is transferred and the cell to which the second element is transferred are formed in different regions on the third substrate. An element arrangement having a convex cell dividing portion for dividing a plurality of concave cells on the front surface side, provided on the back surface side corresponding to the plurality of cells, and penetrating from the bottom surface of the cell to the back surface side A resin layer having pores;
A light emitting element disposed in the element arrangement hole of the resin layer;
A first wiring layer disposed on the bottom surface of each of the plurality of cells of the resin layer, connected to the plurality of light emitting elements, and extending in a predetermined direction;
A second wiring layer connected to each of the plurality of light emitting elements and extending in a direction different from the first wiring layer on the back surface of the resin layer ;
The second wiring layer is made of a light-transmitting conductive material;
A display device in which a back surface side of the resin layer is a display surface side .