CN116685053A - Circuit board of LED display device, preparation method of circuit board and LED display device - Google Patents
Circuit board of LED display device, preparation method of circuit board and LED display device Download PDFInfo
- Publication number
- CN116685053A CN116685053A CN202310764278.5A CN202310764278A CN116685053A CN 116685053 A CN116685053 A CN 116685053A CN 202310764278 A CN202310764278 A CN 202310764278A CN 116685053 A CN116685053 A CN 116685053A
- Authority
- CN
- China
- Prior art keywords
- pole
- display device
- led display
- pad
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000011810 insulating material Substances 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910001020 Au alloy Inorganic materials 0.000 claims 1
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- WABPQHHGFIMREM-FTXFMUIASA-N lead-202 Chemical compound [202Pb] WABPQHHGFIMREM-FTXFMUIASA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to a circuit board of an LED display device, a preparation method thereof and the LED display device, wherein the circuit board of the LED display device comprises a first circuit layer and a second circuit layer arranged on the bottom surface of the first circuit layer; the first circuit layer comprises an A electrode pad and a B electrode pad which are not contacted with each other, and an insulating material filled between the A electrode pad and the B electrode pad; the second circuit layer comprises an A pole pin and a B pole pin which are not contacted with each other, and an insulating material filled between the A pole pin and the B pole pin; the A pole pin is in contact with at least one A pole bonding pad, and the B pole pin is in contact with at least one B pole bonding pad. The circuit board of the LED display device is composed of two circuit layers, and the thickness of the circuit board can be greatly reduced due to the unsupported insulating substrate between the two circuit layers.
Description
Technical Field
The invention relates to the technical field of LED display, in particular to a circuit board of an LED display device, a preparation method of the circuit board and the LED display device.
Background
At present, the LED display industry has entered the development stage of micro-spacing, the layout of small-spacing display device products has become a strategy for many LED display device production enterprises, and many LED device structure schemes are also presented in the process of exploring small-spacing development at present, and as the LED display devices are continuously miniaturized, the thickness reduction of circuit boards of the LED display devices is also required.
As shown in fig. 1, at present, a circuit board of an LED display device is generally manufactured by covering an upper metal layer 2 on the top surface of an insulating substrate 1 (BT board), covering a lower metal layer 3 on the bottom surface, etching the upper metal layer 2 to form an anode pad and a cathode pad, etching the lower metal layer to form an anode pin and a cathode pin, and finally providing a conductive via 1a penetrating the top surface and the bottom surface of the insulating substrate on the insulating substrate 1 to electrically connect the pad and the pin, thereby forming a circuit board with a three-layer structure. However, since the circuit board has a three-layer structure, and the insulating substrate located in the middle layer needs to be provided with a certain thickness to ensure the supporting force, even if the thickness of each layer is reduced, the overall thinning degree of the circuit board is still limited, and it is difficult to meet the requirement for miniaturization of the LED display device.
Disclosure of Invention
Accordingly, it is an object of the present invention to provide a wiring board for an LED display device, which is composed of two wiring layers, which omits an insulating substrate used in a conventional wiring board, and which can greatly reduce the thickness of the wiring board.
The invention is realized by the following technical scheme:
a circuit board of an LED display device comprises a first circuit layer and a second circuit layer arranged on the bottom surface of the first circuit layer; the first circuit layer comprises an A electrode pad and a B electrode pad which are not contacted with each other, and an insulating material filled between the A electrode pad and the B electrode pad; the second circuit layer comprises an A pole pin and a B pole pin which are not contacted with each other, and an insulating material filled between the A pole pin and the B pole pin; the A pole pin is in contact with at least one A pole bonding pad, and the B pole pin is in contact with at least one B pole bonding pad.
Compared with the prior art, the circuit board of the LED display device only comprises a two-layer circuit layer structure, and the A electrode pad 101 and the A electrode pin and the B electrode pad and the B electrode pin are in direct contact to realize electric connection, so that an insulating substrate used in the traditional circuit board is omitted, the whole thickness of the circuit board is greatly reduced, and the requirement of microminiaturization of the LED display device is met.
Further, the top surface of the insulating material of the first circuit layer is flush with the top surfaces of the a-pole pad and the B-pole pad.
Further, the top surface of the insulating material of the second circuit layer is flush with the top surfaces of the A pole pin and the B pole pin.
Further, the insulating material is black.
In another aspect, the present invention provides an LED display device, including the circuit board of the LED display device.
In still another aspect, the present invention further provides a method for preparing a circuit board of the LED display device, including the steps of:
covering a layer of conductive material on the top surface of the insulating substrate to form a first circuit layer;
covering a layer of insulating material on the top surface of the first circuit layer;
forming at least two mutually independent grooves in the insulating material, and filling conductive materials in different grooves to form a second circuit layer, wherein the second circuit layer comprises an A pole pin and a B pole pin which are formed in different grooves;
stripping the insulating substrate;
forming at least two bonding pads which are not contacted with each other on the first circuit layer, namely an A electrode bonding pad and a B electrode bonding pad, wherein the A electrode bonding pad is contacted with the A electrode pin, and the B electrode bonding pad is contacted with the B electrode pin;
and filling an insulating material between the A electrode pad and the B electrode pad.
Further, the method for manufacturing the circuit board of the LED display device comprises the following steps after forming the second circuit layer:
a supporting plate is detachably attached to the top surface of the first circuit layer;
and after the first circuit layer forms at least two non-contact A electrode bonding pads and B electrode bonding pads, the following steps are carried out: and stripping the supporting plate.
Further, the conductive material is a metal or alloy of copper, gold, nickel.
Further, the support plate is made of a material having toughness.
Further, the supporting plate is made of steel or glass.
For a better understanding and implementation, the present invention is described in detail below with reference to the drawings.
Drawings
Fig. 1 is a schematic diagram of a circuit board manufacturing method of a conventional LED display device;
FIG. 2 is a schematic diagram of a circuit board of an embodiment of an LED display device of the present invention;
fig. 3 is a flowchart of a first embodiment of a circuit board manufacturing method of the LED display device of the present invention;
fig. 4 is a schematic structural diagram of a circuit board in each step of a first embodiment of a method for manufacturing a circuit board of an LED display device according to the present invention;
FIG. 5 is a flowchart of a second embodiment of a method for fabricating a circuit board of an LED display device according to the present invention;
fig. 6 is a schematic structural diagram of a circuit board in each step of a second embodiment of a method for manufacturing a circuit board of an LED display device according to the present invention;
reference numerals:
1. an insulating substrate of a conventional circuit board; 1a, conducting through holes of a traditional circuit board; 2. an upper metal layer of a conventional circuit board; 3. a lower metal layer of the conventional circuit board;
10. a first circuit layer; 101. an A pole bonding pad; 102. a B electrode bonding pad;
11. an insulating material; 12. a support plate; 13. adhesive glue;
20. a second circuit layer; 201. an A pole pin; 202. and a B pole pin.
Detailed Description
In the description of the present invention, it should be understood that the terms "center," "longitudinal," "transverse," "up," "down," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the invention. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" or "fixedly connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In order to solve the problems that the traditional circuit board with a three-layer structure formed by an upper metal layer, an insulating substrate and a lower metal layer is large in thickness and difficult to meet the microminiaturization requirement of an LED display device, the invention provides an implementation mode of the circuit board of the LED display device, and the circuit board with the original three-layer structure is reduced to a two-layer structure so as to reduce the overall thickness of the circuit board.
Fig. 2 shows a specific structure of one embodiment of a wiring board of an LED display device. As shown in fig. 2, in this embodiment, the wiring board of the LED display device includes a first wiring layer 10 and a second wiring layer 20 provided on the bottom surface of the first wiring layer 10, wherein the first wiring layer 10 includes an a-pole pad 101 and a B-pole pad 102 that are not in contact with each other, and an insulating material 11 filled between the a-pole pad 101 and the B-pole pad 102. Wherein the A electrode pad 101 and the B electrode pad 102 are made of conductive materials, specifically copper; and the insulating material 11 is black to increase the contrast of the wiring board, specifically, the laminate resin. The second wiring layer 20 includes an a-pole pin 201 and a B-pole pin 202 that are not in contact with each other, and an insulating material 11 filled between the a-pole pin 201 and the B-pole pin 202. Wherein the a-pole pin 201 and the B-pole pin 202 are made of conductive materials, specifically copper; the insulating material 11 may be different from or the same as the insulating material 11 of the first wiring layer 10, and in this embodiment, the insulating material 11 of the second wiring layer 20 is the same as the insulating material 11 of the first wiring layer 10. Each a-pole pin 201 contacts an a-pole pad 101 to electrically connect the a-pole pin 201 to the a-pole pad 101; and each B-pole pin 202 is in contact with a B-pole pad 102 such that the B-pole pin 202 is electrically connected to a B-pole pad 102. Of course, each a-pole pin 201 may be in contact with one a-pole pad 101, or may be in contact with a plurality of a-pole pads 101, respectively, to form a common a-pole structure. Similarly, each B-pole lead 202 may be in contact with one B-pole pad 102 or may be in contact with a plurality of B-pole pads 102, respectively, to form a common B-pole structure.
Preferably, the top surface of the insulating material 11 in the first circuit layer 10 is flush with the top surfaces of the a-pole pad 101 and the B-pole pad 102, so as to allow the light emitting chips having the a-pole and the B-pole with opposite polarities and the a-pole and the B-pole being on the same plane to be respectively die-bonded to the a-pole pad 101 and the B-pole pad 102. The top surface of the insulating material 11 in the second circuit layer 20 is flush with the top surfaces of the a-pole pins 201 and the B-pole pads 102, so that the circuit board of the LED display device is mounted on the circuit substrate of the LED display module.
In the circuit board of the LED display device described above, the a-electrode pad 101 may be an anode pad for connection to the anode of the light emitting chip or may be a cathode pad for connection to the cathode of the light emitting chip. When the a-electrode pad 101 is an anode pad, the B-electrode pad 102 is a cathode pad, and the a-electrode pin 201 is an anode pin and the B-electrode pin 202 is a cathode pin.
In addition, based on the circuit board of the LED display device, the invention further provides the LED display device, which comprises the circuit board of the LED display device.
In order to prepare the circuit board of the LED display device, the invention also provides a preparation method of the circuit board of the LED display device. Fig. 3 and 4 show a specific flow of a first embodiment of the preparation method of the invention, comprising the steps of:
s100: covering a layer of conductive material on the top surface of the insulating substrate 1 to form a first circuit layer 10;
s102: covering the top surface of the first circuit layer 10 with a layer of insulating material 11, etching the insulating material 11 into a specific pattern to form at least two mutually independent grooves (not shown), and filling conductive material into the grooves by electroplating to form a second circuit layer 20; wherein the conductive materials in different grooves (not shown) of the second circuit layer 20 form an a-pole pin 201 and a B-pole pin 202 with opposite polarities; the conductive material is specifically copper or an alloy containing copper, and of course, the conductive material may be a metal or an alloy such as gold or nickel;
s104: stripping the insulating substrate 1;
s106: etching the conductive material of the first circuit layer 10 to form a specific pattern to form at least two mutually independent and non-contact A-electrode bonding pads 101 and B-electrode bonding pads 102, wherein the A-electrode bonding pads 101 and the B-electrode bonding pads 102 are specifically copper; wherein, the A electrode pad 101 is contacted with the A electrode pin 201, and the B electrode pad 102 is contacted with the B electrode pin 202;
s108: filling an insulating material 11 between the a-pole pad 101 and the B-pole pad 102;
finally, a wiring board of the LED display device having a two-layer structure of the first wiring layer 10 and the second wiring layer 20 is formed.
Further, since the first wiring layer 10 and the second wiring layer 20 are relatively thin, the first wiring layer 10 and the second wiring layer 20 may be deformed and warped by mechanical force during the peeling of the insulating substrate 1. To avoid this, the present invention provides a second embodiment of the preparation method. Fig. 5 and 6 show a specific flow of the second embodiment of the production method of the present invention (wherein fig. 6 does not show the structure of step S100 in the second embodiment). The production method of the present embodiment differs from the production method of the first embodiment in that: the present embodiment further performs the following steps before step S104:
s103: a supporting plate 12 is detachably attached to the top surface of the first circuit layer 10 through an adhesive 13; the supporting plate 12 is made of a ductile material, specifically a steel material or a glass material, has good toughness and is not easy to break, and can provide enough supporting force for the first circuit layer 10 and the second circuit layer 20, so that deformation and warping of the first circuit layer 10 and the second circuit layer 20 due to the influence of mechanical force are avoided when the insulating substrate 1 is peeled off, and the stability of the preparation process can be enhanced.
Then, after step S108, the following steps are also performed:
s109: stripping support plate 12;
finally, a wiring board of the LED display device having a two-layer structure of the first wiring layer 10 and the second wiring layer 20 is formed.
Wherein the conductive material in step S100 and step S106 is a conductive metal; here, since copper is easily available and low in cost, the conductive material is preferably copper.
Compared with the prior art, the circuit board of the LED display device only comprises a two-layer circuit layer structure, and the A electrode pad 101 and the A electrode pin and the B electrode pad and the B electrode pin are in direct contact to realize electric connection, so that an insulating substrate used in the traditional circuit board is omitted, and the overall thickness of the circuit board is greatly reduced. The ultra-thin circuit board structure design is beneficial to designing an ultra-small-sized LED display device so as to meet the microminiaturization requirement of the LED display device.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the spirit of the invention, and the invention is intended to encompass such modifications and improvements.
Claims (10)
1. The utility model provides a circuit board of LED display device which characterized in that: comprises a first circuit layer (10) and a second circuit layer (20) arranged on the bottom surface of the first circuit layer (10);
the first circuit layer (10) comprises an A-pole pad (101) and a B-pole pad (102) which are not contacted with each other, and an insulating material (11) filled between the A-pole pad (101) and the B-pole pad (102);
the second circuit layer (20) comprises an A pole pin (201) and a B pole pin (202) which are not contacted with each other, and an insulating material (11) filled between the A pole pin (201) and the B pole pin (202);
wherein the A pole pin (201) is in contact with at least one A pole pad (101), and the B pole pin (202) is in contact with at least one B pole pad (102).
2. The wiring board of an LED display device of claim 1, wherein: the top surface of the insulating material (11) of the first circuit layer (10) is flush with the top surfaces of the A-pole pad (101) and the B-pole pad (102).
3. The wiring board of an LED display device of claim 1, wherein: the top surface of the insulating material (11) of the second circuit layer (20) is flush with the top surfaces of the A pole pin (201) and the B pole pin (202).
4. The wiring board of an LED display device of claim 1, wherein:
the insulating material (11) is black.
5. An LED display device, characterized in that: a wiring board comprising the LED display device according to any one of claims 1 to 4.
6. A preparation method of a circuit board for preparing an LED display device is characterized by comprising the following steps: the method comprises the following steps:
covering a layer of conductive material on the top surface of the insulating substrate to form a first circuit layer (10);
covering the top surface of the first circuit layer (10) with a layer of insulating material;
forming at least two mutually independent grooves in the insulating material, and filling conductive materials in the grooves to form a second circuit layer (20), wherein the second circuit layer (20) comprises an A-pole pin (201) and a B-pole pin (202) which are formed in different grooves;
stripping the insulating substrate (1);
forming at least two non-contact bonding pads, namely an A-electrode bonding pad (101) and a B-electrode bonding pad (102), on the first circuit layer (10), wherein the A-electrode bonding pad (101) is in contact with the A-electrode pin (201), and the B-electrode bonding pad (102) is in contact with the B-electrode pin (202);
an insulating material (11) is filled between the A-pole pad (101) and the B-pole pad (102).
7. The method for manufacturing a wiring board for an LED display device according to claim 6, wherein:
after forming the second wiring layer (20), the following steps are performed:
a supporting plate (12) is detachably attached to the top surface of the first circuit layer (10);
after the first circuit layer (10) forms at least two non-contact A electrode bonding pads (101) and B electrode bonding pads (102), the following steps are carried out:
-peeling off the support plate (12).
8. The method for manufacturing a wiring board for an LED display device according to claim 6, wherein:
the conductive material is a metal or alloy of copper, gold and nickel.
9. The method for manufacturing a wiring board for an LED display device according to claim 7, wherein:
the support plate (12) is made of a material having toughness.
10. The method for manufacturing a wiring board for an LED display device according to claim 7, wherein:
the supporting plate (12) is made of steel or glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310764278.5A CN116685053A (en) | 2023-06-26 | 2023-06-26 | Circuit board of LED display device, preparation method of circuit board and LED display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310764278.5A CN116685053A (en) | 2023-06-26 | 2023-06-26 | Circuit board of LED display device, preparation method of circuit board and LED display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116685053A true CN116685053A (en) | 2023-09-01 |
Family
ID=87789046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310764278.5A Pending CN116685053A (en) | 2023-06-26 | 2023-06-26 | Circuit board of LED display device, preparation method of circuit board and LED display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116685053A (en) |
-
2023
- 2023-06-26 CN CN202310764278.5A patent/CN116685053A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7488897B2 (en) | Hybrid multilayer substrate and method for manufacturing the same | |
| TWI290755B (en) | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | |
| US9730328B2 (en) | Printed circuit board with embedded component and method for manufacturing same | |
| CN114556203B (en) | Array substrate, preparation method thereof, display panel and backlight module | |
| WO2018095043A1 (en) | Led package assembly, led module and manufacturing method therefor | |
| US20130029500A1 (en) | Connector and fabrication method thereof | |
| CN117500155B (en) | Frame plate, circuit board assembly, terminal device and manufacturing method of frame plate | |
| US20090168303A1 (en) | Capacitor device with thin interposer | |
| CN102244972A (en) | Circuit board and application thereof | |
| JP3539563B2 (en) | Light-emitting element laminate and display using the same | |
| CN112331639A (en) | Substrate for manufacturing LED light source, manufacturing method and LED light source assembly | |
| CN116685053A (en) | Circuit board of LED display device, preparation method of circuit board and LED display device | |
| JP4118320B1 (en) | Mounting substrate and method of manufacturing thin light emitting device using the same | |
| CN116761331A (en) | Circuit board of LED display device, preparation method of circuit board and LED display device | |
| CN219738945U (en) | Semiconductor packaging structure and packaging assembly | |
| CN217768418U (en) | Mirror surface aluminum substrate and LED light source device | |
| CN213847133U (en) | Reduce multilayer circuit board structure of thickness | |
| WO2019075713A1 (en) | Fingerprint package chip and packaging method, fingerprint module and mobile terminal | |
| CN114025476B (en) | Integrated circuit board structure of electrochemical detection electrode and manufacturing method thereof | |
| CN219350261U (en) | Chip packaging structure | |
| CN113490327B (en) | Flexible circuit structure | |
| KR20040075754A (en) | Capacitor device | |
| WO2024040565A1 (en) | Packaging substrate and manufacturing method therefor, and functional substrate and manufacturing method therefor | |
| US20240243021A1 (en) | Package carrier and manufacturing method thereof and chip package structure | |
| JP3777131B2 (en) | Electronic component mounting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |