JP3127127U - 発光ダイオードスタンド構造 - Google Patents
発光ダイオードスタンド構造 Download PDFInfo
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- JP3127127U JP3127127U JP2006006544U JP2006006544U JP3127127U JP 3127127 U JP3127127 U JP 3127127U JP 2006006544 U JP2006006544 U JP 2006006544U JP 2006006544 U JP2006006544 U JP 2006006544U JP 3127127 U JP3127127 U JP 3127127U
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- light emitting
- electrostatic protection
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- crystal grains
- emitting diode
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- 239000013078 crystal Substances 0.000 claims abstract description 95
- 239000002184 metal Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000004020 conductor Substances 0.000 claims description 7
- 239000003566 sealing material Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000012811 non-conductive material Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 8
- 230000005611 electricity Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 230000006378 damage Effects 0.000 description 3
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 238000009510 drug design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】発光結晶粒と静電気防護結晶粒とを実装するための発光ダイオードスタンド構造であって、正負極である金属スタンドと突出ブロックとが設けられ、発光結晶粒が、その一つの金属スタンド上に固設され、静電気防護結晶粒が、もう一つの金属スタンド上に固設され、突出ブロックが、発光結晶粒と静電気防護結晶粒の間に設けられ、また、突出ブロックの高さが、静電気防護結晶粒より高いため、突出ブロックの高さにより、静電気防護結晶粒を遮蔽でき、そして、発光結晶粒の発光を反射でき、発光結晶粒の反射率が増加されて、発光ダイオードの輝度が有効に増加される。
【選択図】図2
Description
10 カップ体
11、11’ 金属スタンド
20 発光結晶粒
21 導線
30 静電気防護結晶粒
31 導線
40 シーリング材層
[本考案]
50 カップ体
51、51’ 金属スタンド
52 突出ブロック
53 正極
54 負極
60 発光結晶粒
61 第1の導線
70 静電気防護結晶粒
71 第2の導線
80 シーリング材層
511、511’ 突出部
Claims (10)
- 発光結晶粒と静電気防護結晶粒とを実装するための発光ダイオードスタンド構造であって、
二つの金属スタンドを有し、前記発光結晶粒がその一つの金属スタンド上に固設され、前記静電気防護結晶粒がもう一つの金属スタンド上に固設され、
前記発光結晶粒と前記静電気防護結晶粒の間に設けられ前記突出ブロックの高さが前記静電気防護結晶粒より高い突出ブロックと、を備えることを特徴とする発光ダイオードスタンド構造。 - 前記二つの金属スタンドがカップ体内に固設され、また、前記突出ブロックが前記カップ体内に設けられることを特徴とする請求項1に記載の発光ダイオードスタンド構造。
- 前記カップ体内に位置する発光結晶粒と静電気防護結晶粒とは、一層の透過性のシーリング材層により覆われることを特徴とする請求項2に記載の発光ダイオードスタンド構造。
- 前記カップ体と前記突出ブロックとは、高分子非導電性材料からなることを特徴とする請求項2に記載の発光ダイオードスタンド構造。
- 前記突出ブロックの高さが前記カップ体の上端と一致し、前記二つの金属スタンドの一端がそれぞれ前記突出ブロックを貫通して突出部を形成し、前記二つの突出部がそれぞれ突出ブロックの両側に延び出し、前記二つの突出部が導線により前記発光結晶粒と前記静電気防護結晶粒に接続されることを特徴とする請求項2に記載の発光ダイオードスタンド構造。
- 前記発光結晶粒は絶縁方式によりその一つの金属スタンド上に固設され、前記二つの金属スタンドと前記発光結晶粒とが導線により接続されることを特徴とする請求項1に記載の発光ダイオードスタンド構造。
- 前記静電気防護結晶粒は絶縁方式によりその一つの金属スタンド上に固設され、前記静電気防護結晶粒と前記二つの金属スタンドとが導線により接続されることを特徴とする請求項1に記載の発光ダイオードスタンド構造。
- 前記静電気防護結晶粒は半だ付け方式によりその一つの金属スタンド上に固設され、前記静電気防護結晶粒ともう一つの前記金属スタンドとが導線により接続されることを特徴とする請求項1に記載の発光ダイオードスタンド構造。
- 前記二つの金属スタンドの一端がそれぞれ前記突出ブロックを貫通して突出部を形成し、前記二つの突出部がそれぞれ突出ブロックの両側に延び出し、また、導線により前記発光結晶粒と前記静電気防護結晶粒とに接続されることを特徴とする請求項1に記載の発光ダイオードスタンド構造。
- 前記突出ブロックは、反射率が前記静電気防護結晶粒より高い材料であることを特徴とする請求項1に記載の発光ダイオードスタンド構造。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095210311U TWM302123U (en) | 2006-06-13 | 2006-06-13 | The stand structure of light-emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3127127U true JP3127127U (ja) | 2006-11-24 |
Family
ID=38221284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006006544U Expired - Lifetime JP3127127U (ja) | 2006-06-13 | 2006-08-11 | 発光ダイオードスタンド構造 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7714347B2 (ja) |
JP (1) | JP3127127U (ja) |
TW (1) | TWM302123U (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9061450B2 (en) * | 2007-02-12 | 2015-06-23 | Cree, Inc. | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
JP5114773B2 (ja) * | 2007-08-10 | 2013-01-09 | スタンレー電気株式会社 | 表面実装型発光装置 |
DE102008016534A1 (de) * | 2008-03-31 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements |
JP2012019062A (ja) * | 2010-07-08 | 2012-01-26 | Shin Etsu Chem Co Ltd | 発光半導体装置、実装基板及びそれらの製造方法 |
JP2012104739A (ja) * | 2010-11-12 | 2012-05-31 | Toshiba Corp | 発光素子 |
FR2973573A1 (fr) * | 2011-04-01 | 2012-10-05 | St Microelectronics Grenoble 2 | Boitier semi-conducteur comprenant un dispositif semi-conducteur optique |
KR101852388B1 (ko) * | 2011-04-28 | 2018-04-26 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
CN103000782B (zh) * | 2011-09-13 | 2016-09-07 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
DE102012101560B4 (de) * | 2011-10-27 | 2016-02-04 | Epcos Ag | Leuchtdiodenvorrichtung |
WO2015117273A1 (en) * | 2014-02-08 | 2015-08-13 | Cree Huizhou Solid State Lighting Company Limited | Smart pixel surface mount device package |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
USD453745S1 (en) * | 1999-12-27 | 2002-02-19 | Nichia Corporation | Light emitting diode |
DE10041686A1 (de) * | 2000-08-24 | 2002-03-14 | Osram Opto Semiconductors Gmbh | Bauelement mit einer Vielzahl von Lumineszenzdiodenchips |
US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
USD490387S1 (en) * | 2001-11-22 | 2004-05-25 | Nichia Corporation | Light emitting diode |
USD534505S1 (en) * | 2001-12-28 | 2007-01-02 | Nichia Corporation | Light emitting diode |
US20070063213A1 (en) * | 2005-09-21 | 2007-03-22 | Lighthouse Technology Co., Ltd. | LED package |
-
2006
- 2006-06-13 TW TW095210311U patent/TWM302123U/zh not_active IP Right Cessation
- 2006-08-11 JP JP2006006544U patent/JP3127127U/ja not_active Expired - Lifetime
- 2006-09-12 US US11/518,936 patent/US7714347B2/en active Active
-
2010
- 2010-02-09 US US12/702,574 patent/US8084779B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20070284605A1 (en) | 2007-12-13 |
TWM302123U (en) | 2006-12-01 |
US8084779B2 (en) | 2011-12-27 |
US7714347B2 (en) | 2010-05-11 |
US20100133576A1 (en) | 2010-06-03 |
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