JP3013544B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device.

[0002]

2. Description of the Related Art FIG. 5 shows a prior art hybrid integrated circuit device using an organic substrate. 5A is a top view, and FIG. 5B is a cross-sectional view taken along line EE of FIG. As shown in FIG. 5, a passive element or an active element 6 is mounted on a substrate 2 having a circuit pattern 13 using an adhesive, and a circuit connection is made to a terminal wiring 3 using a thin metal wire 5 or the like. Resin sealing. However, in order to prevent the resin 4 from flowing out, a resin frame (1.0 mm in width) for stopping the flow is placed on the circuit board 2.
X height 1.0 mm etc. ) Or printing frame (width 0.5m)
mx height 0.2 mm etc. ) 10 is provided. In the case of a double-sided mounting structure, as shown in FIG. 6, an adhesive is used for the double-sided pattern of the substrate 2 having the circuit patterns 13 on both sides, and the passive element or the active element 6 is mounted and the circuit connection is performed using the thin metal wire 5 or the like. And the resin 4
Resin sealing. Also in this structure, to prevent the resin 4 from flowing out, a resin frame (width 1.0 mm × height 1.0 mm etc.) or a printing frame (width 0.5 mm × height) is provided on both sides of the circuit board 2 for preventing flow. 0.2 mm etc.) 10 is provided. In addition, in FIG. 6, the FF section of the top view (A) is a sectional view (B). As shown in FIGS. 5 and 6, the position of the resin frame 10 is arranged inside each of the terminal lands 3 of the external lead 1.

[0003]

The conventional hybrid integrated circuit device has a structure in which a resin frame or a printed frame for preventing the leakage of the sealing resin is provided inside the terminal lands for attaching external leads. Space for resin frame or printing frame is required. Therefore, the effective area of the hybrid integrated circuit is reduced. As a result, there is a problem that it is very difficult to achieve high functionality, high integration, miniaturization, and the like. The effective area and the non-effective area (the area required for the resin frame or the printing frame) in FIGS. 5 and 6 are as follows. In FIG. 5, the effective area is a × h, and the ineffective area is (a + 2b) × (h + 2
This is the area obtained by subtracting a × b from d). In addition, in FIG. 6, this ineffective area is on both sides, and is twice as large as that in FIG.

[0004]

The hybrid integrated circuit device of the present invention has a structure in which terminal lands for attaching external leads are used in place of a resin frame or printed frame for preventing resin outflow. Therefore, there is no resin frame or print frame inside the terminal lands for external leads. Features of the present invention
In other words, in a hybrid integrated circuit device in which elements are mounted on the element mounting surface of the substrate, sealed with a sealing resin, and external leads are connected to the substrate terminals, the element mounting surface of the substrate is surrounded by side walls,
The upper surface of the side wall is a substrate terminal land surface higher than the element mounting surface, a substrate terminal land is provided on the substrate terminal land surface, and a through hole land connected to the substrate terminal land is provided in a through hole penetrating the side wall. In the hybrid integrated circuit device, an external lead is connected to a lower end of the through-hole land to prevent the sealing resin from flowing out.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a plan view (A) showing a technique related to the present invention.
And a sectional view (B). Terminal lands 23 are provided on a substrate 22 on which a circuit pattern (not shown) is formed. The terminal lands 23 have a flow preventing structure when the resin 24 is sealed with the resin. The external lands 21 are connected to the terminal lands 23 by solder or conductive adhesive. A passive element or an active element 26 or the like is fixed on the circuit pattern with an adhesive, and the circuit connection is performed by a thin metal wire 25 or the like. Thereafter, resin sealing is performed with the resin 24.

FIG. 2 is a plan view (A) and a sectional view (B) showing another technique related to the present invention. Terminal lands 23 are provided on both surfaces of a substrate 22 having a circuit pattern (not shown) formed on both surfaces. The terminal lands 23 have a flow preventing structure when the resin 24 is sealed with the resin. The external lands 2 are formed on the terminal lands 23 by soldering or conductive adhesive.
1 are connected. On the circuit patterns on both sides, a passive element or an active element 26 or the like is fixed with an adhesive, and circuit connection is performed by a thin metal wire 25 or the like. Then, the resin 24
Resin sealing.

FIG. 3 is a plan view (A) and a sectional view (B) showing a first embodiment of the present invention.

An external lead 31 is connected to a substrate 32 on which a circuit pattern (not shown) is formed by using a through-hole plating method (L / F through-hole 8). The through-hole 7 itself also serves as a terminal land 33. It has a structure. In addition, the through hole land 9 has a structure that prevents the resin 24 from flowing out. A passive element or an active element 26 or the like is fixed on the circuit pattern with an adhesive, and the circuit connection is performed by a thin metal wire 25 or the like. Thereafter, resin sealing is performed with the resin 24.

FIG. 4 is a plan view (A) and a sectional view (B) showing a second embodiment of the present invention.

An external lead 31 is connected to a substrate 32 having a circuit pattern (not shown) formed on both sides by using a through-hole plating method (L / F through-hole 8). The structure serves also as the terminal land 33. Further, the through hole land 9 has a structure that functions to prevent the resin 4 from flowing out. On the circuit patterns on both sides, a passive element or an active element 26 is fixed with an adhesive, and the circuit is connected by a thin metal wire 25 or the like. Thereafter, resin sealing is performed with the resin 24. As described above, in any of the structures of the first to fourth embodiments, the resin frame or the printing frame for preventing the leakage of the sealing resin is unnecessary, and the terminal lands are used as the leakage prevention frames instead.

[0011]

As described above, the present invention has a structure in which the terminal land is used as a leakage prevention frame instead of providing a resin frame or a printing frame for preventing the sealing resin from flowing out. The space in which the resin frame or the printing frame is to be provided can also be effectively utilized as a space constituting the hybrid integrated circuit device. Therefore, it is effective for high integration, high functionality, miniaturization, and the like of the hybrid integrated circuit device. In addition, since the number of components (resin, frame material, manufacturing process, etc.) can be reduced, improvement in quality can be expected.

[Brief description of the drawings]

1A and 1B are a plan view and a cross-sectional view illustrating a technique related to the present invention.

FIG. 2 is a plan view and a cross-sectional view showing another technique related to the present invention.

FIG. 3 is a plan view and a sectional view showing a first embodiment of the present invention.

FIG. 4 is a plan view and a sectional view showing a second embodiment of the present invention.

FIG. 5 is a plan view and a cross-sectional view showing a conventional technique.

FIG. 6 is a plan view and a sectional view showing another conventional technique.

[Explanation of symbols]

 1,21,31 External lead 2,22,32 Substrate 3,23,33 Terminal land 4,24 Resin 5,25 Fine metal wire 6,26 Passive and active element 7 Through hole 8 L / F through hole 9 Through hole land 10 Resin frame or print frame a Effective dimension b Non-effective dimension d Non-effective dimension h Effective dimension

Claims (2)

(57) [Claims] In a hybrid integrated circuit device in which an element is mounted on an element mounting surface of a substrate, sealed with a sealing resin, and an external lead is connected to a substrate terminal, the element mounting surface of the substrate is provided with a side wall. Surrounding the upper surface of the side wall as a substrate terminal land surface higher than the element mounting surface, providing a substrate terminal land on the substrate terminal land surface, and connecting a through hole land connected to the substrate terminal land to a through hole passing through the side wall. Provided in
Connect an external lead to the lower end of the through hole land,
A hybrid integrated circuit device having a structure that prevents the sealing resin from flowing out. 2. The device mounting surface on both sides of the substrate,
2. The hybrid integrated circuit device according to claim 1 , wherein said side wall, said substrate terminal land surface, said substrate terminal land, and said through-hole land are provided respectively.