JPH0582673A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To effectively use a space and miniaturize a device by a method wherein a substrate terminal land plane of the substrate is provided higher than a mounting plate of a passive element, an active element, or the like so that sealing resin can be prevented from flowing out. CONSTITUTION:A terminal land 23 is provided on a substrate 22 in which a circuit pattern is formed. The terminal land 23 has a flowing-out prevention structure at resin-sealing resin 24. Also, the terminal land 23 is connected to an external lead 21 by solder, conductive adhesive or the like. Namely, the terminal land 23 plane of the substrate 22 is provided higher than the mounting plate of passive elements, active elements 26 or the like, and a resin frame or a printing frame for preventing the sealing resin from flowing out is not provided and instead of that such a structure as the flowing-out prevention frame of the terminal land 23 is provide. Thus, a space for providing the resin frame or the printing frame within the terminal land 23 can also effectively be used as a space constituting a hybrid integrated circuit device, so that it can be effective in miniaturizing the device or the like.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a hybrid integrated circuit device.

[0002]

2. Description of the Related Art A prior art hybrid integrated circuit device using an organic substrate is shown in FIG. In FIG. 5, (A) is a top view and (B) is a sectional view taken along line EE of (A). As shown in FIG. 5, an adhesive is used on a substrate 2 having a circuit pattern 13, a passive element or an active element 6 is mounted, and a circuit connection is made to a terminal wiring 3 using a thin metal wire 5 or the like, and a resin 4 is used. It is resin-sealed. However, in order to prevent the resin 4 from flowing out, a resin frame (width 1.0 mm) for preventing flow is provided on the circuit board 2.
× Height 1.0 mm etc. ) Or printing frame (width 0.5m
m × height 0.2 mm etc. ) 10 is provided. Further, in the case of the double-sided mounting structure, as shown in FIG. 6, an adhesive is used for the double-sided pattern of the substrate 2 having the circuit patterns 13 on both sides, and the passive element or the active element 6 is mounted and the circuit connection is made by using the thin metal wire 5 or the like. And resin 4
Is resin-sealed. Also in this structure, in order to prevent the resin 4 from flowing out, a resin frame (width 1.0 mm x height 1.0 mm etc.) or a printing frame (width 0.5 mm x height) is provided on both sides of the circuit board 2 for preventing flow. 0.2 mm etc.) 10 is provided. In addition, in FIG. 6, the FF cross section of the top view (A) is a sectional view (B). As shown in FIGS. 5 and 6, the resin frame 10 is located inside each of the terminal lands 3 of the external leads 1.

[0003]

This conventional hybrid integrated circuit device has a structure in which a resin frame or a printing frame for preventing the outflow of the sealing resin is provided inside the external lead mounting terminal land. Space for resin frame or printing frame is required. Therefore, the effective area constituting the hybrid integrated circuit is reduced. As a result, there has been a problem that it is very difficult to achieve high functionality, high integration, and miniaturization. The effective area and the non-effective area (the area required for the resin frame or the printing frame) in FIGS. 5 and 6 are as follows. In FIG. 5, the effective area is a × h, and the ineffective area is (a + 2b) × (h + 2
It is the area obtained by subtracting a × b from d). Further, in FIG. 6, since this non-effective area is on both sides, it is twice as large as that in FIG.

[0004]

The hybrid integrated circuit device of the present invention has a structure in which a terminal land for attaching an external lead is used in place of a resin frame or a printing frame for preventing resin outflow. Therefore, there is no resin frame or printing frame inside the terminal land for external leads.

[0005]

The present invention will be described below with reference to the drawings. FIG. 1 is a plan view (A) showing a first embodiment of the present invention.
It is a sectional view (B). Terminal lands 23 are provided on a substrate 22 on which a circuit pattern (not shown) is formed. The terminal land 23 has a flow prevention structure when the resin 24 is sealed with the resin. The external leads 21 are connected to the terminal lands 23 by solder, conductive adhesive, or the like. A passive element or an active element 26 or the like is fixed on the circuit pattern with an adhesive, and the metal thin wire 25 or the like is used for circuit connection. After that, resin sealing is performed with the resin 24.

FIG. 2 is a plan view (A) and a sectional view (B) showing a second embodiment of the present invention. Terminal lands 23 are provided on both surfaces of a substrate 22 having circuit patterns (not shown) formed on both surfaces. This terminal land 23 is made of resin 24
It has a flow prevention structure when the resin is sealed. The external leads 21 are connected to the terminal lands 23 by solder, conductive adhesive, or the like. A passive element or an active element 26 or the like is fixed on the circuit patterns on both sides with an adhesive, and the metal fine wire 2
5. Connect the circuit by 5 etc. After that, resin sealing is performed with the resin 24.

FIG. 3 is a plan view (A) and a sectional view (B) showing a third embodiment of the present invention.

An external lead 31 is connected to a substrate 32 having a circuit pattern (not shown) formed by using a through hole plating method (L / F through hole 8). The through hole 7 itself also serves as the terminal land 33. It has a structure. Further, the through hole land 9 serves as a structure for preventing the resin 24 from flowing out. A passive element or active element 26 or the like is fixed on the circuit pattern with an adhesive, and a circuit is connected by a metal thin wire 25 or the like. After that, resin sealing is performed with the resin 24.

FIG. 4 is a plan view (A) and a sectional view (B) showing a fourth embodiment of the present invention.

External leads 31 are connected to a substrate 32 having circuit patterns (not shown) formed on both sides by using a through hole plating method (L / F through holes 8), and the through holes 7 themselves are formed on both sides. The structure also serves as the terminal land 33. Further, the through hole land 9 serves as a structure for preventing the resin 4 from flowing out. Passive elements or active elements 26 are fixed on the circuit patterns on both sides with an adhesive, and the circuits are connected by metal thin wires 25 or the like. After that, resin sealing is performed with the resin 24. As described above, in any of the structures of the first to fourth embodiments, the resin frame or the printing frame for preventing the outflow of the sealing resin is unnecessary, and the terminal land is used as the outflow prevention frame instead.

[0011]

As described above, according to the present invention, the resin land or the printing frame for preventing the outflow of the sealing resin is not provided, but instead the terminal land is used as the outflow prevention frame. The space where the resin frame or the printing frame is to be provided can also be effectively used as a space for forming the hybrid integrated circuit device. Therefore, it is effective for high integration, high functionality, miniaturization, etc. of the hybrid integrated circuit device. Further, since the number of constituent elements (resin, frame material, manufacturing process, etc.) can be reduced, quality improvement can be expected.

[Brief description of drawings]

FIG. 1 is a plan view and a cross-sectional view showing a first embodiment of the present invention.

2A and 2B are a plan view and a sectional view showing a second embodiment of the present invention.

FIG. 3 is a plan view and a sectional view showing a third embodiment of the present invention.

FIG. 4 is a plan view and a sectional view showing a fourth embodiment of the present invention.

FIG. 5 is a plan view and a cross-sectional view showing a conventional technique.

FIG. 6 is a plan view and a cross-sectional view showing another conventional technique.

[Explanation of symbols]

 1,2,31 External lead 2,22,32 Substrate 3,23,33 Terminal land 4,24 Resin 5,25 Metal fine wire 6,26 Passive and active element 7 Through hole 8 L / F through hole 9 Through hole land 10 Resin frame or printing frame a Effective dimension b Ineffective dimension d Ineffective dimension h Effective dimension

Claims (1)

[Claims] 1. A hybrid integrated circuit device in which a passive element, an active element, etc. are mounted on an organic substrate, sealed with a sealing resin, and external leads are connected to a substrate terminal land. A hybrid integrated circuit device having a structure in which a land surface is made higher than a mounting surface for passive elements, active elements, etc., thereby preventing the sealing resin from flowing out.