JP2866167B2 - 接着された接触を有する多層トランスデューサおよびその接着方法 - Google Patents

接着された接触を有する多層トランスデューサおよびその接着方法

Info

Publication number
JP2866167B2
JP2866167B2 JP2217992A JP21799290A JP2866167B2 JP 2866167 B2 JP2866167 B2 JP 2866167B2 JP 2217992 A JP2217992 A JP 2217992A JP 21799290 A JP21799290 A JP 21799290A JP 2866167 B2 JP2866167 B2 JP 2866167B2
Authority
JP
Japan
Prior art keywords
transducer
contact area
wafer
electrical contact
vertical surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2217992A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03104167A (ja
Inventor
アリ・レート
ユーア・ラーデンペレ
ヘイキ・クイスマ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vaisala Oy
Original Assignee
Vaisala Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vaisala Oy filed Critical Vaisala Oy
Publication of JPH03104167A publication Critical patent/JPH03104167A/ja
Application granted granted Critical
Publication of JP2866167B2 publication Critical patent/JP2866167B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Measuring Fluid Pressure (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Light Receiving Elements (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP2217992A 1989-08-17 1990-08-17 接着された接触を有する多層トランスデューサおよびその接着方法 Expired - Fee Related JP2866167B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI893874 1989-08-17
FI893874A FI893874A7 (fi) 1989-08-17 1989-08-17 Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen.

Publications (2)

Publication Number Publication Date
JPH03104167A JPH03104167A (ja) 1991-05-01
JP2866167B2 true JP2866167B2 (ja) 1999-03-08

Family

ID=8528855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2217992A Expired - Fee Related JP2866167B2 (ja) 1989-08-17 1990-08-17 接着された接触を有する多層トランスデューサおよびその接着方法

Country Status (11)

Country Link
US (1) US5083234A (https=)
JP (1) JP2866167B2 (https=)
CH (1) CH681581A5 (https=)
DE (1) DE4023776C2 (https=)
ES (1) ES2023345A6 (https=)
FI (1) FI893874A7 (https=)
FR (1) FR2651069B1 (https=)
GB (1) GB2235090B (https=)
IT (1) IT1241544B (https=)
NO (1) NO307488B1 (https=)
SE (1) SE508914C2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930011143A (ko) * 1991-11-14 1993-06-23 김광호 반도체장치 및 그 제조방법
CA2115947A1 (en) * 1993-03-03 1994-09-04 Gregory C. Smith Wafer-like processing after sawing dmds
DE4321804A1 (de) * 1993-06-30 1995-01-12 Ranco Inc Verfahren zur Herstellung von Kleinbauelementen
US5912796A (en) * 1996-11-15 1999-06-15 Illinois Tool Works, Inc. Metallized film capacitor and manufacturing process
DE10309869A1 (de) * 2003-03-06 2004-09-23 Infineon Technologies Ag Verfahren zur Herstellung mindestens eines Halbleiterchips und Halbleiterchip
DE10321214A1 (de) * 2003-05-12 2004-12-30 Infineon Technologies Ag Verfahren zum Aufbringen elektrischer Kontaktierungselemente auf einen Chip eines Chip-Wafers und Chip
DE10326804A1 (de) * 2003-06-13 2004-11-18 Infineon Technologies Ag Verfahren zur Herstellung mindestens eines Halbleiterchips und Halbleiterchip
DE10334634B3 (de) * 2003-07-29 2005-01-13 Infineon Technologies Ag Verfahren zum seitlichen Kontaktieren eines Halbleiterchips
DE10334633A1 (de) * 2003-07-29 2004-10-07 Infineon Technologies Ag Verfahren zur Herstellung einer Anordnung mit zwei Halbleiterchips und Anordnung mit zwei Halbleiterchips
TWI559349B (zh) * 2014-10-28 2016-11-21 鈺邦科技股份有限公司 導電端子改良之固態電解電容器封裝結構之製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL128146C (https=) * 1963-03-05
GB1115259A (en) * 1966-05-20 1968-05-29 Gen Dynamics Corp Load measuring system
GB1342468A (en) * 1969-10-16 1974-01-03 Chubb Alarms Mfg Ltd Security detection systems
GB1533191A (en) * 1977-03-30 1978-11-22 G Ni I P I Redkometallich Prom Pressure-sensitive semiconductor bodies and pressure-sensitive devices including such bodies
US4267634A (en) * 1978-04-05 1981-05-19 American Components Inc. Method for making a chip circuit component
US4386453A (en) * 1979-09-04 1983-06-07 Ford Motor Company Method for manufacturing variable capacitance pressure transducers
JPS58159360A (ja) * 1982-03-17 1983-09-21 Fujitsu Ltd 半導体装置
EP0094078B1 (en) * 1982-05-11 1988-11-02 Nec Corporation Multilayer electrostrictive element which withstands repeated application of pulses
FI842307A7 (fi) * 1984-06-07 1985-12-08 Vaisala Oy Menetelmä läpiviennin aikaansaamiseksi mikromekaaniseen rakenteeseen.
JPS6127688A (ja) * 1984-07-02 1986-02-07 Nec Corp 電歪効果素子およびその製造方法
IL82960A0 (en) * 1986-06-30 1987-12-20 Rosemount Inc Differential pressure sensor
JPS63149531A (ja) * 1986-12-12 1988-06-22 Fuji Electric Co Ltd 静電容量式圧力センサ
JPH061228B2 (ja) * 1987-08-13 1994-01-05 富士電機株式会社 静電容量式圧力検出器
DE3727142C2 (de) * 1987-08-14 1994-02-24 Kernforschungsz Karlsruhe Verfahren zur Herstellung von Mikrosensoren mit integrierter Signalverarbeitung
FI78784C (fi) * 1988-01-18 1989-09-11 Vaisala Oy Tryckgivarkonstruktion och foerfarande foer framstaellning daerav.

Also Published As

Publication number Publication date
US5083234A (en) 1992-01-21
IT1241544B (it) 1994-01-17
DE4023776A1 (de) 1991-02-21
GB9017035D0 (en) 1990-09-19
IT9048226A0 (it) 1990-08-14
JPH03104167A (ja) 1991-05-01
NO903622L (no) 1991-02-18
SE9002663L (sv) 1991-02-18
GB2235090B (en) 1993-11-17
SE508914C2 (sv) 1998-11-16
SE9002663D0 (sv) 1990-08-15
ES2023345A6 (es) 1992-01-01
CH681581A5 (https=) 1993-04-15
NO903622D0 (no) 1990-08-16
FI893874A0 (fi) 1989-08-17
IT9048226A1 (it) 1992-02-14
FI893874A7 (fi) 1991-02-18
GB2235090A (en) 1991-02-20
NO307488B1 (no) 2000-04-10
DE4023776C2 (de) 2003-07-03
FR2651069A1 (fr) 1991-02-22
FR2651069B1 (fr) 1998-04-03

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