FI893874A0 - Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen. - Google Patents

Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen.

Info

Publication number
FI893874A0
FI893874A0 FI893874A FI893874A FI893874A0 FI 893874 A0 FI893874 A0 FI 893874A0 FI 893874 A FI893874 A FI 893874A FI 893874 A FI893874 A FI 893874A FI 893874 A0 FI893874 A0 FI 893874A0
Authority
FI
Finland
Prior art keywords
skiktstruktur
kontaktfoersedd
kontakteringen
givare
med
Prior art date
Application number
FI893874A
Other languages
English (en)
Other versions
FI893874A (fi
Inventor
Ari Lehto
Juha Lahdenperae
Heikki Kuisma
Original Assignee
Vaisala Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of FI893874A0 publication Critical patent/FI893874A0/fi
Priority to FI893874A priority Critical patent/FI893874A/fi
Application filed by Vaisala Oy filed Critical Vaisala Oy
Priority to US07/553,597 priority patent/US5083234A/en
Priority to DE4023776A priority patent/DE4023776C2/de
Priority to ES9002096A priority patent/ES2023345A6/es
Priority to GB9017035A priority patent/GB2235090B/en
Priority to CH2599/90A priority patent/CH681581A5/de
Priority to FR9010329A priority patent/FR2651069B1/fr
Priority to IT48226A priority patent/IT1241544B/it
Priority to SE9002663A priority patent/SE508914C2/sv
Priority to FI904050A priority patent/FI106754B/fi
Priority to NO903622A priority patent/NO307488B1/no
Priority to JP2217992A priority patent/JP2866167B2/ja
Publication of FI893874A publication Critical patent/FI893874A/fi

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Measuring Fluid Pressure (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Light Receiving Elements (AREA)
FI893874A 1989-08-17 1989-08-17 Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen. FI893874A (fi)

Priority Applications (12)

Application Number Priority Date Filing Date Title
FI893874A FI893874A (fi) 1989-08-17 1989-08-17 Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen.
US07/553,597 US5083234A (en) 1989-08-17 1990-07-18 Multilayer transducer with bonded contacts and method for implementation of bonding
DE4023776A DE4023776C2 (de) 1989-08-17 1990-07-26 Mehrschichtige Halbleiterstruktur, insbesondere Wandler und Verfahren zur Bildung von Kontaktflächen an Halbleiterbereichen solcher mehrschichtiger Halbleiterstrukturen
ES9002096A ES2023345A6 (es) 1989-08-17 1990-08-02 Transductor multicapa con contactos postizos y metodo para la incorporacion de dichos contactos.
GB9017035A GB2235090B (en) 1989-08-17 1990-08-03 Multilayer semi-conductor elements and their manufacture
CH2599/90A CH681581A5 (fi) 1989-08-17 1990-08-09
IT48226A IT1241544B (it) 1989-08-17 1990-08-14 Trasduttore con contatti solidali e metodo per formare detti contatti
FR9010329A FR2651069B1 (fr) 1989-08-17 1990-08-14 Transducteur multicouches a contacts lies et procedes de realisation de la liaison
SE9002663A SE508914C2 (sv) 1989-08-17 1990-08-15 Mikrodrivanordning
FI904050A FI106754B (fi) 1989-08-17 1990-08-16 Kontaktoitu kerrosrakenteinen anturi sekä menetelmä kontaktoinnin toteuttamiseksi
NO903622A NO307488B1 (no) 1989-08-17 1990-08-16 Flersjiktstransduser med põsveisete kontaktforbindelser
JP2217992A JP2866167B2 (ja) 1989-08-17 1990-08-17 接着された接触を有する多層トランスデューサおよびその接着方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI893874A FI893874A (fi) 1989-08-17 1989-08-17 Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen.

Publications (2)

Publication Number Publication Date
FI893874A0 true FI893874A0 (fi) 1989-08-17
FI893874A FI893874A (fi) 1991-02-18

Family

ID=8528855

Family Applications (1)

Application Number Title Priority Date Filing Date
FI893874A FI893874A (fi) 1989-08-17 1989-08-17 Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen.

Country Status (11)

Country Link
US (1) US5083234A (fi)
JP (1) JP2866167B2 (fi)
CH (1) CH681581A5 (fi)
DE (1) DE4023776C2 (fi)
ES (1) ES2023345A6 (fi)
FI (1) FI893874A (fi)
FR (1) FR2651069B1 (fi)
GB (1) GB2235090B (fi)
IT (1) IT1241544B (fi)
NO (1) NO307488B1 (fi)
SE (1) SE508914C2 (fi)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930011143A (ko) * 1991-11-14 1993-06-23 김광호 반도체장치 및 그 제조방법
CA2115947A1 (en) * 1993-03-03 1994-09-04 Gregory C. Smith Wafer-like processing after sawing dmds
DE4321804A1 (de) * 1993-06-30 1995-01-12 Ranco Inc Verfahren zur Herstellung von Kleinbauelementen
US5912796A (en) * 1996-11-15 1999-06-15 Illinois Tool Works, Inc. Metallized film capacitor and manufacturing process
DE10309869A1 (de) * 2003-03-06 2004-09-23 Infineon Technologies Ag Verfahren zur Herstellung mindestens eines Halbleiterchips und Halbleiterchip
DE10321214A1 (de) * 2003-05-12 2004-12-30 Infineon Technologies Ag Verfahren zum Aufbringen elektrischer Kontaktierungselemente auf einen Chip eines Chip-Wafers und Chip
DE10326804A1 (de) * 2003-06-13 2004-11-18 Infineon Technologies Ag Verfahren zur Herstellung mindestens eines Halbleiterchips und Halbleiterchip
DE10334633A1 (de) * 2003-07-29 2004-10-07 Infineon Technologies Ag Verfahren zur Herstellung einer Anordnung mit zwei Halbleiterchips und Anordnung mit zwei Halbleiterchips
DE10334634B3 (de) * 2003-07-29 2005-01-13 Infineon Technologies Ag Verfahren zum seitlichen Kontaktieren eines Halbleiterchips
TWI559349B (zh) * 2014-10-28 2016-11-21 鈺邦科技股份有限公司 導電端子改良之固態電解電容器封裝結構之製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL128146C (fi) * 1963-03-05
GB1115259A (en) * 1966-05-20 1968-05-29 Gen Dynamics Corp Load measuring system
GB1342468A (en) * 1969-10-16 1974-01-03 Chubb Alarms Mfg Ltd Security detection systems
GB1533191A (en) * 1977-03-30 1978-11-22 G Ni I P I Redkometallich Prom Pressure-sensitive semiconductor bodies and pressure-sensitive devices including such bodies
US4267634A (en) * 1978-04-05 1981-05-19 American Components Inc. Method for making a chip circuit component
US4386453A (en) * 1979-09-04 1983-06-07 Ford Motor Company Method for manufacturing variable capacitance pressure transducers
JPS58159360A (ja) * 1982-03-17 1983-09-21 Fujitsu Ltd 半導体装置
EP0094078B1 (en) * 1982-05-11 1988-11-02 Nec Corporation Multilayer electrostrictive element which withstands repeated application of pulses
FI842307A (fi) * 1984-06-07 1985-12-08 Vaisala Oy Foerfarande foer aostadkommande av genomfoering i en mikromekanisk konstruktion.
JPS6127688A (ja) * 1984-07-02 1986-02-07 Nec Corp 電歪効果素子およびその製造方法
IL82960A0 (en) * 1986-06-30 1987-12-20 Rosemount Inc Differential pressure sensor
JPS63149531A (ja) * 1986-12-12 1988-06-22 Fuji Electric Co Ltd 静電容量式圧力センサ
JPH061228B2 (ja) * 1987-08-13 1994-01-05 富士電機株式会社 静電容量式圧力検出器
DE3727142C2 (de) * 1987-08-14 1994-02-24 Kernforschungsz Karlsruhe Verfahren zur Herstellung von Mikrosensoren mit integrierter Signalverarbeitung
FI78784C (fi) * 1988-01-18 1989-09-11 Vaisala Oy Tryckgivarkonstruktion och foerfarande foer framstaellning daerav.

Also Published As

Publication number Publication date
NO903622D0 (no) 1990-08-16
NO903622L (no) 1991-02-18
US5083234A (en) 1992-01-21
JPH03104167A (ja) 1991-05-01
NO307488B1 (no) 2000-04-10
SE9002663D0 (sv) 1990-08-15
GB2235090A (en) 1991-02-20
JP2866167B2 (ja) 1999-03-08
SE508914C2 (sv) 1998-11-16
SE9002663L (sv) 1991-02-18
GB9017035D0 (en) 1990-09-19
GB2235090B (en) 1993-11-17
FI893874A (fi) 1991-02-18
FR2651069B1 (fr) 1998-04-03
IT9048226A0 (it) 1990-08-14
IT1241544B (it) 1994-01-17
IT9048226A1 (it) 1992-02-14
ES2023345A6 (es) 1992-01-01
DE4023776A1 (de) 1991-02-21
DE4023776C2 (de) 2003-07-03
FR2651069A1 (fr) 1991-02-22
CH681581A5 (fi) 1993-04-15

Similar Documents

Publication Publication Date Title
FI901473A0 (fi) Taelt med yttre stomme samt delstomme daertill.
FI922978A (fi) Silplaot med foerbaettrad slitstyrka samt foerfarande foer framstaellning daerav.
FI911960A0 (fi) Laddningsanordning samt instaellnings- och uppbaeringsanordning foer ackumulator.
FI890543A (fi) Foerfarande foer tillverkning av en stomme foer en radiotelefon samt enligt foerfarandet tillverkad stomme.
FI906188A0 (fi) Foerbaettring vid tillslutning av foervaringskaerl med skruvkork samt med foerseglingsbart rivband.
FI902571A0 (fi) Foerpackning samt foerfarande foer foerslutning av densamma.
FI901756A0 (fi) Filtreringsmedium samt ansiktsskydd innehaollande detsamma.
FI896323A0 (fi) Foerfarande foer framstaellning av en prokatalytkomposition avsedd foer polymerisering av olefiner samt anvaendning av kompositionen.
FI905767A (fi) Foerfarande foer serieproduktion av axiellt symmetriska patronskal samt enligt detta foerfarande framstaellda patronskal.
FI893874A0 (fi) Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen.
FI891057A0 (fi) Foerfarande foer styrning av frekvensomformar- och riktarbryggor samt en foer tillaempning av foerfarandet avsedd modulatorenhet.
FI903307A0 (fi) Pressfoerfarande foer bildaeck samt form foer utfoerande av naemnda foerfarande.
FI893819A0 (fi) Foerfarande foer framstaellning av en foerpackningsfolie samt en enligt foerfarandet framstaelld foerpackningsfolie.
FI902799A0 (fi) Foerfarande foer framstaellning av en skida samt en medelst foerfarandet framstaelld skida.
FI87013B (fi) Braenningsfoerfarande foer minskande av bildning av kvaeveoxider i samband med foerbraenning samt anordning foer tillaempande av foerfarandet.
FI892283A0 (fi) Foerfarande foer framstaellning av betongpelare samt anordning foer foerverkligande av foerfarandet.
FI904050A0 (fi) Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontaktering.
FI894288A0 (fi) Foerfarande foer bestaemning av fyllningsnivaon av jaernvaegsvagn samt foer genomfoerande av foerfarandet avsedd maetapparat av vaetskeytans nivao.
FI892854A (fi) Foerfarande foer fogning av omslagslaminat samt omslagspapper tillverkat av sammanfogade omslagslaminat.
FI894433A (fi) Foerfarande foer framstaellning av hoegtalarfodral samt hoegtalarfodral.
FI894388A0 (fi) Foerfarande foer styrning av en ljudeffektanordning samt en foer tillaempning av foerfarandet avsedd ljudeffektanordning.
FI892873A0 (fi) Foerfarande foer luftkonditionering av en byggnad samt ventilationsanlaeggning.
FI891566A (fi) Foerfarande foer tillverkning av vaermefoerseglade filmfoerpackningar samt en foer tillaempning av foerfarandet avsedd foerseglings anordning.
FI895152A0 (fi) Foerfarande foer transportering av lastpallar samt transportflyttarrangemang foer lastpallar.
FI892472A0 (fi) Foerfarande foer foerpackning av aegg samt aeggfoerpackning.

Legal Events

Date Code Title Description
FD Application lapsed

Owner name: VAISALA OY