ES2023345A6 - Transductor multicapa con contactos postizos y metodo para la incorporacion de dichos contactos. - Google Patents
Transductor multicapa con contactos postizos y metodo para la incorporacion de dichos contactos.Info
- Publication number
- ES2023345A6 ES2023345A6 ES9002096A ES9002096A ES2023345A6 ES 2023345 A6 ES2023345 A6 ES 2023345A6 ES 9002096 A ES9002096 A ES 9002096A ES 9002096 A ES9002096 A ES 9002096A ES 2023345 A6 ES2023345 A6 ES 2023345A6
- Authority
- ES
- Spain
- Prior art keywords
- transducer
- bonded
- bonding
- implementation
- contact areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Pressure Sensors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Measuring Fluid Pressure (AREA)
- Electrodes Of Semiconductors (AREA)
- Light Receiving Elements (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Electroplating Methods And Accessories (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
TRANSDUCTOR MULTICAPA CON CONTACTOS POSTIZOS Y METODO PARA LA INCORPORACION DE DICHOS CONTACTOS. LA INVENCION DA A CONOCER UN NUEVO TRANSDUCTOR MULTICAPA (1'') CON CONTACTOS POSTIZOS Y UN METODO PARA LA INCORPORACION DE DICHAS AREAS DE CONTACTO (5'') DEL TRANSDUCTOR. DE ACUERDO CON LA PRESENTE INVENCION, LAS ARES DE CONTACTO (5'') QUEDAN CONSTITUIDAS EN LA SUPERFICIE LATERAL (7) DEL TRANSDUCTOR POR DEPOSITO DE METAL UTILIZANDO DEPOSITO BASADO EN RAYOS LASER, BOMBARDEO IONICO U OTRO METODO DE METALIZACION ADECUADO. EN VIRTUD DEL NUEVO METODO DE REALIZACION DE LAS AREAS DE CONTACTO, EL TAMAÑO DEL TRANSDUCTOR (1'') PUEDE SER REDUCIDO Y EL TRANSDUCTOR (1'') PUEDE QUEDAR UNIDO A UNA PLACA DE CIRCUITO UTILIZANDO TECNOLOGIAS DE MONTAJES SUPERFICIALES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI893874A FI893874A (fi) | 1989-08-17 | 1989-08-17 | Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen. |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2023345A6 true ES2023345A6 (es) | 1992-01-01 |
Family
ID=8528855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES9002096A Expired - Fee Related ES2023345A6 (es) | 1989-08-17 | 1990-08-02 | Transductor multicapa con contactos postizos y metodo para la incorporacion de dichos contactos. |
Country Status (11)
Country | Link |
---|---|
US (1) | US5083234A (es) |
JP (1) | JP2866167B2 (es) |
CH (1) | CH681581A5 (es) |
DE (1) | DE4023776C2 (es) |
ES (1) | ES2023345A6 (es) |
FI (1) | FI893874A (es) |
FR (1) | FR2651069B1 (es) |
GB (1) | GB2235090B (es) |
IT (1) | IT1241544B (es) |
NO (1) | NO307488B1 (es) |
SE (1) | SE508914C2 (es) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR930011143A (ko) * | 1991-11-14 | 1993-06-23 | 김광호 | 반도체장치 및 그 제조방법 |
CA2115947A1 (en) * | 1993-03-03 | 1994-09-04 | Gregory C. Smith | Wafer-like processing after sawing dmds |
DE4321804A1 (de) * | 1993-06-30 | 1995-01-12 | Ranco Inc | Verfahren zur Herstellung von Kleinbauelementen |
US5912796A (en) * | 1996-11-15 | 1999-06-15 | Illinois Tool Works, Inc. | Metallized film capacitor and manufacturing process |
DE10309869A1 (de) * | 2003-03-06 | 2004-09-23 | Infineon Technologies Ag | Verfahren zur Herstellung mindestens eines Halbleiterchips und Halbleiterchip |
DE10321214A1 (de) * | 2003-05-12 | 2004-12-30 | Infineon Technologies Ag | Verfahren zum Aufbringen elektrischer Kontaktierungselemente auf einen Chip eines Chip-Wafers und Chip |
DE10326804A1 (de) * | 2003-06-13 | 2004-11-18 | Infineon Technologies Ag | Verfahren zur Herstellung mindestens eines Halbleiterchips und Halbleiterchip |
DE10334633A1 (de) * | 2003-07-29 | 2004-10-07 | Infineon Technologies Ag | Verfahren zur Herstellung einer Anordnung mit zwei Halbleiterchips und Anordnung mit zwei Halbleiterchips |
DE10334634B3 (de) * | 2003-07-29 | 2005-01-13 | Infineon Technologies Ag | Verfahren zum seitlichen Kontaktieren eines Halbleiterchips |
TWI559349B (zh) * | 2014-10-28 | 2016-11-21 | 鈺邦科技股份有限公司 | 導電端子改良之固態電解電容器封裝結構之製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL128146C (es) * | 1963-03-05 | |||
GB1115259A (en) * | 1966-05-20 | 1968-05-29 | Gen Dynamics Corp | Load measuring system |
GB1342468A (en) * | 1969-10-16 | 1974-01-03 | Chubb Alarms Mfg Ltd | Security detection systems |
GB1533191A (en) * | 1977-03-30 | 1978-11-22 | G Ni I P I Redkometallich Prom | Pressure-sensitive semiconductor bodies and pressure-sensitive devices including such bodies |
US4267634A (en) * | 1978-04-05 | 1981-05-19 | American Components Inc. | Method for making a chip circuit component |
US4386453A (en) * | 1979-09-04 | 1983-06-07 | Ford Motor Company | Method for manufacturing variable capacitance pressure transducers |
JPS58159360A (ja) * | 1982-03-17 | 1983-09-21 | Fujitsu Ltd | 半導体装置 |
EP0094078B1 (en) * | 1982-05-11 | 1988-11-02 | Nec Corporation | Multilayer electrostrictive element which withstands repeated application of pulses |
FI842307A (fi) * | 1984-06-07 | 1985-12-08 | Vaisala Oy | Foerfarande foer aostadkommande av genomfoering i en mikromekanisk konstruktion. |
JPS6127688A (ja) * | 1984-07-02 | 1986-02-07 | Nec Corp | 電歪効果素子およびその製造方法 |
IL82960A0 (en) * | 1986-06-30 | 1987-12-20 | Rosemount Inc | Differential pressure sensor |
JPS63149531A (ja) * | 1986-12-12 | 1988-06-22 | Fuji Electric Co Ltd | 静電容量式圧力センサ |
JPH061228B2 (ja) * | 1987-08-13 | 1994-01-05 | 富士電機株式会社 | 静電容量式圧力検出器 |
DE3727142C2 (de) * | 1987-08-14 | 1994-02-24 | Kernforschungsz Karlsruhe | Verfahren zur Herstellung von Mikrosensoren mit integrierter Signalverarbeitung |
FI78784C (fi) * | 1988-01-18 | 1989-09-11 | Vaisala Oy | Tryckgivarkonstruktion och foerfarande foer framstaellning daerav. |
-
1989
- 1989-08-17 FI FI893874A patent/FI893874A/fi not_active Application Discontinuation
-
1990
- 1990-07-18 US US07/553,597 patent/US5083234A/en not_active Expired - Lifetime
- 1990-07-26 DE DE4023776A patent/DE4023776C2/de not_active Expired - Lifetime
- 1990-08-02 ES ES9002096A patent/ES2023345A6/es not_active Expired - Fee Related
- 1990-08-03 GB GB9017035A patent/GB2235090B/en not_active Expired - Fee Related
- 1990-08-09 CH CH2599/90A patent/CH681581A5/de not_active IP Right Cessation
- 1990-08-14 IT IT48226A patent/IT1241544B/it active IP Right Grant
- 1990-08-14 FR FR9010329A patent/FR2651069B1/fr not_active Expired - Fee Related
- 1990-08-15 SE SE9002663A patent/SE508914C2/sv unknown
- 1990-08-16 NO NO903622A patent/NO307488B1/no not_active IP Right Cessation
- 1990-08-17 JP JP2217992A patent/JP2866167B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
SE9002663D0 (sv) | 1990-08-15 |
IT1241544B (it) | 1994-01-17 |
NO903622D0 (no) | 1990-08-16 |
JP2866167B2 (ja) | 1999-03-08 |
IT9048226A0 (it) | 1990-08-14 |
FI893874A0 (fi) | 1989-08-17 |
SE508914C2 (sv) | 1998-11-16 |
SE9002663L (sv) | 1991-02-18 |
DE4023776A1 (de) | 1991-02-21 |
FR2651069A1 (fr) | 1991-02-22 |
NO307488B1 (no) | 2000-04-10 |
DE4023776C2 (de) | 2003-07-03 |
FI893874A (fi) | 1991-02-18 |
GB2235090B (en) | 1993-11-17 |
JPH03104167A (ja) | 1991-05-01 |
IT9048226A1 (it) | 1992-02-14 |
NO903622L (no) | 1991-02-18 |
CH681581A5 (es) | 1993-04-15 |
GB2235090A (en) | 1991-02-20 |
FR2651069B1 (fr) | 1998-04-03 |
GB9017035D0 (en) | 1990-09-19 |
US5083234A (en) | 1992-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD2A | Announcement of lapse in spain |
Effective date: 20180802 |