JP2810909B2 - 露光装置 - Google Patents
露光装置Info
- Publication number
- JP2810909B2 JP2810909B2 JP6030039A JP3003994A JP2810909B2 JP 2810909 B2 JP2810909 B2 JP 2810909B2 JP 6030039 A JP6030039 A JP 6030039A JP 3003994 A JP3003994 A JP 3003994A JP 2810909 B2 JP2810909 B2 JP 2810909B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- exposure
- frame
- original film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 141
- 230000005611 electricity Effects 0.000 claims description 22
- 230000003068 static effect Effects 0.000 claims description 20
- 230000001681 protective effect Effects 0.000 claims description 15
- 230000005684 electric field Effects 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000011889 copper foil Substances 0.000 description 16
- 230000032258 transport Effects 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6030039A JP2810909B2 (ja) | 1994-02-28 | 1994-02-28 | 露光装置 |
| TW84109270A TW275183B (enrdf_load_stackoverflow) | 1994-02-28 | 1995-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6030039A JP2810909B2 (ja) | 1994-02-28 | 1994-02-28 | 露光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07239551A JPH07239551A (ja) | 1995-09-12 |
| JP2810909B2 true JP2810909B2 (ja) | 1998-10-15 |
Family
ID=12292690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6030039A Expired - Fee Related JP2810909B2 (ja) | 1994-02-28 | 1994-02-28 | 露光装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2810909B2 (enrdf_load_stackoverflow) |
| TW (1) | TW275183B (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5933216A (en) * | 1997-10-16 | 1999-08-03 | Anvik Corporation | Double-sided patterning system using dual-wavelength output of an excimer laser |
| JP4949195B2 (ja) * | 2007-10-26 | 2012-06-06 | 株式会社アドテックエンジニアリング | 露光装置及び基板の矯正装置 |
| JP6149214B2 (ja) * | 2013-03-26 | 2017-06-21 | サンエー技研株式会社 | 露光装置、露光方法 |
-
1994
- 1994-02-28 JP JP6030039A patent/JP2810909B2/ja not_active Expired - Fee Related
-
1995
- 1995-09-06 TW TW84109270A patent/TW275183B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW275183B (enrdf_load_stackoverflow) | 1996-05-01 |
| JPH07239551A (ja) | 1995-09-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |