JP2565303Y2 - 半導体パッケージ用セラミック基板 - Google Patents
半導体パッケージ用セラミック基板Info
- Publication number
- JP2565303Y2 JP2565303Y2 JP1990405558U JP40555890U JP2565303Y2 JP 2565303 Y2 JP2565303 Y2 JP 2565303Y2 JP 1990405558 U JP1990405558 U JP 1990405558U JP 40555890 U JP40555890 U JP 40555890U JP 2565303 Y2 JP2565303 Y2 JP 2565303Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- semiconductor package
- chipping
- depth
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims description 35
- 239000000758 substrate Substances 0.000 title claims description 32
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 230000007547 defect Effects 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241000217377 Amblema plicata Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990405558U JP2565303Y2 (ja) | 1990-12-28 | 1990-12-28 | 半導体パッケージ用セラミック基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990405558U JP2565303Y2 (ja) | 1990-12-28 | 1990-12-28 | 半導体パッケージ用セラミック基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0492649U JPH0492649U (enrdf_load_stackoverflow) | 1992-08-12 |
| JP2565303Y2 true JP2565303Y2 (ja) | 1998-03-18 |
Family
ID=31882960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990405558U Expired - Fee Related JP2565303Y2 (ja) | 1990-12-28 | 1990-12-28 | 半導体パッケージ用セラミック基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2565303Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5617574B2 (ja) * | 2010-12-01 | 2014-11-05 | 株式会社村田製作所 | セラミック多層基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0731549Y2 (ja) * | 1988-11-11 | 1995-07-19 | 京セラ株式会社 | 半導体パッケージ用セラミック基板 |
-
1990
- 1990-12-28 JP JP1990405558U patent/JP2565303Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0492649U (enrdf_load_stackoverflow) | 1992-08-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |