JP2551531B2 - 部分メッキ方法、および部分メッキ装置 - Google Patents
部分メッキ方法、および部分メッキ装置Info
- Publication number
- JP2551531B2 JP2551531B2 JP5345308A JP34530893A JP2551531B2 JP 2551531 B2 JP2551531 B2 JP 2551531B2 JP 5345308 A JP5345308 A JP 5345308A JP 34530893 A JP34530893 A JP 34530893A JP 2551531 B2 JP2551531 B2 JP 2551531B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- sparger
- bearing
- plating
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims description 111
- 238000000034 method Methods 0.000 title claims description 55
- 238000007789 sealing Methods 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 9
- 230000000881 depressing effect Effects 0.000 claims 1
- 238000012546 transfer Methods 0.000 description 18
- 230000032258 transport Effects 0.000 description 11
- 210000000078 claw Anatomy 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5345308A JP2551531B2 (ja) | 1993-12-20 | 1993-12-20 | 部分メッキ方法、および部分メッキ装置 |
| TW083111913A TW293942B (enrdf_load_stackoverflow) | 1993-12-20 | 1994-12-20 | |
| KR1019940035335A KR100251245B1 (ko) | 1993-12-20 | 1994-12-20 | 부분도금방법및그장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5345308A JP2551531B2 (ja) | 1993-12-20 | 1993-12-20 | 部分メッキ方法、および部分メッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07173670A JPH07173670A (ja) | 1995-07-11 |
| JP2551531B2 true JP2551531B2 (ja) | 1996-11-06 |
Family
ID=18375721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5345308A Expired - Fee Related JP2551531B2 (ja) | 1993-12-20 | 1993-12-20 | 部分メッキ方法、および部分メッキ装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2551531B2 (enrdf_load_stackoverflow) |
| KR (1) | KR100251245B1 (enrdf_load_stackoverflow) |
| TW (1) | TW293942B (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100724068B1 (ko) * | 2006-08-07 | 2007-06-07 | 대성하이피(주) | 분할식 부분 전기도금장치 |
| KR101149158B1 (ko) | 2009-05-26 | 2012-06-01 | 현대제철 주식회사 | 프레스 성형품의 국부도금방법 및 그에 이용되는 금형 |
-
1993
- 1993-12-20 JP JP5345308A patent/JP2551531B2/ja not_active Expired - Fee Related
-
1994
- 1994-12-20 KR KR1019940035335A patent/KR100251245B1/ko not_active Expired - Fee Related
- 1994-12-20 TW TW083111913A patent/TW293942B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR950018680A (ko) | 1995-07-22 |
| JPH07173670A (ja) | 1995-07-11 |
| KR100251245B1 (ko) | 2000-04-15 |
| TW293942B (enrdf_load_stackoverflow) | 1996-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |