JP2548253Y2 - テーピング用治具 - Google Patents
テーピング用治具Info
- Publication number
- JP2548253Y2 JP2548253Y2 JP1990110990U JP11099090U JP2548253Y2 JP 2548253 Y2 JP2548253 Y2 JP 2548253Y2 JP 1990110990 U JP1990110990 U JP 1990110990U JP 11099090 U JP11099090 U JP 11099090U JP 2548253 Y2 JP2548253 Y2 JP 2548253Y2
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- width
- carrier tape
- tape
- crimping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000002788 crimping Methods 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 30
- 229910052742 iron Inorganic materials 0.000 description 15
- 230000032798 delamination Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 2
- 235000000396 iron Nutrition 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Package Closures (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990110990U JP2548253Y2 (ja) | 1990-10-23 | 1990-10-23 | テーピング用治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990110990U JP2548253Y2 (ja) | 1990-10-23 | 1990-10-23 | テーピング用治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0468803U JPH0468803U (en, 2012) | 1992-06-18 |
| JP2548253Y2 true JP2548253Y2 (ja) | 1997-09-17 |
Family
ID=31858401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990110990U Expired - Lifetime JP2548253Y2 (ja) | 1990-10-23 | 1990-10-23 | テーピング用治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2548253Y2 (en, 2012) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005263226A (ja) * | 2004-03-16 | 2005-09-29 | Nippon Inter Electronics Corp | テーピング方法 |
| JP2014205511A (ja) * | 2013-04-15 | 2014-10-30 | 株式会社ティ−アンドケイ東華 | 圧着ヘッドおよび圧着装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0199910A (ja) * | 1987-09-30 | 1989-04-18 | Hitachi Condenser Co Ltd | テーピング電子部品の製造方法 |
-
1990
- 1990-10-23 JP JP1990110990U patent/JP2548253Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0468803U (en, 2012) | 1992-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2548253Y2 (ja) | テーピング用治具 | |
| JP2504510B2 (ja) | 電子部品 | |
| JP3392337B2 (ja) | はんだ印刷用マスクおよびその製造方法 | |
| JPH0341486Y2 (en, 2012) | ||
| JPH0213764U (en, 2012) | ||
| JPH0354631B2 (en, 2012) | ||
| JPH01209674A (ja) | 混成集積回路装置およびリードフレーム | |
| JPH054209Y2 (en, 2012) | ||
| JPH01181553A (ja) | サイドブレーズ型セラミック基板 | |
| JPH0134360Y2 (en, 2012) | ||
| JPH046212Y2 (en, 2012) | ||
| JPS60184268U (ja) | 加熱圧着コネクタ | |
| JPH047850A (ja) | テープキャリア | |
| JP2530783Y2 (ja) | チップ部品の実装構造 | |
| JPS6010277U (ja) | フイルム状ヒ−トシ−ルコネクタ | |
| JPH0365023B2 (en, 2012) | ||
| JPS63117436A (ja) | フイルムキヤリア | |
| JPS6066003U (ja) | 複合部品 | |
| JPS587338U (ja) | 半導体装置用グランドチツプ | |
| JPH06162446A (ja) | 薄膜磁気ヘッド | |
| JPS61291439A (ja) | 高強度ステンドグラス | |
| JPS6113938U (ja) | プラグインパツケ−ジ基板 | |
| JPS61166952U (en, 2012) | ||
| JPS59171372U (ja) | 薄型回路基板 | |
| JPS63127077U (en, 2012) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |