JP2544761Y2 - 半導体レーザ用ヒートシンク - Google Patents

半導体レーザ用ヒートシンク

Info

Publication number
JP2544761Y2
JP2544761Y2 JP1990089383U JP8938390U JP2544761Y2 JP 2544761 Y2 JP2544761 Y2 JP 2544761Y2 JP 1990089383 U JP1990089383 U JP 1990089383U JP 8938390 U JP8938390 U JP 8938390U JP 2544761 Y2 JP2544761 Y2 JP 2544761Y2
Authority
JP
Japan
Prior art keywords
heat sink
film
solder
semiconductor laser
platinum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990089383U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0446568U (enrdf_load_stackoverflow
Inventor
清次 船川
Original Assignee
安藤電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 安藤電気株式会社 filed Critical 安藤電気株式会社
Priority to JP1990089383U priority Critical patent/JP2544761Y2/ja
Publication of JPH0446568U publication Critical patent/JPH0446568U/ja
Application granted granted Critical
Publication of JP2544761Y2 publication Critical patent/JP2544761Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
JP1990089383U 1990-08-27 1990-08-27 半導体レーザ用ヒートシンク Expired - Lifetime JP2544761Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990089383U JP2544761Y2 (ja) 1990-08-27 1990-08-27 半導体レーザ用ヒートシンク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990089383U JP2544761Y2 (ja) 1990-08-27 1990-08-27 半導体レーザ用ヒートシンク

Publications (2)

Publication Number Publication Date
JPH0446568U JPH0446568U (enrdf_load_stackoverflow) 1992-04-21
JP2544761Y2 true JP2544761Y2 (ja) 1997-08-20

Family

ID=31823319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990089383U Expired - Lifetime JP2544761Y2 (ja) 1990-08-27 1990-08-27 半導体レーザ用ヒートシンク

Country Status (1)

Country Link
JP (1) JP2544761Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006313897A (ja) * 2005-05-07 2006-11-16 Samsung Electronics Co Ltd 発光素子パッケージ用サブマウント

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02137389A (ja) * 1988-11-18 1990-05-25 Nec Corp サブマウント及び光半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006313897A (ja) * 2005-05-07 2006-11-16 Samsung Electronics Co Ltd 発光素子パッケージ用サブマウント

Also Published As

Publication number Publication date
JPH0446568U (enrdf_load_stackoverflow) 1992-04-21

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