JP2538245Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2538245Y2
JP2538245Y2 JP1988120044U JP12004488U JP2538245Y2 JP 2538245 Y2 JP2538245 Y2 JP 2538245Y2 JP 1988120044 U JP1988120044 U JP 1988120044U JP 12004488 U JP12004488 U JP 12004488U JP 2538245 Y2 JP2538245 Y2 JP 2538245Y2
Authority
JP
Japan
Prior art keywords
insulating film
wiring
film
semiconductor device
concave portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988120044U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0241442U (US20100223739A1-20100909-C00025.png
Inventor
久晴 清田
Original Assignee
ソニー 株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー 株式会社 filed Critical ソニー 株式会社
Priority to JP1988120044U priority Critical patent/JP2538245Y2/ja
Publication of JPH0241442U publication Critical patent/JPH0241442U/ja
Application granted granted Critical
Publication of JP2538245Y2 publication Critical patent/JP2538245Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP1988120044U 1988-09-12 1988-09-12 半導体装置 Expired - Lifetime JP2538245Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988120044U JP2538245Y2 (ja) 1988-09-12 1988-09-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988120044U JP2538245Y2 (ja) 1988-09-12 1988-09-12 半導体装置

Publications (2)

Publication Number Publication Date
JPH0241442U JPH0241442U (US20100223739A1-20100909-C00025.png) 1990-03-22
JP2538245Y2 true JP2538245Y2 (ja) 1997-06-11

Family

ID=31365798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988120044U Expired - Lifetime JP2538245Y2 (ja) 1988-09-12 1988-09-12 半導体装置

Country Status (1)

Country Link
JP (1) JP2538245Y2 (US20100223739A1-20100909-C00025.png)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6325951A (ja) * 1986-07-17 1988-02-03 Nec Corp 半導体装置
JPS63211739A (ja) * 1987-02-27 1988-09-02 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPH0241442U (US20100223739A1-20100909-C00025.png) 1990-03-22

Similar Documents

Publication Publication Date Title
JP2538245Y2 (ja) 半導体装置
JP2570953B2 (ja) 半導体装置の製造方法
JP2817752B2 (ja) 半導体装置の製造方法
JP2508831B2 (ja) 半導体装置
JP3130726B2 (ja) 半導体装置及びその製造方法
JPH05267290A (ja) 半導体集積回路およびその製造方法
JPS62155537A (ja) 半導体装置の製造方法
JPS5833854A (ja) 半導体装置の製造方法
JPS6254427A (ja) 半導体装置の製造方法
JP2758765B2 (ja) 半導体装置の製造方法
JP2770390B2 (ja) 半導体装置
JPH079933B2 (ja) 半導体装置の製造方法
JP3039163B2 (ja) 半導体装置の製造方法
JP2734881B2 (ja) 半導体装置の製造方法
JPH04109654A (ja) 半導体装置及びその製造方法
JPS62136857A (ja) 半導体装置の製造方法
JPS63226041A (ja) 半導体集積回路装置の製造方法
JPH0541454A (ja) 半導体装置
JPH0936222A (ja) 半導体装置及びその製造方法
JPS60177652A (ja) 半導体装置の製造方法
JPH0291968A (ja) メモリ装置の製造方法
JPH09283619A (ja) 半導体集積回路装置の製造方法
JPH0595048A (ja) 半導体集積回路装置の製造方法
JPH03126246A (ja) 半導体装置
JPS62200746A (ja) 半導体装置