JP2529774C - - Google Patents
Info
- Publication number
- JP2529774C JP2529774C JP2529774C JP 2529774 C JP2529774 C JP 2529774C JP 2529774 C JP2529774 C JP 2529774C
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead frame
- wire
- thickness
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 62
- 239000010949 copper Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 21
- 238000005096 rolling process Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 9
- 238000000137 annealing Methods 0.000 description 8
- 230000007613 environmental effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Family
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