JP2529431B2 - 洗浄装置 - Google Patents

洗浄装置

Info

Publication number
JP2529431B2
JP2529431B2 JP2030375A JP3037590A JP2529431B2 JP 2529431 B2 JP2529431 B2 JP 2529431B2 JP 2030375 A JP2030375 A JP 2030375A JP 3037590 A JP3037590 A JP 3037590A JP 2529431 B2 JP2529431 B2 JP 2529431B2
Authority
JP
Japan
Prior art keywords
exhaust
cleaning tank
cleaning
cleaned
guide pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2030375A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03234022A (ja
Inventor
益太 多田
至 菅野
信美 服部
隼明 福本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2030375A priority Critical patent/JP2529431B2/ja
Priority to US07/643,289 priority patent/US5129198A/en
Priority to DE4103577A priority patent/DE4103577A1/de
Publication of JPH03234022A publication Critical patent/JPH03234022A/ja
Application granted granted Critical
Publication of JP2529431B2 publication Critical patent/JP2529431B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
JP2030375A 1990-02-09 1990-02-09 洗浄装置 Expired - Fee Related JP2529431B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2030375A JP2529431B2 (ja) 1990-02-09 1990-02-09 洗浄装置
US07/643,289 US5129198A (en) 1990-02-09 1991-01-22 Cleaning device for semiconductor wafers
DE4103577A DE4103577A1 (de) 1990-02-09 1991-02-06 Reinigungsvorrichtung fuer einen gegenstand mit einer zu reinigenden oberflaeche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2030375A JP2529431B2 (ja) 1990-02-09 1990-02-09 洗浄装置

Publications (2)

Publication Number Publication Date
JPH03234022A JPH03234022A (ja) 1991-10-18
JP2529431B2 true JP2529431B2 (ja) 1996-08-28

Family

ID=12302132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2030375A Expired - Fee Related JP2529431B2 (ja) 1990-02-09 1990-02-09 洗浄装置

Country Status (3)

Country Link
US (1) US5129198A (enExample)
JP (1) JP2529431B2 (enExample)
DE (1) DE4103577A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2857569B2 (ja) 1993-06-25 1999-02-17 住友重機械工業株式会社 洗浄装置および洗浄方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744166B2 (ja) * 1990-07-31 1995-05-15 三菱電機株式会社 半導体ウエハ洗浄装置
JP2529468B2 (ja) * 1990-11-30 1996-08-28 大陽酸素株式会社 半導体ウエハの洗浄装置及び洗浄方法
US5315793A (en) * 1991-10-01 1994-05-31 Hughes Aircraft Company System for precision cleaning by jet spray
JPH06132273A (ja) * 1992-10-19 1994-05-13 Mitsubishi Electric Corp ウエハ洗浄装置
US6239038B1 (en) 1995-10-13 2001-05-29 Ziying Wen Method for chemical processing semiconductor wafers
US5810942A (en) * 1996-09-11 1998-09-22 Fsi International, Inc. Aerodynamic aerosol chamber
DE19860084B4 (de) * 1998-12-23 2005-12-22 Infineon Technologies Ag Verfahren zum Strukturieren eines Substrats
US6740247B1 (en) 1999-02-05 2004-05-25 Massachusetts Institute Of Technology HF vapor phase wafer cleaning and oxide etching
AT411233B (de) * 1999-05-07 2003-11-25 Berndorf Band Ges M B H Vorrichtung mit zumindest einem endlosen band aus stahl und verfahren zum thermischen beaufschlagen von plastischen massen
US6500758B1 (en) 2000-09-12 2002-12-31 Eco-Snow Systems, Inc. Method for selective metal film layer removal using carbon dioxide jet spray
US6520838B1 (en) * 2001-06-25 2003-02-18 General Electric Company Shielded spin polishing
US20080157007A1 (en) * 2006-12-27 2008-07-03 Varian Semiconductor Equipment Associates, Inc. Active particle trapping for process control
CN105483819B (zh) * 2016-01-26 2017-12-05 中山大学 一种用于提拉法晶体生长的对流控制装置和晶体生长炉

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4649672A (en) 1984-02-29 1987-03-17 Chantal Thomann Installation for cleaning building
US4723378A (en) 1987-02-24 1988-02-09 Progressive Blasting Systems, Inc. Exhaust and reclaim system for blasting enclosures

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3097450A (en) * 1963-07-16 Rough cleaning and finish cleaning machine and method
DE3844649C2 (enExample) * 1987-06-23 1992-04-23 Taiyo Sanso Co. Ltd., Osaka, Jp
JPH02130921A (ja) * 1988-11-11 1990-05-18 Taiyo Sanso Co Ltd 固体表面洗浄装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4649672A (en) 1984-02-29 1987-03-17 Chantal Thomann Installation for cleaning building
US4723378A (en) 1987-02-24 1988-02-09 Progressive Blasting Systems, Inc. Exhaust and reclaim system for blasting enclosures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2857569B2 (ja) 1993-06-25 1999-02-17 住友重機械工業株式会社 洗浄装置および洗浄方法

Also Published As

Publication number Publication date
US5129198A (en) 1992-07-14
DE4103577C2 (enExample) 1992-10-29
JPH03234022A (ja) 1991-10-18
DE4103577A1 (de) 1991-08-14

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