JP2528396Y2 - 温度センサ - Google Patents
温度センサInfo
- Publication number
- JP2528396Y2 JP2528396Y2 JP1990043480U JP4348090U JP2528396Y2 JP 2528396 Y2 JP2528396 Y2 JP 2528396Y2 JP 1990043480 U JP1990043480 U JP 1990043480U JP 4348090 U JP4348090 U JP 4348090U JP 2528396 Y2 JP2528396 Y2 JP 2528396Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- elastic body
- film
- sensitive
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000004044 response Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011888 foil Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fixing For Electrophotography (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990043480U JP2528396Y2 (ja) | 1990-04-25 | 1990-04-25 | 温度センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990043480U JP2528396Y2 (ja) | 1990-04-25 | 1990-04-25 | 温度センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH043325U JPH043325U (enrdf_load_stackoverflow) | 1992-01-13 |
| JP2528396Y2 true JP2528396Y2 (ja) | 1997-03-12 |
Family
ID=31555923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990043480U Expired - Fee Related JP2528396Y2 (ja) | 1990-04-25 | 1990-04-25 | 温度センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528396Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012093572A1 (ja) * | 2011-01-07 | 2012-07-12 | 株式会社村田製作所 | 温度センサおよび温度センサ取り付け構造 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7306571B2 (ja) * | 2020-03-31 | 2023-07-11 | 株式会社村田製作所 | 温度センサおよび温度センサアレイ |
| JP2024077876A (ja) | 2022-11-29 | 2024-06-10 | 三菱マテリアル株式会社 | 温度センサ |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6042627A (ja) * | 1983-08-19 | 1985-03-06 | Ishizuka Denshi Kk | 温度検出装置 |
| JPS63120233A (ja) * | 1986-11-07 | 1988-05-24 | Matsushita Electric Ind Co Ltd | 表面温センサ |
-
1990
- 1990-04-25 JP JP1990043480U patent/JP2528396Y2/ja not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012093572A1 (ja) * | 2011-01-07 | 2012-07-12 | 株式会社村田製作所 | 温度センサおよび温度センサ取り付け構造 |
| CN103282754A (zh) * | 2011-01-07 | 2013-09-04 | 株式会社村田制作所 | 温度传感器及温度传感器安装结构 |
| CN103282754B (zh) * | 2011-01-07 | 2015-05-20 | 株式会社村田制作所 | 温度传感器及温度传感器安装结构 |
| US9316546B2 (en) | 2011-01-07 | 2016-04-19 | Murata Manufacturing Co., Ltd. | Temperature sensor and temperature sensor attaching structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH043325U (enrdf_load_stackoverflow) | 1992-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |