JP2527709Y2 - 半導体製造装置の搬送部品 - Google Patents
半導体製造装置の搬送部品Info
- Publication number
- JP2527709Y2 JP2527709Y2 JP40146190U JP40146190U JP2527709Y2 JP 2527709 Y2 JP2527709 Y2 JP 2527709Y2 JP 40146190 U JP40146190 U JP 40146190U JP 40146190 U JP40146190 U JP 40146190U JP 2527709 Y2 JP2527709 Y2 JP 2527709Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor manufacturing
- fork
- suction
- manufacturing equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims description 12
- 239000002861 polymer material Substances 0.000 claims description 10
- 229920005570 flexible polymer Polymers 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40146190U JP2527709Y2 (ja) | 1990-12-25 | 1990-12-25 | 半導体製造装置の搬送部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40146190U JP2527709Y2 (ja) | 1990-12-25 | 1990-12-25 | 半導体製造装置の搬送部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0493149U JPH0493149U (enExample) | 1992-08-13 |
| JP2527709Y2 true JP2527709Y2 (ja) | 1997-03-05 |
Family
ID=31879553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40146190U Expired - Lifetime JP2527709Y2 (ja) | 1990-12-25 | 1990-12-25 | 半導体製造装置の搬送部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527709Y2 (enExample) |
-
1990
- 1990-12-25 JP JP40146190U patent/JP2527709Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0493149U (enExample) | 1992-08-13 |
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