JP2527420Y2 - 電子部品のはんだ被覆装置 - Google Patents
電子部品のはんだ被覆装置Info
- Publication number
- JP2527420Y2 JP2527420Y2 JP12647290U JP12647290U JP2527420Y2 JP 2527420 Y2 JP2527420 Y2 JP 2527420Y2 JP 12647290 U JP12647290 U JP 12647290U JP 12647290 U JP12647290 U JP 12647290U JP 2527420 Y2 JP2527420 Y2 JP 2527420Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- chain
- engagement
- engaging
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12647290U JP2527420Y2 (ja) | 1990-11-30 | 1990-11-30 | 電子部品のはんだ被覆装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12647290U JP2527420Y2 (ja) | 1990-11-30 | 1990-11-30 | 電子部品のはんだ被覆装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0485741U JPH0485741U (enrdf_load_html_response) | 1992-07-24 |
JP2527420Y2 true JP2527420Y2 (ja) | 1997-02-26 |
Family
ID=31874028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12647290U Expired - Fee Related JP2527420Y2 (ja) | 1990-11-30 | 1990-11-30 | 電子部品のはんだ被覆装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2527420Y2 (enrdf_load_html_response) |
-
1990
- 1990-11-30 JP JP12647290U patent/JP2527420Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0485741U (enrdf_load_html_response) | 1992-07-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |