JP2523146Y2 - ペレットボンディング装置における接着剤塗布装置 - Google Patents

ペレットボンディング装置における接着剤塗布装置

Info

Publication number
JP2523146Y2
JP2523146Y2 JP1990045548U JP4554890U JP2523146Y2 JP 2523146 Y2 JP2523146 Y2 JP 2523146Y2 JP 1990045548 U JP1990045548 U JP 1990045548U JP 4554890 U JP4554890 U JP 4554890U JP 2523146 Y2 JP2523146 Y2 JP 2523146Y2
Authority
JP
Japan
Prior art keywords
adhesive
holder
application
bonding
adhesive application
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990045548U
Other languages
English (en)
Japanese (ja)
Other versions
JPH045639U (cs
Inventor
泰雄 岩城
Original Assignee
東芝メカトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝メカトロニクス株式会社 filed Critical 東芝メカトロニクス株式会社
Priority to JP1990045548U priority Critical patent/JP2523146Y2/ja
Publication of JPH045639U publication Critical patent/JPH045639U/ja
Application granted granted Critical
Publication of JP2523146Y2 publication Critical patent/JP2523146Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1990045548U 1990-04-28 1990-04-28 ペレットボンディング装置における接着剤塗布装置 Expired - Lifetime JP2523146Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990045548U JP2523146Y2 (ja) 1990-04-28 1990-04-28 ペレットボンディング装置における接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990045548U JP2523146Y2 (ja) 1990-04-28 1990-04-28 ペレットボンディング装置における接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPH045639U JPH045639U (cs) 1992-01-20
JP2523146Y2 true JP2523146Y2 (ja) 1997-01-22

Family

ID=31559826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990045548U Expired - Lifetime JP2523146Y2 (ja) 1990-04-28 1990-04-28 ペレットボンディング装置における接着剤塗布装置

Country Status (1)

Country Link
JP (1) JP2523146Y2 (cs)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2519257B2 (ja) * 1987-08-06 1996-07-31 株式会社日立製作所 ダイボンダ

Also Published As

Publication number Publication date
JPH045639U (cs) 1992-01-20

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term