JPH045639U - - Google Patents

Info

Publication number
JPH045639U
JPH045639U JP4554890U JP4554890U JPH045639U JP H045639 U JPH045639 U JP H045639U JP 4554890 U JP4554890 U JP 4554890U JP 4554890 U JP4554890 U JP 4554890U JP H045639 U JPH045639 U JP H045639U
Authority
JP
Japan
Prior art keywords
adhesive
positioning
holder
application part
adhesive application
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4554890U
Other languages
English (en)
Japanese (ja)
Other versions
JP2523146Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990045548U priority Critical patent/JP2523146Y2/ja
Publication of JPH045639U publication Critical patent/JPH045639U/ja
Application granted granted Critical
Publication of JP2523146Y2 publication Critical patent/JP2523146Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1990045548U 1990-04-28 1990-04-28 ペレットボンディング装置における接着剤塗布装置 Expired - Lifetime JP2523146Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990045548U JP2523146Y2 (ja) 1990-04-28 1990-04-28 ペレットボンディング装置における接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990045548U JP2523146Y2 (ja) 1990-04-28 1990-04-28 ペレットボンディング装置における接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPH045639U true JPH045639U (cs) 1992-01-20
JP2523146Y2 JP2523146Y2 (ja) 1997-01-22

Family

ID=31559826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990045548U Expired - Lifetime JP2523146Y2 (ja) 1990-04-28 1990-04-28 ペレットボンディング装置における接着剤塗布装置

Country Status (1)

Country Link
JP (1) JP2523146Y2 (cs)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6441231A (en) * 1987-08-06 1989-02-13 Hitachi Ltd Die bonder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6441231A (en) * 1987-08-06 1989-02-13 Hitachi Ltd Die bonder

Also Published As

Publication number Publication date
JP2523146Y2 (ja) 1997-01-22

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term