JP2518646Y2 - 半導体レーザ装置 - Google Patents
半導体レーザ装置Info
- Publication number
- JP2518646Y2 JP2518646Y2 JP1990053937U JP5393790U JP2518646Y2 JP 2518646 Y2 JP2518646 Y2 JP 2518646Y2 JP 1990053937 U JP1990053937 U JP 1990053937U JP 5393790 U JP5393790 U JP 5393790U JP 2518646 Y2 JP2518646 Y2 JP 2518646Y2
- Authority
- JP
- Japan
- Prior art keywords
- cap body
- transparent plate
- adhesive
- semiconductor laser
- stem
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 26
- 239000000853 adhesive Substances 0.000 claims description 45
- 230000001070 adhesive effect Effects 0.000 claims description 45
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000010304 firing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990053937U JP2518646Y2 (ja) | 1990-05-23 | 1990-05-23 | 半導体レーザ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990053937U JP2518646Y2 (ja) | 1990-05-23 | 1990-05-23 | 半導体レーザ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0412673U JPH0412673U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-01-31 |
| JP2518646Y2 true JP2518646Y2 (ja) | 1996-11-27 |
Family
ID=31575555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990053937U Expired - Lifetime JP2518646Y2 (ja) | 1990-05-23 | 1990-05-23 | 半導体レーザ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2518646Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5748007B2 (ja) * | 2014-01-29 | 2015-07-15 | 日亜化学工業株式会社 | 発光装置 |
| JP6296024B2 (ja) * | 2015-08-28 | 2018-03-20 | 日亜化学工業株式会社 | 半導体レーザ装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6084845A (ja) * | 1983-10-14 | 1985-05-14 | Matsushita Electric Works Ltd | 封止半導体装置 |
| JPS62159529A (ja) * | 1986-01-07 | 1987-07-15 | Nec Corp | 強制通話チヤネル切替方式 |
-
1990
- 1990-05-23 JP JP1990053937U patent/JP2518646Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412673U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-01-31 |
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