JP2517954Y2 - 樹脂モールド型半導体装置 - Google Patents

樹脂モールド型半導体装置

Info

Publication number
JP2517954Y2
JP2517954Y2 JP1990087605U JP8760590U JP2517954Y2 JP 2517954 Y2 JP2517954 Y2 JP 2517954Y2 JP 1990087605 U JP1990087605 U JP 1990087605U JP 8760590 U JP8760590 U JP 8760590U JP 2517954 Y2 JP2517954 Y2 JP 2517954Y2
Authority
JP
Japan
Prior art keywords
hole
resin
semiconductor device
heat sink
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990087605U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0444155U (enrdf_load_stackoverflow
Inventor
和洋 井上
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1990087605U priority Critical patent/JP2517954Y2/ja
Publication of JPH0444155U publication Critical patent/JPH0444155U/ja
Application granted granted Critical
Publication of JP2517954Y2 publication Critical patent/JP2517954Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1990087605U 1990-08-21 1990-08-21 樹脂モールド型半導体装置 Expired - Lifetime JP2517954Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990087605U JP2517954Y2 (ja) 1990-08-21 1990-08-21 樹脂モールド型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990087605U JP2517954Y2 (ja) 1990-08-21 1990-08-21 樹脂モールド型半導体装置

Publications (2)

Publication Number Publication Date
JPH0444155U JPH0444155U (enrdf_load_stackoverflow) 1992-04-15
JP2517954Y2 true JP2517954Y2 (ja) 1996-11-20

Family

ID=31820091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990087605U Expired - Lifetime JP2517954Y2 (ja) 1990-08-21 1990-08-21 樹脂モールド型半導体装置

Country Status (1)

Country Link
JP (1) JP2517954Y2 (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6472546A (en) * 1987-09-11 1989-03-17 Kansai Nippon Electric Semiconductor device

Also Published As

Publication number Publication date
JPH0444155U (enrdf_load_stackoverflow) 1992-04-15

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