JP2515671Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JP2515671Y2
JP2515671Y2 JP1990115192U JP11519290U JP2515671Y2 JP 2515671 Y2 JP2515671 Y2 JP 2515671Y2 JP 1990115192 U JP1990115192 U JP 1990115192U JP 11519290 U JP11519290 U JP 11519290U JP 2515671 Y2 JP2515671 Y2 JP 2515671Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
insulating frame
metal base
package
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990115192U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0472639U (en:Method
Inventor
隆一 井村
義博 森上
千尋 牧原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1990115192U priority Critical patent/JP2515671Y2/ja
Publication of JPH0472639U publication Critical patent/JPH0472639U/ja
Application granted granted Critical
Publication of JP2515671Y2 publication Critical patent/JP2515671Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP1990115192U 1990-10-31 1990-10-31 半導体素子収納用パッケージ Expired - Lifetime JP2515671Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990115192U JP2515671Y2 (ja) 1990-10-31 1990-10-31 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990115192U JP2515671Y2 (ja) 1990-10-31 1990-10-31 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0472639U JPH0472639U (en:Method) 1992-06-26
JP2515671Y2 true JP2515671Y2 (ja) 1996-10-30

Family

ID=31862936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990115192U Expired - Lifetime JP2515671Y2 (ja) 1990-10-31 1990-10-31 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2515671Y2 (en:Method)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5956746A (ja) * 1982-09-24 1984-04-02 Kyocera Corp 半導体パツケ−ジ
JPS61220444A (ja) * 1985-03-27 1986-09-30 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6489350A (en) * 1987-09-29 1989-04-03 Kyocera Corp Package for containing semiconductor element

Also Published As

Publication number Publication date
JPH0472639U (en:Method) 1992-06-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term