JP2514910Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JP2514910Y2
JP2514910Y2 JP1990127591U JP12759190U JP2514910Y2 JP 2514910 Y2 JP2514910 Y2 JP 2514910Y2 JP 1990127591 U JP1990127591 U JP 1990127591U JP 12759190 U JP12759190 U JP 12759190U JP 2514910 Y2 JP2514910 Y2 JP 2514910Y2
Authority
JP
Japan
Prior art keywords
metal layer
metallized
semiconductor element
insulating substrate
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990127591U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0482853U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
明彦 舟橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1990127591U priority Critical patent/JP2514910Y2/ja
Publication of JPH0482853U publication Critical patent/JPH0482853U/ja
Application granted granted Critical
Publication of JP2514910Y2 publication Critical patent/JP2514910Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990127591U 1990-11-28 1990-11-28 半導体素子収納用パッケージ Expired - Lifetime JP2514910Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990127591U JP2514910Y2 (ja) 1990-11-28 1990-11-28 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990127591U JP2514910Y2 (ja) 1990-11-28 1990-11-28 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0482853U JPH0482853U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-07-20
JP2514910Y2 true JP2514910Y2 (ja) 1996-10-23

Family

ID=31875085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990127591U Expired - Lifetime JP2514910Y2 (ja) 1990-11-28 1990-11-28 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2514910Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591844A (en) * 1978-12-28 1980-07-11 Fujitsu Ltd Electronic parts package
JPS5868951A (ja) * 1981-10-21 1983-04-25 Hitachi Ltd 半導体装置
US4672739A (en) * 1985-04-11 1987-06-16 International Business Machines Corporation Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
JPH01166547A (ja) * 1987-12-23 1989-06-30 Hitachi Ltd セラミック基板

Also Published As

Publication number Publication date
JPH0482853U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-07-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term