JP2510576Y2 - プリント配線基板 - Google Patents
プリント配線基板Info
- Publication number
- JP2510576Y2 JP2510576Y2 JP1990015595U JP1559590U JP2510576Y2 JP 2510576 Y2 JP2510576 Y2 JP 2510576Y2 JP 1990015595 U JP1990015595 U JP 1990015595U JP 1559590 U JP1559590 U JP 1559590U JP 2510576 Y2 JP2510576 Y2 JP 2510576Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- hole
- solder land
- metal layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 claims description 81
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 230000000873 masking effect Effects 0.000 claims description 18
- 238000005219 brazing Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000009420 retrofitting Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990015595U JP2510576Y2 (ja) | 1990-02-21 | 1990-02-21 | プリント配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990015595U JP2510576Y2 (ja) | 1990-02-21 | 1990-02-21 | プリント配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03106779U JPH03106779U (enrdf_load_stackoverflow) | 1991-11-05 |
| JP2510576Y2 true JP2510576Y2 (ja) | 1996-09-11 |
Family
ID=31518893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990015595U Expired - Fee Related JP2510576Y2 (ja) | 1990-02-21 | 1990-02-21 | プリント配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510576Y2 (enrdf_load_stackoverflow) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724026Y2 (enrdf_load_stackoverflow) * | 1978-01-30 | 1982-05-25 | ||
| JPS60141169U (ja) * | 1984-02-28 | 1985-09-18 | 三洋電機株式会社 | 印刷配線基板 |
| JPH0197579U (enrdf_load_stackoverflow) * | 1987-12-21 | 1989-06-29 |
-
1990
- 1990-02-21 JP JP1990015595U patent/JP2510576Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03106779U (enrdf_load_stackoverflow) | 1991-11-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |