JP2509409Y2 - チップ型電子部品及びその実装基板 - Google Patents
チップ型電子部品及びその実装基板Info
- Publication number
- JP2509409Y2 JP2509409Y2 JP1990095530U JP9553090U JP2509409Y2 JP 2509409 Y2 JP2509409 Y2 JP 2509409Y2 JP 1990095530 U JP1990095530 U JP 1990095530U JP 9553090 U JP9553090 U JP 9553090U JP 2509409 Y2 JP2509409 Y2 JP 2509409Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- type electronic
- concave groove
- chip type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 19
- 238000004140 cleaning Methods 0.000 description 23
- 229910000679 solder Inorganic materials 0.000 description 23
- 239000003990 capacitor Substances 0.000 description 21
- 239000007788 liquid Substances 0.000 description 17
- 239000000758 substrate Substances 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990095530U JP2509409Y2 (ja) | 1990-09-13 | 1990-09-13 | チップ型電子部品及びその実装基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990095530U JP2509409Y2 (ja) | 1990-09-13 | 1990-09-13 | チップ型電子部品及びその実装基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0455123U JPH0455123U (en, 2012) | 1992-05-12 |
JP2509409Y2 true JP2509409Y2 (ja) | 1996-09-04 |
Family
ID=31834303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990095530U Expired - Lifetime JP2509409Y2 (ja) | 1990-09-13 | 1990-09-13 | チップ型電子部品及びその実装基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2509409Y2 (en, 2012) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5360158B2 (ja) * | 2011-08-05 | 2013-12-04 | 株式会社村田製作所 | チップ部品構造体 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6393601U (en, 2012) * | 1986-12-05 | 1988-06-17 | ||
JPS6418722U (en, 2012) * | 1987-07-22 | 1989-01-30 |
-
1990
- 1990-09-13 JP JP1990095530U patent/JP2509409Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0455123U (en, 2012) | 1992-05-12 |
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