JP2507013Y2 - ワイヤ―ボンディング装置 - Google Patents

ワイヤ―ボンディング装置

Info

Publication number
JP2507013Y2
JP2507013Y2 JP1989151050U JP15105089U JP2507013Y2 JP 2507013 Y2 JP2507013 Y2 JP 2507013Y2 JP 1989151050 U JP1989151050 U JP 1989151050U JP 15105089 U JP15105089 U JP 15105089U JP 2507013 Y2 JP2507013 Y2 JP 2507013Y2
Authority
JP
Japan
Prior art keywords
bonding
wire
mounting substrate
semiconductor element
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989151050U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0390442U (https=
Inventor
雄治郎 森
英治 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1989151050U priority Critical patent/JP2507013Y2/ja
Publication of JPH0390442U publication Critical patent/JPH0390442U/ja
Application granted granted Critical
Publication of JP2507013Y2 publication Critical patent/JP2507013Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP1989151050U 1989-12-28 1989-12-28 ワイヤ―ボンディング装置 Expired - Lifetime JP2507013Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989151050U JP2507013Y2 (ja) 1989-12-28 1989-12-28 ワイヤ―ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989151050U JP2507013Y2 (ja) 1989-12-28 1989-12-28 ワイヤ―ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0390442U JPH0390442U (https=) 1991-09-13
JP2507013Y2 true JP2507013Y2 (ja) 1996-08-14

Family

ID=31697367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989151050U Expired - Lifetime JP2507013Y2 (ja) 1989-12-28 1989-12-28 ワイヤ―ボンディング装置

Country Status (1)

Country Link
JP (1) JP2507013Y2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101023758B1 (ko) * 2010-10-13 2011-03-21 손정현 다층 구조를 가지는 구이기

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648970B2 (https=) * 1972-08-25 1981-11-19

Also Published As

Publication number Publication date
JPH0390442U (https=) 1991-09-13

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