JP2507013Y2 - Wire-bonding equipment - Google Patents
Wire-bonding equipmentInfo
- Publication number
- JP2507013Y2 JP2507013Y2 JP1989151050U JP15105089U JP2507013Y2 JP 2507013 Y2 JP2507013 Y2 JP 2507013Y2 JP 1989151050 U JP1989151050 U JP 1989151050U JP 15105089 U JP15105089 U JP 15105089U JP 2507013 Y2 JP2507013 Y2 JP 2507013Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire
- mounting substrate
- semiconductor element
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、半導体装置のワイヤ・ボンディング装置に
関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a wire bonding apparatus for a semiconductor device.
従来、この種のワイヤーボンディング装置では、第４
図に示す様に半導体素子８上のボンディングパッド11の
列と取付基板９のボンディング位置の列とが並行してい
なくともボンディング距離は一定となっていたのでボン
ディングワイヤー10の長さは常に一定であり、ボンディ
ングパッド11の列と取付基板９のボンディング位置の列
とを正確に、ボンディングすることができなかった。Conventionally, in this type of wire bonding apparatus,
As shown in the figure, even if the row of bonding pads 11 on the semiconductor element 8 and the row of bonding positions on the mounting substrate 9 are not parallel, the bonding distance is constant, so the length of the bonding wire 10 is always constant. Therefore, the row of the bonding pads 11 and the row of the bonding positions on the mounting substrate 9 could not be accurately bonded.
上述した従来のボンディング装置は、取付基板９と半
導体素子８の角度ずれによって、ボンディングパッド11
と取付基板９のボンディング位置との間隔のずれが生じ
ても、ボンディング距離、すなわちボンディングワイヤ
ー10の長さは固定となっている為、相対的にボンディン
グ位置がずれるという欠点があった。In the conventional bonding apparatus described above, the bonding pad 11 is moved due to the angular deviation between the mounting substrate 9 and the semiconductor element 8.
Even if there is a gap between the bonding position of the mounting substrate 9 and the bonding position of the mounting substrate 9, since the bonding distance, that is, the length of the bonding wire 10 is fixed, the bonding position is relatively displaced.
本考案によるワイヤーボンディング装置は、認識デー
タにより、角度ずれ量を算出し、その角度ずれ量に応
じ、基準ボンディング位置に相対するボンディング位置
の補正を行ないながらワイヤーボンディングを行なう位
置補正手段を有している。The wire bonding apparatus according to the present invention has a position correction means for performing wire bonding while calculating an angle deviation amount from the recognition data and correcting the bonding position relative to the reference bonding position according to the angle deviation amount. There is.
従って、本考案によれば、ボンディング距離の補正が
出来るとともに、基準ボンディング位置の選択が出来る
という利点を有する。Therefore, according to the present invention, the bonding distance can be corrected and the reference bonding position can be selected.
次に、本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は、本考案の一実施例を説明するための構成図
である。第２図はこの一実施例のワイヤーリング図であ
る。認識装置１と撮影用のカメラ12と演算用のマイコン
２と、ボンディングを施すウェッジボンディング装置３
と、ウェッジ7,X軸テーブル4,Y軸テーブル5,θテーブル
６とを有し、半導体素子はこの半導体素子に対して、θ
°角度ずれしている取付基板９に取り付けられてθテー
ブル６上に載置されている。FIG. 1 is a block diagram for explaining an embodiment of the present invention. FIG. 2 is a wiring diagram of this embodiment. Recognition device 1, camera 12 for photographing, microcomputer 2 for calculation, and wedge bonding device 3 for bonding
And a wedge 7, an X-axis table 4, a Y-axis table 5, and a θ table 6, and the semiconductor element is
It is mounted on the mounting substrate 9 which is deviated from the angle and is mounted on the θ table 6.
本実施例によれば、カメラ12と認識装置１による認識
データとをもとに、マイコン２によって、半導体素子８
を基準に補正値を算出し、Ｘ軸テーブル4,Y軸テーブル
5,θテーブル６の駆動係によって、距離補正して、第２
図に示すように半導体素子８上のボンディングパッド11
と取付基板９のボンディング位置とをボンディングワイ
ヤー10の長さを調整しながらワイヤーボンディングを行
なう。According to this embodiment, based on the recognition data obtained by the camera 12 and the recognition device 1, the semiconductor element 8 is detected by the microcomputer 2.
Calculate the correction value based on the X-axis table 4, Y-axis table
5, The distance correction is performed by the driving section of the θ table 6, and the second
As shown in the figure, the bonding pad 11 on the semiconductor element 8
Wire bonding is performed while adjusting the bonding wire 10 and the bonding position of the mounting substrate 9.
第３図は、本考案の他の実施例のワイヤーリング図で
ある。構成としては、第１図と同じであるが、この実施
例では、取付基板９を基準として、補正値を算出し、距
離補正ボンディングを行なっている。FIG. 3 is a wiring diagram of another embodiment of the present invention. Although the configuration is the same as that of FIG. 1, in this embodiment, a correction value is calculated with the mounting substrate 9 as a reference, and distance correction bonding is performed.
この様に、基準位置をマイコン２によって選択するこ
とが出来る。In this way, the reference position can be selected by the microcomputer 2.
以上説明したように、本考案は、１ループ間のボンデ
ィング距離を補正することにより、位置の安定したワイ
ヤーボンディングを行なえる効果がある。As described above, the present invention has an effect that wire bonding with stable position can be performed by correcting the bonding distance between one loop.
第１図は本考案の一実施例の構成図、第２図はこの一実
施例のワイヤーリング図、第３図は、本考案の他の実施
例のワイヤーリング図、第４図は従来技術のワイヤーリ
ング図である。 １……認識装置、２……マイコン、３……ウェッジボン
ディング、４……Ｘ軸テーブル、５……Ｙ軸テーブル、
６……θテーブル、７……ウェッジ、８……半導体素
子、９……取付基板、10……ボンディングワイヤ、11…
…ボンディングパッド、12……カメラ。FIG. 1 is a block diagram of an embodiment of the present invention, FIG. 2 is a wiring diagram of this embodiment, FIG. 3 is a wiring diagram of another embodiment of the present invention, and FIG. It is a wiring diagram of. 1 ... Recognition device, 2 ... Microcomputer, 3 ... Wedge bonding, 4 ... X-axis table, 5 ... Y-axis table,
6 ... θ table, 7 ... Wedge, 8 ... Semiconductor element, 9 ... Mounting board, 10 ... Bonding wire, 11 ...
… Bonding pad, 12… Camera.
Claims (1)
タから取付基板と半導体素子との角度ずれ量を算出し、
前記角度ずれ量からボンディングワイヤーの距離補正値
を演算する演算装置と、前記距離補正値に従って前記ボ
ンディングワイヤーの長さを調節しながらウエッジボン
ディングを行うウエッジボンディング装置とを有するこ
とを特徴とするワイヤーボンディング装置。1. A recognition device, and an amount of angular deviation between a mounting substrate and a semiconductor element is calculated from recognition data by the recognition device,
A wire bonding device, comprising: a computing device that computes a distance correction value of the bonding wire from the amount of angular deviation; and a wedge bonding device that performs wedge bonding while adjusting the length of the bonding wire according to the distance correction value. apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989151050U JP2507013Y2 (en) | 1989-12-28 | 1989-12-28 | Wire-bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989151050U JP2507013Y2 (en) | 1989-12-28 | 1989-12-28 | Wire-bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0390442U JPH0390442U (en) | 1991-09-13 |
| JP2507013Y2 true JP2507013Y2 (en) | 1996-08-14 |
Family
ID=31697367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989151050U Expired - Lifetime JP2507013Y2 (en) | 1989-12-28 | 1989-12-28 | Wire-bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2507013Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101023758B1 (en) * | 2010-10-13 | 2011-03-21 | 손정현 | The roaster that have a multi-layered structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5648970B2 (en) * | 1972-08-25 | 1981-11-19 |
-
1989
- 1989-12-28 JP JP1989151050U patent/JP2507013Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0390442U (en) | 1991-09-13 |
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